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Professor Wang Zhengping, the father of modern semiconductor plastic packaging, was elected as a foreign academician of the Chin

Professor Wang Zhengping, the father of modern semiconductor plastic packaging, was elected as a foreign academician of the Chin

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Professor Wang Zhengping is a professor of electronic engineering at the Chinese University of Hong Kong, dean of the School of Engineering, academician of the American Academy of Engineering, and a foreign academician of the Chinese Academy of Engineering. He has been engaged in electronic packaging research for a long time and has been awarded the highest honor in the field of electronic packaging by the IEEE - IEEE Component, Packaging and Manufacturing Technology Award for his pioneering contributions in the field for decades. He is also known as "the father of modern semiconductor packaging". It has been widely recognized in the industry.
Professor Wang is one of the pioneers in plastic packaging technology. In 1977, he pioneered the packaging of gate-switched diode switches (GDX) using silicone in Bell Labs, enabling the use of polymer materials to seal the equivalent package of GDX structures, significantly improving the packaging reliability of GDX. Overcoming the problems of large weight, complicated process and high cost of traditional ceramic packaging, the molding material and structural process passed the US military's 883 reliability test standard. The plastic packaging technology has been used by AT&T (American Telegraph and Telephone Company) and the US military, and then transferred to consumer electronics manufacturers such as Intel and IBM and promoted in the industry. At present, plastic packaging accounts for more than 95% of the world's integrated circuit packaging market.
Professor Wang also deeply studied and solved the problem of unstable contact resistance between the conductive adhesive and the device interface which has long plagued the packaging industry. The conductive adhesive innovation technology has been used in the conductive adhesive products of Henkel (Henkel) and other companies. He also developed the first solvent-free, high-Tg non-flow underfill in the industry, simplifying the flip-chip packaging process and improving the device's excellent performance and reliability. This non-flowing underfill technology has long been used by companies such as Hitachi (Hitachi). Since then, he has led the research team to develop silicon-based carbon nanotube array transfer technology, which has laid a solid foundation for 3D interconnects and nanoelectronic devices.
Major international awards include: IEEE Component, Packaging and Manufacturing Technology Award (2006), Pan Wenyuan Award (Taiwan's highest honor in overseas manufacturing for electronic manufacturing technology, 2007), Dresden-Buckhausen Award (The world's most important contribution to materials, physics and electronics in the Dresden Materials Research Institute, Germany, 2012), IEEE-CPMT (Components, Packaging and Manufacturing Technology) Society for Excellence in Technological Achievement Awards, IEEE-CPMT David Feldman Award for Outstanding Contribution.
Professor Wang Zhengping, as a well-known scholar in the field of international electronic packaging, has traveled to China and the United States for decades and has made significant contributions to China's academic, industrial development and international cooperation in research and higher education.
He has been participating in the domestic international conference on electronic packaging for many years and has made special invitations and short courses training to bring the international advanced electronic packaging technology back to China and promote the development of China's electronic packaging academic and industrial circles. He spared no effort to train Chinese students, currently a total of more than 30. He also actively accepted more than 20 young teachers and enterprise engineers from the Mainland to visit and study at the National Institute of Packaging Research at Georgia Institute of Technology, and did his utmost to build an echelon of Chinese electronic packaging talents.
In 2010, Professor Wang returned to China full time and was hired as Dean of the School of Engineering at the Chinese University of Hong Kong. In order to change the invisible constraints of the shortage of engineering research talents in Hong Kong, he is passing 5-6 reforms and expects the Chinese University of Hong Kong to export high-end scientific research talents in the engineering field in the next decade to promote the development of high-tech industries in Hong Kong and the whole country.
In 2011, Professor Wang was hired as the chief scientist of the electronic packaging materials direction of the Shenzhen Institute of Advanced Technology of the Chinese Academy of Sciences. As a leader, he was selected and successfully selected as the “Advanced Electronic Packaging Materials” Guangdong Innovation Research Team. The team comprehensively carried out research work on key materials for electronic packaging, and built a demonstration platform for the development and transformation of electronic packaging materials at the international level, striving to change the situation of China's high-end electronic materials and high-performance devices relying on imports, and improving the upstream, downstream and downstream industries of China's integrated circuits. chain.