The 2017 China Planarization Technology Conference and the Cross-Strait Planarization Technology Forum were held in Dalian, China.

Hosted by the Flatness Technology Alliance and the Micro- and Nano-Manufacturing Tribology Professional Committee of the Society of Tribology, and organized by Dalian University of Technology, the “2017 China Flatness Technology Conference and Cross-Strait Flatness Technology Forum” was held from May 22 to 23 at Dalian University of Technology. Participants included representatives from Tsinghua University, National Taiwan University, Dalian University of Technology, National Kaohsiung University of Science and Technology, Southwest Jiaotong University, Chien Hsin University of Science and Technology, Hebei University of Technology, Tamkang University, Huaqiao University, National University of Defense Technology, Nanjing University of Aeronautics and Astronautics, Guangdong University of Technology, Fujian Jing’an Optoelectronics, Intel (Dalian), Huahai Qingke, and Jiabo Microelectronics Materials Co., Ltd.

　　Hosted by the Flatness Technology Alliance and the Micro- and Nano-Manufacturing Tribology Professional Committee of the Tribology Society, and organized by Dalian University of Technology, the “2017 China Flatness Technology Conference and Cross-Strait Flatness Technology Forum” was held from May 22 to 23 at Dalian University of Technology. A total of 121 participants attended the conference, representing 22 institutions and 26 enterprises from both sides of the Taiwan Strait, including Tsinghua University, National Taiwan University, Dalian University of Technology, National Chiao Tung University, Southwest Jiaotong University, Chien Hsin University of Science and Technology, Hebei University of Technology, Tamkang University, Huaqiao University, National University of Defense Technology, Nanjing University of Aeronautics and Astronautics, Guangdong University of Technology, Fujian Jing’an Optoelectronics, Intel (Dalian), Huahai Qingke, Jiabo Microelectronics Materials Co., Ltd., and Linxconsulting.

　　The opening ceremony of the conference was chaired by Professor Kang Renke from Dalian University of Technology. At the opening ceremony, Professor Jia Zhenyuan, Vice President of Dalian University of Technology, delivered a speech. Professor Lu Xinchun, Chairman of the Organizing Committee of the Cross-Strait Planarization Technology Forum and Director of the State Key Laboratory of Tribology at Tsinghua University, as well as Professor Chen Zhaozhang, Vice Chairman of the conference and Supervisor of the Taiwan Association for Planarization Application Technologies, each delivered remarks, warmly congratulating the convening of the conference.

　　With the rapid advancement of semiconductor manufacturing technology, planarization technology will continue to be one of the core technologies in integrated circuit fabrication. China has already made significant progress in planarization technology and has attracted considerable attention from both the academic and industrial communities worldwide. This conference is of great significance in promoting exchanges between industry and academia across the Taiwan Strait and within China in this field.

　　The conference received sponsorship and support from Tianjin Huahai Qingke Mechanical & Electrical Technology Co., Ltd. (Gold), Hebei University of Technology (Gold), Olympus (China) Co., Ltd. (Gold), 3M Science (Gold), Beijing Tesisdi Equipment Manufacturing Co., Ltd. (Silver), and Chengdu Shidai Lifu Technology Co., Ltd. (Silver).

　　At this technical forum, 15 experts—including Professor Chen Zhaozhang from Taiwan University of Science and Technology, Professor Liu Yuling from Hebei University of Technology, Dr. Zhao Dewen from Tianjin HuaHai Qingke Mechanical & Electrical Technology Co., Ltd., Dr. Wang Ke, Associate Professor Zhou Ping from Dalian University of Technology and Head of CMP Technology at Intel Fab68 (Dalian), Professor Qian Linmao from Southwest Jiaotong University, and Dr. Wu Guojun, Director of Technical Development at Taiwan Jiabo Microelectronics Materials Co., Ltd.—delivered keynote invited presentations.

　　This seminar provided valuable opportunities for exchange among the participants, who engaged in thorough discussions on the current state of research, challenges faced, development trends, and application areas of planarization technologies both domestically and internationally. The successful holding of the conference has fostered greater exchanges between the two sides of the Taiwan Strait.

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