The first Advanced Electronic Packaging Materials Technology Forum was successfully held.

2013 Year 11 Moon 18 On [date], the first Advanced Electronic Packaging Materials Technology Forum, proposed and supported by the Materials Alliance, was successfully held in Shenzhen. This forum focused on... “ Development and Industrialization of Key Materials for Next-Generation Electronic Packaging ” The forum, themed around an in-depth exploration of China’s electronic packaging materials and development models, will also discuss establishing smooth channels for industry-academia-research collaboration. The forum is organized by the Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences. “ Advanced electronic packaging materials ” Guangdong Province Innovation Team (hereinafter referred to as) “ Innovation Team ” The forum was hosted by Bi Yalei, Assistant Director of the Shenzhen Institute of Advanced Technology and Director of the Department of Industrial Development and Resources, who also presided over the opening ceremony.

country 02 Researcher Ye Tianchun, Chief Engineer for Specialized Technologies and Director of the Institute of Microelectronics at the Chinese Academy of Sciences, delivered a speech. In his address, Director Ye first introduced the current status and future development trends of integrated circuit technology, as well as the gap between China and advanced countries abroad. He also pointed out that materials could potentially become the core component of the next-generation integrated circuits. Director Ye believes that China needs to deploy its efforts with the following goals in mind: mastering core technologies, developing competitive products, forging distinctive innovative strengths, and enhancing industrial competitiveness; and focusing on... “ Chase Strategy ” To “ Innovation and Leapfrogging Strategy ” The shift involves moving from striving to narrow the technological gap to pursuing the goal of establishing our own distinctive position within the global industrial innovation chain.

Chen Tian’an, General Manager of Debang Technology Co., Ltd., delivered a speech on behalf of the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials Industry. In his address, Chen Tian’an introduced the alliance’s founding history, organizational structure, mission and vision, as well as its goals. He also highlighted the Guangdong Province Advanced Electronic Packaging Materials Innovation Research Team and expressed his hope that this team would play a leading and exemplary role in advancing the development of electronic packaging materials in China. Furthermore, he expressed his wish that this forum would actively promote the development of electronic packaging materials in China.

In his speech, Director Fan Jianping of the Institute of Advanced Technology stated that the state has recognized that the integrated circuit industry is the core and foundation for fostering and developing strategic emerging industries, promoting the deep integration of informatization and industrialization, and serving as an important guarantee for transforming the economic development model, adjusting the structure of the information industry, expanding information consumption, and safeguarding national security. However, at present, most of the key materials used in China’s integrated circuit industry still rely on imports, leaving the industry’s development subject to external dependencies. As an open, platform-based research institute, the Institute of Advanced Technology has introduced... “ Advanced electronic packaging materials ” The Guangdong Province Innovation Team is conducting research and development as well as industrialization efforts focused on high-density system-level packaging materials, striving to provide impetus for the development of China’s integrated circuit industry.

The forum’s special report session was chaired by Researcher Sun Rong, the executive leader of the innovation team. Professor Wang Zhengping, head of the innovation team, member of the U.S. National Academy of Engineering, Dean of the Faculty of Engineering at the Chinese University of Hong Kong, and Distinguished Professor at the Georgia Institute of Technology in the U.S., delivered a report on the history and challenges facing advanced electronic packaging technologies and key materials. Professor Wang has long been engaged in research on packaging technologies and materials and is widely acclaimed. “ The Father of Modern Semiconductor Packaging ” , its research areas include IC Publish academic papers in the field of packaging materials, particularly on encapsulation—especially equivalent sealing encapsulation, electronic processing encapsulation and self-assembly processing, interfacial adhesion, and nano-functional materials. 1000 Multiple applications for U.S. patents 60 Other items: Over the past five years, I have undertaken and participated in various projects. 100 Item.

Researcher Sun Rong, focusing on the development and industrialization of polymer-based electronic packaging materials, provided a detailed introduction to the research directions and progress made by her innovative team. She also shared with the attending business guests the team’s philosophy of serving enterprises and expressed their willingness to work together with companies to propel China’s advanced electronic packaging technology to an internationally leading position.

Professor Li Shiwei, Director of the Center for Advanced Microsystem Packaging at the Hong Kong University of Science and Technology and a core member of the innovation team, introduced to the audience present the interrelationships among advanced electronic packaging processes, technologies, and materials, as well as the cutting-edge technological developments in this field. He also led a discussion on the challenges facing China’s electronic packaging industry, including the gap between domestic and international practices in electronic packaging materials, the difficulties in localizing the supply of packaging materials, and the hurdles encountered in commercializing R&D achievements from universities and research institutes.

Professor Li Shiwei introduced electronic packaging structures and materials in a witty and humorous style, drawing parallels to Jin Yong’s martial arts novels. Professor Li likened the five core members of Guangdong Province’s innovative research team to the contenders vying for supremacy at Mount Hua, and compared the Five Elements of the Heavenly Stems to five different types of materials: Underfill Like water, belonging to the north, it represents the direction for future industrial research and development; high-thermal-conductivity and thermal-interface materials, like fire, belong to the south. —— Ultimately, we’re considering thermal resistance, and we must simultaneously take into account the relationship between thermal conductivity and mechanical strength. Substrate materials such as wood are typically found in Eastern cultures. —— We need to consider the relationship between the mechanical and electrical properties of substrate materials; high-dielectric materials such as gold belong to the Western world. —— This is the material most likely to be industrialized; TSV The material, like soil, occupies a central position and connects all other components. In addition, Professor Li emphasized that collaborative innovation plays a crucial role in scientific research!

This forum also invited renowned domestic experts from leading electronics companies to deliver presentations, including Shangguan Dongkai, CEO of Huajin Semiconductor Packaging Leading Technology Research Center Co., Ltd.; Han Jianglong, Chairman of Jiangsu Huahai Chengke New Materials Co., Ltd.; Kong Lingwen, Chief Engineer of Shenzhen Nan Circuit Co., Ltd.; and Zhang Yuan, Director and Planner of Product Engineering at Huawei Technologies Co., Ltd. The guests provided in-depth analyses of cutting-edge technologies in their respective areas of focus, such as high-density packaging substrate materials, plastic encapsulation materials, and trends in electronic hybrid integration.

Academician Wang Zhengping delivered a concluding remark at the forum. He pointed out that China’s electronic packaging materials and technologies still lag behind international standards. He expressed hope that packaging companies would give opportunities to packaging material manufacturers, working together to promote the development of China’s integrated circuit industry, and urged the government to provide appropriate policy support. At the same time, Academician Wang encouraged young students and engineers to study diligently, think creatively, conduct solid research, and become outstanding patriotic youths. Integrated circuit technology is transforming our social structures and personal lifestyles; yet what remains constant is the innovative spirit of the Guangdong Province Electronic Packaging Materials Innovation Team—its proactive thinking, courageous exploration, and sense of social responsibility in the field of electronic packaging technology. In the future, we must collectively pay close attention to and actively explore the prospects for academic research and industrial development in electronic packaging materials. We hope everyone will join forces to strive toward the goal of achieving domestic production and application of high-end electronic packaging materials in China.