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Quantum Core Block, No. 27, Zhichun Road, Haidian District, Beijing

Record number 京ICP备13052968号-1 The Integrated Circuit Materials Industry Technology Innovative Alliance Powered by www.300.cn

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During October 25-27, The 24th China Integrated Circuit Manufacturing Annual Conference and Supply Chain Innovation and Development Conference, along with 2021 China Semiconductor Materials Innovation and Development Conference (hereafter “2021 ICM”), hosted by China Integrated Circuit Materials Industry Technology Innovation Alliance will be grandly opened.

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2021 China Semiconductor Materials Innovation and Development Conference

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Registration
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IC Materials Award
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Agenda
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Guests

Yuchun Wang

Vice President, Anji Microelectronics

Junhua Li

PERIC Special Gases Co.,Ltd

Key.Chung

TongFu Microelectronics Co.,Ltd

Dan P. Tracy

Sr. Director and Sr. Market Analyst of TECHCET

Allan Gabor

President, Merck China Managing Director of Electronics China

Ying Shi

Secretary General of the Integrated Circuit Materials Industry Technology Innovative Alliance

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News

2021 China Semiconductor Materials Innovative Development Conference is Postponed

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2019 China Semiconductor Materials Innovation and Development Conference Held Successfully

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The 2020 China Semiconductor Materials Innovation and Development Conference was Successfully Held in Hefei

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2019 China Semiconductor Materials Innovation and Development Conference Officially Opened to Regist

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2018 China Semiconductor Materials and Components Innovative Development Conference was Successfully

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Lack of Skills and Materials Vex Chinese Computer-Chip Ambitions

The ability to remove particles no more than 1 nm in size from a solution is one of the technologies that the semiconductor industry will soon require for making next-generation chips. It’s a technolo

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