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2017 China Flattening Technology Conference & Cross-Strait Flattening Technology Forum (May 21-23, 2017) Notice of Meeting (Thir

2017 China Flattening Technology Conference & Cross-Strait Flattening Technology Forum (May 21-23, 2017) Notice of Meeting (Thir

Source:
2017/05/11
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The Cross-Strait Flattening Technology Seminar aims to promote cross-strait flattening technology exchanges, cooperation between the deep chemical industry and the industry, and improve the level of cross-strait flattening technology. It has been held for five sessions since 2012. The 2017 Cross-Strait Flattening Technology Forum will be held at Dalian University of Technology from May 21st to 23rd. This seminar will invite enterprises, universities and research institutes related to the flattening technology across the Taiwan Strait to participate in the academic exchanges on the development status and trends of the flattening technology, jointly improve the research level and technical level of the flattening technology, and promote relevant Industrial Development. The conference will be a grand gathering of academics and industry in the field of flat technology, and welcomes the extensive participation of academics and industry colleagues.
 
Time: May 21~23, 2017.
 
Venue: Dalian University of Technology International Conference Center
 
Topic: The latest achievements and progress in flattening technology, including;
 
l flattening / polishing technology mechanism;
 
l CMP process modeling, simulation and optimization;
 
l Flattening/polishing process technology for hard and brittle materials;
 
l CMP measurement technology;
 
l Key materials and components for CMP processes;
 
l Post-CMP cleaning and defect suppression process;
 
l CMP process integration and control technology;
 
l New demands for CMP technology in industrial development;
 
l Flattening/polishing new principles and new technologies;
 
Organizer: Flattening Technology Alliance (CMPUG-CN), Micro-Nano Manufacturing Tribology Professional Committee
 
Organizer: Dalian University of Technology
 
Sponsors: Olympus (China) Co., Ltd. (Gold), 3M sicence (Gold), Hebei Industrial University (Gold), Tianjin Huahai Qingke Electromechanical Technology Co., Ltd. (Gold), Beijing Tesidi Equipment Manufacturing Co., Ltd. ( Silver), Times Liv (Silver)
 
Invited reporting unit: The conference will invite Dalian University of Technology, Tamkang University, Fujian Jingan Optoelectronics, National University of Defense Technology, Hebei University of Technology, Huaqiao University, Intel, Jiabo Microelectronics Materials, Linx consulting, Nanjing University of Aeronautics and Astronautics, Qinyi Scholars from science and technology universities, Tsinghua University, Taiwan University, Taiwan University of Science and Technology, Southwest Jiaotong University and other institutions made invitations.
 
Chairman of the Organizing Committee: Lu Xinchun (Tsinghua University)
 
Vice Chairman: Qu Xinping (Fudan University), Professor Chen Yuzhang (Taiwan University of Science and Technology), Liu Yuling (Hebei University of Technology)
 
Members: Wang Yuchun (Anji Microelectronics), Zhang Baoguo (Hebei University of Technology), Ge Jun (SMIC), Yang Tao (Microelectronics Institute of Chinese Academy of Sciences), Liu Bin (45 CLP), Shangguan Dongsheng (Huajin Semiconductor) Liu Weili (Shanghai Xin'an), Kang Renke (Dalian University of Technology), Lei Hong (Shanghai University), Zhang Lijuan (Time Lifu), Wang Xueze (Jiangfeng Electronics), Zhou Hua (Jiangfeng Precision), Zhang Yuliang (Tianjin Institute of Technology) University), Pan Guoshun (Shenzhen Lihe), Wang Tongqing (Tsinghua University), Zhou Ping (Dalian University of Technology)
 
Secretary General: Zhou Ping (Dalian University of Technology)
 
Secretariat: Key Laboratory of Precision and Special Processing, Ministry of Education, Dalian University of Technology
 
Contact person: Yan Ying, yycmp2017@163.com, mobile phone: 15140697605
 
Zhou Ping, pzhou@dlut.edu.cn, mobile phone: 13478754767
 
Registration fee: Return to the meeting receipt before April 20th and pay registration fee: 1500 yuan / person, student 800 yuan / person. After April 20, the registration fee will be raised to: 1,600 yuan / person, student 900 yuan / person. Including the venue, catering, materials and other expenses. It is recommended to pay by remittance, and provide invoices on the spot (if the payment is made on site, the receipt can only be provided first, and the invoice will be sent out after the meeting).
 
Remittance Account:
 
Account name: Dalian University of Technology Bank of deposit: China Construction Bank Dalian City Jinjin Branch
 
Account Opening Account: 21201501910050000923 Please be sure to indicate "CMP+Name" when remittance.
 
Conference URL: http://conf.cnki.net/WebSite/index.aspx?conferenceID=d671d738-

 

 

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☆ Note: Since Intel Dalian Company has to review the information of visitors in advance, participants who did not send a return receipt to the conference group before May 1st will not arrange a visit on the afternoon of the 23rd.

 

 

2017 China Flattening Technology Conference and Cross-Strait Flattening Technology Forum Meeting Schedule

 

 

日期

时间

内 容

主持人

 

 

 

 

5  21

8:00-22:00

注册

会务组

 

 

 

 

 

8:15-8:45

开幕式:领导致辞

康仁科

 

 

 

 

 

8:45-9:00

合影

 

 

 

 

 

 

9:00-9:25

报告人:陳炤彰(台湾科技大学)

路新春

 

 

报告题目:待定(特邀报告)

 

 

 

 

 

 

9:25-9:50

报告人:刘玉岭(河北工业大学)

 

 

 

报告题目:化学机械超精密加工质量传速理论分析研究(特邀报告)

 

 

 

 

 

 

9:50-10:15

报告人:段定夫(Linx Consulting):

 

 

 

报告题目:Technology trend and industry development in CMP materials supply chain(特邀报告)

 

 

 

 

 

5  22

10:15-10:25

茶 歇

 

 

 

 

 

上午

10:25:10:50

报告人:王科(Intel

陈炤彰

 

 

报告题目:CMP New Challenges in 3D NAND Era (特邀报告)

 

 

 

 

 

 

10:50:11:15

报告人:蔡明義(勤益科技大学)

 

 

 

报告题目:崁入式鑽石研磨拋光盤開發研究(特邀报告)

 

 

 

 

 

 

11:15-11:30

报告人:潘继生、阎秋生(广东工业大学)

朱永伟

 

 

报告题目:新型动态磁场磁流变效应平面抛光技术研究

 

 

 

 

 

 

11:30-11:45

报告人:王桂河3M 中国有限公司

 

 

 

报告题目:新一代复合刚性过滤器用于 CMP Slurry 过滤

 

 

 

 

 

 

11:45-12:00

报告人:王彦(河北工业大学)

 

 

 

报告题目:弱碱性铜抛光液中甘氨酸与 BTA 的协同作用对平坦化的影响

 

 

 

 

 

 

12:00-13:30

午餐、休息

 

 

 

 

 

 

13:30-13:55

报告人:徐西鹏(华侨大学)

张保国

 

 

报告题目:单晶碳化硅衬底的固结磨料磨抛加工技术(特邀报告)

 

 

 

 

 

 

13:55-14:20

报告人:钱林茂(西南交通大学)

 

 

 

报告题目:单晶硅原子级材料去除的机理及控制研究(特邀报告)

 

 

 

 

 

5  22

14:20-14:45

报告人:赵德文(清华大学)

 

 

报告题目:12 英寸晶圆平坦化机理研究与工业应用(特邀报告)

 

下午

 

 

 

 

 

 

 

14:45-15:10

报告人:吳國俊(嘉柏微電子材料公司)

 

 

 

报告题目:待定(特邀报告)

 

 

 

 

 

 

15:10-15:35

报告人:周平(大连理工大学)

 

 

 

报告题目:CMP 过程量化分析的关键问题研究(特邀报告)

 

 

 

 

 

 

15:35-15:45

茶 歇

 

 

 

 

 

 

15:45-16:00

报告人:温家林(清华大学)

钱林茂

 

 

 

 

 

 

 

报告题目:基于 ReaxFF 化学反应分子动力学的硅化学机械抛

 

 

 

光过程中材料去除机理研究

 

 

 

 

 

 

16:00-16:15

报告人:田胜骏(河北工业大学)

 

 

 

报告题目:基于弱碱性抛光液铜化学机械平坦化一致性的研究

 

 

 

 

 

 

16:15-16:30

报告人:赵欣(河北工业大学)

 

 

 

报告题目:不同抛光参数对蓝宝石衬底 CMP 的影响

 

 

 

 

 

 

16:30-16:45

报告人:程洁(清华大学)

 

 

 

报告题目:不同缓蚀剂对铜钌电偶腐蚀的抑制作用

 

 

 

 

 

 

17:00-17:40

实验室参观

 

 

 

 

 

 

18:00-20:00

                            欢迎晚宴

 

 

 

 

 

5  23

8:30-8:55

报告人:谢斌晖(福建晶安光电)

徐西鹏

上午

 

报告题目:蓝宝石衬底抗高温强酸蚀刻加工技术(特邀报告)

 

 

 

 

 

 

8:55-9:20

报告人:廖運炫(台湾大学)

 

 

 

报告题目:超声振动应用于蓝宝石研磨之研究(特邀报告)

 

 

 

 

 

 

9:20-9:45

报告人:彭小强(国防科技大学)

 

 

 

题目:强光元件离子束抛光低缺陷表面制造技术研究(特邀报告)

 

 

 

 

 

 

9:45-10:10

报告人:趙崇禮(淡江大学)

 

 

 

报告题目:Study on Surface Integrity of Precision Ground Single

 

 

 

Crystal Silicon (精密研磨單晶硅之表面完整性研究)(特邀报告)

 

 

 

 

 

 

10:10-10:35

报告人:朱永伟(南京航空航天大学):

 

 

 

报告题目:石英玻璃研磨过程中的亚表面损伤(特邀报告)

 

 

 

 

 

 

10:35-10:45

茶 歇

 

 

 

 

 

 

10:45:11:00

报告人:柳鹏飞(天津大学)

雷红

 

 

报告题目:A Novel Research about Fluid Hydrodynamic Fixed Abrasive Grinding based on Small Tool

 

 

 

 

 

 

11:00:11:15

报告人:杨师(中国电子科技集团公司第四十五研究所)

 

 

 

报告题目:化学机械抛光技术研究

 

 

 

 

 

 

11:15-11:30

报告人:潘国峰(河北工业大学)

 

 

 

报告题目:非离子表面活性剂对阻挡层 CMP CoCu 电偶腐蚀的影响

 

 

 

 

 

 

11:30-11:45

报告人:霍瑞芳(天津理工大学)

 

 

 

报告题目:相变材料 Cr-ST 的化学机械抛光液的优化研究

 

 

 

 

 

 

11:45-12:00

报告人:杨柳(河北工业大学)

 

 

 

报告题目:新型碱性清洗液对 CMP 后残留 SiO2 颗粒的去除

 

 

 

 

 

 

12:00-13:00

午餐、休息

 

 

 

 

 

5  23

13:05 出发

Intel 大连公司参观 (厂区&文化)

 

下午

17:00 之前

 

 

 

回到市区

 

 

 

 

 

 

 

☆ Note: Since Intel Dalian Company has to review the information of visitors in advance, participants who did not send a return receipt to the conference group before May 1st will not arrange a visit on the afternoon of the 23rd.
 
 
 
Travel information:
 
The venue of the conference is arranged at the International Conference Center of Dalian University of Technology, located at the South Gate of Dalian University of Technology, about 12 kilometers from Dalian Zhoushuizi International Airport. It takes 25 minutes by taxi. The cost is about 35 yuan (daytime), about 45 yuan. (after 22:00).
 
Due to the peak tourist season and the tight housing, the accommodation will be arranged at the Dalian University of Technology International Conference Center and the Dalian Origar Hotel. On the morning of May 22nd and 23rd, the conference team will arrange for the vehicle to stay in Origar. Representatives of the participants received the meeting. Dalian Origar Hotel is located in the middle of the bustling Zhongshan Road in the center of the city, 8 km from the International Convention Center. It takes 20 minutes by taxi. The cost is about 22 yuan (daytime), about 29 yuan (after 22:00). It is about 12 kilometers from Dalian Zhoushuizi International Airport. It takes 25 minutes by taxi. The cost is about 35 yuan (daytime), about 45 yuan (after 22:00).

 

 

The conference group provides traffic information:
 
On May 22nd at 7:15 am, Origar Grand Hotel® Dalian University of Technology International Conference Center
 
At 8:15 pm on May 22, Dalian University of Technology International Conference Center® Origar Grand Hotel
 
On May 23rd at 7:40 am, Origar Grand Hotel® Dalian University of Technology International Conference Center