Hotspot Focus
This work is aimed at next-generation optoelectronic information systems, developing novel preparation technologies for semiconductor optoelectronic functional materials to meet the demands of high speed, integration, and quantization in semiconductor optoelectronic devices. The material preparation employs precision techniques such as molecular beam epitaxy (MBE), metal-organic chemical vapor deposition (MOCVD), and atmospheric-pressure chemical vapor deposition (CVD); device fabrication utilizes standard semiconductor processes and micro- and nano-fabrication technologies. Using MBE, we have prepared high-density 1.3-μm InAs/GaAs quantum-dot materials. Lasers fabricated from these materials achieve a single-layer gain of 7 cm⁻¹ at 1.3 μm and support direct modulation.
Phase-change memory chip manufacturing
In recent years, thanks to the joint efforts of researchers from both academia and industry, phase-change memory technology has evolved from theoretical models into real-world products. After decades of development, PCRAM has emerged as the leading candidate for next-generation non-volatile storage technology, holding great promise to replace the current DRAM-plus-flash storage paradigm and demonstrating tremendous potential in high-speed, massive-data storage applications. This article reviews the development history and trends of phase-change memory, with a particular focus on the research achievements made by the Shanghai Institute of Microsystem and Information Technology of the Chinese Academy of Sciences and SMIC (Semiconductor Manufacturing International Corporation) in the development of new materials and process integration for phase-change memory.
Development Trends and Challenges of Non-Volatile Memory
Non-volatile memory is one of the most important technologies in integrated circuits, widely used across various fields—including information technology, aerospace, military and national defense, new energy, and scientific research—and boasts a massive market. Currently, the mainstream non-volatile memory technology—“flash memory” based on floating-gate structures—is approaching its physical limits in terms of size scaling, making it increasingly difficult to further enhance storage density and performance to meet the demands of the big-data era for information storage and processing. This report will provide an overview of the current state and challenges facing the global and Chinese memory industry, as well as the academic research landscape of non-volatile memory and the research progress made by the Institute of Microelectronics in this field.
Hubei Dinghui—Striving to Be a Leader in the Polishing Consumables Industry
Hubei Dinghui Microelectronics Materials Co., Ltd. is a wholly-owned subsidiary of Hubei Dinglong Holding Co., Ltd. (stock code: 300054). With a registered capital of 100 million RMB, the company is located in the Wuhan Economic and Technological Development Zone in Hubei Province. It is a technology-driven enterprise specializing in the R&D and manufacturing of semiconductor materials. Leveraging Dinglong Holding’s more than two decades of technological expertise in the field of chemical materials and the support of seasoned industry experts both domestically and internationally, the company focuses on the integrated circuit materials industry. We consistently adhere to a technology development strategy that emphasizes “focusing on the international high-end market, attracting industry elites, insisting on independent innovation, and striving to become a leader in the industry,” and we rely on Dinglong Holding’s national...
On September 21, 2017, the Cooperation Forum for Domestic Equipment Suppliers of Silicon-Based OLED Display Technology was successfully held at the headquarters building of Shanghai Shiyi Information Technology Co., Ltd., located in the Pudong New Area of Shanghai. The forum was jointly organized by Shanghai Shiyi and the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials and Components Industry. The forum was co-hosted by Ms. Shi Ying, Secretary-General of the Alliance, and Mr. Gu Tie, President of Shanghai Shiyi. More than ten prominent domestic equipment suppliers, including Northern HuaChuang, Shanghai Weizhuang, Shenyang Xinyuan, Tuojing Technology, Wuhan Jingce, and Zhichun Technology, attended the forum. Mr. Gu Tie provided the attendees with a detailed introduction to the applications of silicon-based OLED products.
HuaHong Group’s integrated circuit manufacturing facility adopts a unified naming system.
To showcase the overall image of HuaHong Group’s integrated circuit manufacturing business and to facilitate global customers and partners in identifying HuaHong’s various manufacturing facilities, HuaHong Group recently formulated and implemented the “HuaHong Group Integrated Circuit Manufacturing Facility Naming Management Measures.” Under these measures, all facilities belonging to Shanghai HuaHong Macroblock Semiconductor Manufacturing Co., Ltd., Shanghai HuaLi Microelectronics Co., Ltd., and Shanghai HuaLi Integrated Circuit Manufacturing Co., Ltd.—all subsidiaries of HuaHong Group—have been uniformly numbered and named, and official plaques have been awarded. On August 4, HuaHong Group held a ceremony at the construction site of the “‘909’ Second Upgrade and Reconstruction Project—12-Inch Advanced Process Chip Project” located in the Kangqiao Industrial Zone in Pudong.
On the afternoon of August 17, 2017, the second seventh meeting of the Board of Directors of the Integrated Circuit Materials and Components Industry Technology Innovation Strategic Alliance (hereinafter referred to as the “Alliance”) was successfully held in Ningbo. More than 180 people attended the meeting, including the Alliance’s Secretary-General, Vice-Chairpersons, Executive Directors, representatives from member units, and representatives from newly applying organizations seeking membership. Secretary-General Shi Ying chaired the meeting and delivered a report summarizing the Alliance’s work progress for the first half of 2017 and outlining plans for the second half of the year. Each specialist working group leader then presented reports on topics such as supplier pre-assessment and the 2017 C-
On August 8, SMIC (New York Stock Exchange: SMI; Hong Kong Stock Exchange: 981) announced its consolidated financial results for the three months ended June 30, 2017. According to the financial report, sales in the second quarter of 2017 totaled US$751.2 million, representing an 8.8% increase year-on-year but a 5.3% decrease quarter-on-quarter. Gross profit amounted to US$194.1 million, down from US$220.8 million in the first quarter of 2017 and from US$217.8 million in the second quarter of 2016. The gross margin for the second quarter of 2017 was 25.8%, compared to 2... in the first quarter of 2017.
On the afternoon of August 2, Shanghai HuaHong (Group) Co., Ltd. and the Wuxi Municipal People's Government held a signing ceremony for a strategic cooperation agreement in Wuxi. The HuaHong Group’s integrated circuit R&D and manufacturing base project—totaling approximately US$10 billion in investment—has officially been established in the Wuxi High-tech Zone, marking the launch of HuaHong Group’s first integrated circuit R&D and manufacturing base outside of Shanghai. It is reported that this collaborative project will involve the phased construction of several 12-inch integrated circuit chip production lines. The first-phase project will include a single 12-inch production line with a monthly capacity of about 40,000 wafers, along with related supporting facilities. Following the completion of the first-phase project, construction of a second production line will be initiated at an appropriate time. Jiangsu.
On the evening of August 2, Shanghai Xinyang issued an announcement stating that, in order to continuously expand its business scope and broaden the application areas of its products, the company is seeking to make in-depth inroads into the panel display market. At the same time, this move will lay a solid foundation for the company’s development of high-end photoresists used in integrated circuit manufacturing. Accordingly, the company plans to establish a wholly-owned subsidiary in South Korea using its own funds to engage in the development of black photoresists for panel displays. The subsidiary’s provisional name is Xinyang (Korea) Semiconductor Materials Co., Ltd. (the final name will be subject to actual industrial and commercial registration), with a registered capital of US$2 million. The company stated that the establishment of this subsidiary will help it further enhance its capabilities in various aspects, including market presence, technology, products, services, and talent acquisition.
From July 8 to 12, 2017, the "China Materials Conference 2017" was grandly held at the Ningxia International Convention Center in Yinchuan City, Ningxia Hui Autonomous Region. The conference featured a total of 35 sub-forums and 2 international forums, with themes covering material fields such as energy materials, environmental materials, advanced structural materials, functional materials, and basic materials research. The number of participants exceeded 5,000. Concurrent with the conference was the "Advanced Microelectronics and Optoelectronics Materials Sub-forum," organized by the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials and Components Industry and jointly supported by the Shanghai Institute of Microsystem and Information Technology of the Chinese Academy of Sciences and the Beijing Multi-Dimensional Electronic Materials Technology Development and Promotion Center.
On the morning of June 21, the topping-out ceremony for the main plant building and the unveiling ceremony for the Design & R&D Center of Huaian Dekema Semiconductor Co., Ltd. were held in Huaiyin District, marking the project’s entry into a new phase of simultaneous construction and R&D, thus laying a solid foundation for its smooth commissioning and achieving desired results in the next stage. Attending the ceremony were Shi Ying, Secretary-General of the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials and Components Industry; Cai Lixin, Acting Mayor of Huaian City; Gu Kun, Vice Mayor; Xia Shaozeng, Chairman of Huaian Dekema Semiconductor Co., Ltd.; as well as representatives from the construction company and partner enterprises. It is reported that the Huaian Dekema project has a total investment of 15 billion yuan, with the first phase aiming to produce 240,000 12-inch semiconductor wafers annually.
Hosted by the Flatness Technology Alliance and the Micro- and Nano-Manufacturing Tribology Professional Committee of the Society of Tribology, and organized by Dalian University of Technology, the “2017 China Flatness Technology Conference and Cross-Strait Flatness Technology Forum” was held from May 22 to 23 at Dalian University of Technology. Participants included representatives from Tsinghua University, National Taiwan University, Dalian University of Technology, National Kaohsiung University of Science and Technology, Southwest Jiaotong University, Chien Hsin University of Science and Technology, Hebei University of Technology, Tamkang University, Huaqiao University, National University of Defense Technology, Nanjing University of Aeronautics and Astronautics, Guangdong University of Technology, Fujian Jing’an Optoelectronics, Intel (Dalian), Huahai Qingke, and Jiabo Microelectronics Materials Co., Ltd.
Hosted by the Flatness Technology Alliance and the Micro- and Nano-Manufacturing Tribology Professional Committee of the Society of Tribology, and organized by Dalian University of Technology, the “2017 China Flatness Technology Conference and Cross-Strait Flatness Technology Forum” was held from May 22 to 23 at Dalian University of Technology. Participants included representatives from Tsinghua University, National Taiwan University, Dalian University of Technology, National Kaohsiung University of Science and Technology, Southwest Jiaotong University, Chien Hsin University of Science and Technology, Hebei University of Technology, Tamkang University, Huaqiao University, National University of Defense Technology, Nanjing University of Aeronautics and Astronautics, Guangdong University of Technology, Fujian Jing’an Optoelectronics, Intel (Dalian), Huahai Qingke, and Jiabo Microelectronics Materials Co., Ltd.
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