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Committed To Building China's Integrated Circuit Industry Materials  Supply Chain

China's semiconductor materials and components development will be open for registration in 2018!


2023 Symposium on Silicon IC-Used Based Gases was Successfully Held


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Industry News Quick Report, Member News Early Know

Industry Reports

Report on the Development of China's Semiconductor Support Industry (2022)
2021 Statistical Report on Target Industry Data

Member News

Asem Succesfully Listed!
The Completion Ceremony of Kunshan Base of Darbon Technology Co., Ltd. was a Complete Success
Dinglong (Xiantao) Semiconductor Materials Industrial Park Put into Operation Ceremony Successfully Held
Liufang Tech Completed Nearly 100 Million Yuan Financing
The Completion and Putting into Operation of the Second Phase of the Scienchem Project and the Tenth Anniversary Celebration of the First Phase of the Project into Operation were a Complete Success

Expert's Point

Based on the locality, marching towards the world--Thinking about the growth of China's emerging semiconductor materials compani
I. Ten years of China's emerging semiconductor materials

In the past ten years, China's semiconductor materials have emerged as a group of emerging semiconductor materials companies, such as Jiangfen
China's creation leads the future
Ningbo Jiangfeng Electronic Materials Co., Ltd. is engaged in the research and development and production of ultra-high purity metals and sputtering targets for ultra-large scale integrated circuits.
Enlightenment from the recruitment of technology innovation strategic alliance in integrated circuit materials industry
Notice on holding the ICMtia-PALL joint technology seminar
Notice of the Three Departments on the Pilot Work of Applying the Insurance Compensation Mechanism for the First Batch of Key Ne
Enlightenment from the recruitment of integrated circuit materials and components alliance (Ningbo) Industry Promotion Center
Publicizing the "Guidelines for the First Batch Application of Key New Materials (2017 Edition)"
2017 China Flattening Technology Conference & Cross-Strait Flattening Technology Forum (May 21-23, 2017) Notice of Meeting (Thir


Industry Information

China IC Materials Industry Technology Innovation Strategic Alliance was established
The 718th research institute of CSIC (PERIC) : For the industry, the industry is the first
KFMI: Adding bricks and tiles to China's material industrialization
Anji Microelectronics: Innovation lays the foundation of the company and promotes the development of the company
Shanghai Sinyang: The road to independent innovation
Professor Wang Zhengping, the father of modern semiconductor plastic packaging, was elected as a foreign academician of the Chin