China IC Materials Industry Technology Innovation Strategic Alliance was established
Photo of the First Council of Materials Alliance
The first council of the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance was held in Shanghai on January 8, 2013. The meeting elected the director of the Shanghai Institute of Microsystems and Information Technology of the Chinese Academy of Sciences, the chairman of Shanghai Simgui Technology Co.,Ltd., and the deputy head of the 02 special general expert group, Academician Wang Wei, as the chairman of the alliance; elected Li Xuwu, SMIC International Integrated Circuit Manufacturing Co., Ltd. Vice President of R&D, Vice President of Operation of Lei Haibo, Shanghai Huahong NEC Electronics Co., Ltd., Chairman of Zhouqi Steel, Research Institute Semiconductor Materials Co., Ltd., Sun Jiangyan Chief Engineer of Shanghai Sinyang Semiconductor Materials Co., Ltd., Konfoong Materials International Co., Ltd. Chairman Yao Lijun is the vice chairman; Chairman of the Board of Directors of Beijing Kempur Microelectronics Co., Ltd. Chen Wei, Chairman of Anji Microelectronics (Shanghai) Co., Ltd. Wang Shumin, Chairman of Tianjin Huanou Semiconductor Materials Technology Co., Ltd. Shen Haoping, China Wang Shaobo, deputy director of he 718th research institute of CSIC (PERIC) , Yang Zhicheng, general manager of Shenzhen Shennan Circuit Co., Ltd., and Chairman of the Board of Jiangsu Zhongpeng New Materials Co., Ltd., Feng Qili, are the executive directors; Manager Assistant, 02 Special General Panel Member Stone Ms. Qi is the Secretary-General.
The council reviewed and approved the first expert advisory committee of the alliance by 10 comrades including Wang Hao, Yang Deren, Peng Shugen, Su Shi, Liu Zhiguo, Zhao Chao, Sun Jiangyan, Wang Shumin, Xu Congying, Chen Tianan, and Academician Wang Wei as the director and Yang Deren. The professor is the deputy director.
The Council reviewed and approved the Administrative Measures of the Union Expert Advisory Committee, the Administrative Measures of the Alliance Secretariat, the Measures for the Administration of Alliance Funds, the Measures for the Management of Alliance Projects, the Measures for the Management of Intellectual Property Rights of the Alliance, and the Dissolution and Clearing of the Alliance. The Administrative Measures will take effect from now.
The Alliance will integrate the nation's innovative resources in the field of integrated circuit materials, implement the national medium- and long-term science and technology development plan, and deploy the strategically-oriented platform and link of the national major science and technology project “extremely large-scale integrated circuit manufacturing equipment and complete sets of technology”, relying on the member units of the alliance. Talents, technology and market resources, accelerate the industrialization of scientific and technological achievements, and realize the localized supply of materials for the manufacture of integrated circuits in China. By building effective cooperation methods, enhancing the overall advantages of the alliance, promoting talent pooling and key technology development in China's integrated circuit materials, continuously improving independent innovation capabilities, supporting China's integrated circuit technology innovation and contributing to the development of international integrated circuit materials technology.