Notice on Further Encouraging the Development of the Software Industry and the Integrated Circuit Industry through Corporate Income Tax Policies

Cai Shui [2012] No. 27 To the Finance Departments (Bureaus), State Tax Bureaus, and Local Tax Bureaus of all provinces, autonomous regions, municipalities directly under the central government, and cities separately listed in the plan: In accordance with the "Enterprise Income Tax Law of the People's Republic of China" and its Implementation Regulations, as well as the spirit of the "Notice of the State Council on Issuing Several Policies to Further Encourage the Development of the Software Industry and the Integrated Circuit Industry" (Guo Fa [2011] No. 4), and in order to further promote scientific and technological innovation and industrial structure upgrading, and to facilitate the development of the information technology industry, we hereby notify you of the following corporate income tax policies aimed at encouraging the development of the software industry and the integrated circuit industry: 1. For integrated circuits with a linewidth less than 0.8 microns...

Local Supporting Management Measures for Major National Science and Technology Projects in Beijing Municipality

Jingke Fa [2010] No. 272, Chapter I—General Provisions, Article 1: In order to encourage local entities in this city to undertake major national science and technology projects, ensure the smooth implementation of these major national science and technology initiatives, and promote the transformation and industrialization of significant scientific and technological achievements within this city, these Measures are formulated in accordance with relevant national regulations and the "Beijing Medium- and Long-Term Science and Technology Development Plan Outline (2008–2020)." Article 2: The “major national science and technology projects” referred to in these Measures (hereinafter referred to as “major projects”) shall mean the 11 major science and technology projects for civilian sectors that were approved by the State Council and were to be implemented nationally from 2006 to 2020. Article 3: Municipal...

Administrative Measures for the Special Funds of the Industry and Technology Alliance in the Zhongguancun National Independent Innovation Demonstration Zone

Zhongke Yuan Fa [2012] No. 60, Chapter I: General Provisions, Article 1: In accordance with documents including the “Guiding Opinions on Promoting the Establishment of Industrial Technology Innovation Strategic Alliances” (Guo Ke Fa Zheng [2008] No. 770), the “Opinions on Accelerating the Development of Industrial Technology Innovation Strategic Alliances” (Jing Ke Fa [2011] No. 303), the “Administrative Measures for Special Funds for the Development of the Zhongguancun National Independent Innovation Demonstration Zone” (Jing Cai Wen [2011] No. 2858), and the “Administrative Measures for the Use of Special Funds for the Development of the Zhongguancun National Independent Innovation Demonstration Zone (Municipal-Level Coordinated Portion)” (Zhongke Yuan Fa [2011] No. 26), among others.

Academician Wang Xi, Chairman of the Materials Alliance, and his delegation visited Zhonghuan Shares for a research visit.

On the morning of January 11, 2014, Academician Wang Xi, Deputy Head of the Overall Expert Group for National Major Science and Technology Project 02 and Chairman of the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance (“Materials Alliance”), along with his delegation, conducted an on-site inspection at Tianjin Zhonghuan Semiconductor Co., Ltd. (“Zhonghuan Shares”). Attending the visit were Shen Haoping, General Manager of Zhonghuan Shares; Gao Shuliang, Deputy General Manager and Chief Engineer of Zhonghuan Shares; Wang Yanjun, General Manager of Huan’ou Company; Zhang Xuenan, Deputy General Manager of Huan’ou Company; and Li Xiang, General Manager of Zhonghuan Leading. Also accompanying the delegation were experts from the Overall Expert Group of Project 02 and Shi Ying, Secretary-General of the Materials Alliance, as well as Yu Wenjie, Deputy Secretary-General of the Materials Alliance. Academician Wang Xi and his delegation met with representatives from Zhonghuan.

The first Advanced Electronic Packaging Materials Technology Forum was successfully held.

On November 18, 2013, the first Advanced Electronic Packaging Materials Technology Forum, proposed and supported by the Materials Alliance, was successfully held in Shenzhen. With the theme “Development and Industrialization of Key Materials for Next-Generation Electronic Packaging,” the forum delved into China’s electronic packaging materials and development models, and discussed establishing smooth channels for industry-academia-research cooperation. The forum was organized by the Guangdong Provincial Innovation Team for Advanced Electronic Packaging Materials at the Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences (hereinafter referred to as the “Innovation Team”). Bi Yalei, Assistant Director of the Shenzhen Institute of Advanced Technology and Director of the Department of Industrial Development and Resources, presided over the opening ceremony of the forum. The chief technical officer of National Project 02...

The alliance is urgently convening an expert review meeting for the draft roadmap on industrial technology development.

On November 14–15, 2013, the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance (hereinafter referred to as the “Alliance”) convened a meeting in Shanghai to review the draft of the Alliance’s “Technology Development Roadmap for the Integrated Circuit Materials Industry” (hereinafter referred to as the “Roadmap”). The meeting was chaired by Secretary-General Shi Ying. More than 60 representatives attended the meeting, including members of the review expert panel and representatives from the 11 specialized working groups under the Roadmap. The expert panel comprised members of the Alliance’s Expert Advisory Committee (hereinafter referred to as the “Advisory Committee”) and members of the Alliance’s Board of Directors, including Professor Yang Deren, Deputy Director of the Advisory Committee and Director of the Semiconductor Materials Research Institute at Zhejiang University, as well as members of the Advisory Committee from Nanjing University.

The SMIC Demand Matching Conference was held in Shanghai.

On August 9, 2013, the Materials Enterprise of the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance (hereinafter referred to as the “Alliance”) successfully held the Supply-Demand Matchmaking Meeting for the Batch Application of Domestically Produced Materials in Cooperation with SMIC (the SMIC Demand-Matching Meeting) in Shanghai. Academician Wang Xi, Chairman of the Materials Alliance, attended the meeting. Dr. Qiu Ciyun, CEO of SMIC, along with heads responsible for material verification and application evaluation from SMIC’s four major plants—Shanghai 8-inch plant, Plant 8, Beijing plant, and Tianjin Plant 7—joined over a hundred representatives from alliance member units across the country, who are responsible for technology, quality, and marketing sales. The conference featured a national...

Shanghai Xinyang: Pursuing a Steadfast Path of Independent Innovation

Shanghai Xinyang Semiconductor Materials Co., Ltd. is a high-tech enterprise specializing in the R&D, design, manufacturing, and sales services of electronic chemicals and supporting equipment required by the semiconductor industry. Founded in July 1999, the company is located in Songjiang, Shanghai, with a factory site covering over 80 mu. The company has two R&D teams—one for electronic chemicals and another for supporting equipment—and is equipped with advanced instruments and equipment such as ICP-AES/MS, GC-MS, 3D X-ray systems, and an 18-megohm ultrapure water treatment system, providing both hardware and software capabilities to supply products and services to integrated circuit manufacturers. Shanghai Xinyang boasts two core competencies: electronic plating and electronic cleaning.

Anji Microelectronics: Innovation Lays the Foundation for the Company, and Collaboration Drives Its Development.

Anji Microelectronics Co., Ltd. is located in Pudong, Shanghai, and is one of the few domestic high-tech microelectronic materials companies that integrates R&D, production, sales, and service into a single, independently innovative enterprise. Several of the company’s leading figures boast nearly two decades of extensive technical and managerial experience in the semiconductor industry from globally renowned companies. The company has assembled a team of talented professionals drawn from prestigious global chip manufacturers and other high-end microelectronics industries. The company’s main products include a variety of chemical-mechanical polishing liquids, cleaning solutions, 3D packaging materials, and related chemical solutions for integrated circuit manufacturing. Several of these products have already entered mass production at well-known semiconductor facilities both domestically and internationally, and the company holds over 70 patents. In I

Jiangfeng Electronics: Adding to the Development of China's Materials Industry

China Shipbuilding Industry Corporation No. 718 Research Institute: Strive for the glory of our industry and boldly aim to be the industry leader.

The 718th Institute of China Shipbuilding Industry Corporation began research and development on NF3 in the late 1970s. By the end of 2002, the institute had developed a process for producing high-purity NF3 gas (99.99% purity) via electrolysis and achieved large-scale production. Subsequently, through continuous optimization and adjustment of the process flow and operating parameters, the purity of NF3 gas was raised to 99.996%, with a production capacity reaching 1,350 tons per year. Building on the increasingly mature technology for NF3 products, the institute successfully developed high-purity WF6 gas at 99.9999% purity in 2006 and completed the construction of a production line, now boasting a capacity of 150 tons per year.

The Materials Alliance and Suzhou Jingfang jointly held a supply-and-demand matchmaking meeting to promote the mass application of domestically produced materials, which took place on July 3, 2013, in Suzhou.

To accelerate the large-scale application of domestically produced materials in integrated circuits and advanced packaging, enhance the overall competitiveness of products from member companies of the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance (referred to as the “Materials Alliance”), and assist semiconductor manufacturing enterprises in selecting top domestic material suppliers and establishing long-term partnerships, the Materials Alliance held a supply-and-demand matchmaking meeting on July 3, 2013, jointly with Suzhou Jingfang Semiconductor Technology Co., Ltd. to promote the large-scale application of domestically produced materials. Suzhou Jingfang provided strong support for this meeting. Mr. Wang Wei, Chairman and President of the company, and Mr. Vage Oganesian, Chief Executive Officer (CEO), attended the meeting.

The China Integrated Circuit Materials Industry Technology Innovation Strategic Alliance Has Been Established.

Photo of the First Board of Directors of the Materials Alliance: The first board of directors of the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance was held in Shanghai on January 8, 2013. At the meeting, Academician Wang Xi, Director of the Shanghai Institute of Microsystem and Information Technology of the Chinese Academy of Sciences, Chairman of Shanghai Xin'ao Technology Co., Ltd., and Deputy Head of the Overall Expert Group for Project 02, was elected as the Chairman of the Alliance. Also elected were Li Xuwu, Vice President of R&D at SMIC; Lei Haibo, Vice President of Operations at Shanghai HuaHong NEC Electronics Co., Ltd.; Zhou Qigang, Chairman of Youyan Semiconductor Materials Co., Ltd.; and Sun Jiangyan, Chief Engineer at Shanghai Xinyang Semiconductor Materials Co., Ltd.