Connecting Global Intellectual Resources to Boost China’s Materials Development—The Integrated Circuit Materials Industry Intelligence Exchange and Networking Conference Successfully Held in Shanghai

The “Integrated Circuit Materials Industry Intelligence Exchange Conference,” organized by the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance (hereinafter referred to as the “Materials Alliance”), was held in Shanghai on March 16, 2015. The event, themed “Connecting Global Intellectual Resources to Boost China’s Materials Development,” featured lively discussions on the latest technological advancements in the field of integrated circuit materials, development opportunities for China’s integrated circuit materials industry, and prospects for mutually beneficial, win-win cooperation and collaborative development. Ye Tianchun, Director of the Institute of Microelectronics at the Chinese Academy of Sciences and Head of the Overall Group for National Project 02; Wang Xi, Academician, Director of the Shanghai Institute of Microsystem at the Chinese Academy of Sciences, Deputy Head of the Overall Group for National Project 02, and Chairman of the Materials Alliance; and U.S.

The 2nd General Assembly of the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials Industry was held in Beijing.

On February 10, 2015, the second general assembly of the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials Industry was held in Beijing. Leaders and experts—including Ye Tianchun, Director of the Institute of Microelectronics at the Chinese Academy of Sciences and head of the overall group for National Project 02; and Academician Wang Xi, deputy head of the overall group for National Project 02—attended the meeting and delivered speeches. Ms. Shi Ying, Secretary-General of the Alliance, chaired the meeting and presented the work report. More than 70 representatives from member units of the Alliance participated in the meeting. The meeting fully recognized the Alliance’s achievements over the past two years in promoting supply-demand cooperation in the integrated circuit materials industry, supporting the relevant work of Project 02 and government departments, organizing industry forums as well as academic and industrial exchange activities, and exploring...

Materials Alliance Organizes a Seminar on Resource Recovery from Waste Generated by Semiconductor Manufacturing Processes

Statistical data show that China’s manufacturing sectors—including integrated circuits, flat-panel displays, and solar cells—consume approximately 700,000 tons of chemicals and metal targets annually, generating about 500,000 tons of waste chemicals and metal targets each year. The disposal of these wastes requires enormous financial resources, and most of the waste chemicals are treated by methods such as incineration or neutralization followed by landfilling, which not only leads to resource wastage but also increases the burden of environmental remediation. On March 10, 2015, the Materials Alliance, in collaboration with the China Semiconductor Industry Association, organized a “Semiconductor Manufacturing Process Waste Resource Utilization Technology Seminar” in Beijing. The seminar focused on resource utilization technologies for waste generated during semiconductor manufacturing processes and related industry practices.

CMP Industry Technology Development Trends

In recent years, with the rapid advancement of CMP industry technology, the future application prospects and existing challenges of advanced CMP technologies have become a hot topic of great concern. Currently, the main CMP technologies for nodes below 10nm include: FinFET STICMP, FinFET PolyCMP, FinFET RMGWCMP, CuCMP, and TSVCuCMP. On the path toward mastering CMP technologies below 10nm, several key challenges remain: reducing defects and achieving uniformity control in FEOLCMP; precisely controlling the height of metal gates in MOLCMP; reducing defects and ensuring self-aligned contacts.

2013 Silicon Substrate Materials Industry Data Statistics Report

This report is based on the requirements of the Chinese market and utilizes the latest data to analyze the domestic silicon substrate material industry from various perspectives, including industry size, production capacity of key products, R&D and industrial development investment, patent status, and workforce characteristics. The report was completed in December 2014. Report Outline: Preface—Introduction to the Silicon Substrate Material Industry; 1. Silicon Single-Crystal Polished Wafers; 2. Silicon Single-Crystal Epitaxial Wafers; 3. Silicon Single-Crystal Annealed Wafers; 4. Zone-Melted Silicon Single-Crystal Wafers; 5. SOI Wafers; 1. Overall Industry Scale of Silicon Substrate Materials in China; 2. Production Capacity of Key Products in the Silicon Substrate Material Industry; 3. China’s Silicon Substrate Material Industry...

Xuzhou Bokang: A Rising Star in the Photoresist Industry

Xuzhou Bokang Information Chemicals Co., Ltd. (hereinafter referred to as the “Company”) was established in March 2010. The Company is located in the Chemical Industry Cluster Zone of the Economic Development Zone in Pizhou City, Jiangsu Province, covering an area of 140 mu. It has set up a research and development base in Shanghai and boasts a dynamic R&D team. At this stage, the Company primarily engages in the R&D, production, and sales of photoresist monomers and related photoresist product series that are protected by independent intellectual property rights. Its designed production capacity is 500 tons per year, while its current production capacity has reached 150 tons per year. The Company holds 9 authorized invention patents and another 34 invention patent applications have successfully passed substantive examination. The Company has been recognized as a National High-Tech Enterprise and was awarded this title in 2013.

Liming Institute: Technology Leads Industries, Innovation Drives Development

Lingming Chemical Research & Design Institute Co., Ltd. (Lingming Institute) is the first domestic entity to research and develop the production technology for sulfur hexafluoride. It has achieved a leading position in China in terms of comprehensive technical capabilities in the fluorine production and fluoride compound manufacturing industries, with some of its technologies already reaching world-class levels. In recent years, Lingming Institute has also undertaken the industrial-scale development of specialty fluorine-containing electronic gases, such as high-purity sulfur hexafluoride, electronic-grade sulfur hexafluoride, high-purity nitrogen trifluoride, carbon tetrafluoride, and tungsten hexafluoride. Currently, the institute has established a production capacity of 3,000 tons per year of industrial-grade sulfur hexafluoride, 500 tons per year of high-purity sulfur hexafluoride, and 200 tons per year of high-purity nitrogen trifluoride. Among these, sulfur hexafluoride...

Introduction to the Innovative Research Team for Advanced Electronic Packaging Materials in Guangdong Province

In accordance with the central government’s overall strategic goal of building an innovation-driven nation and the National Medium- and Long-Term Science and Technology Development Plan, and in alignment with the Chinese Academy of Sciences’ requirements for adjusting its scientific and technological layout, and focusing on Shenzhen’s implementation of an innovation-oriented city strategy, in February 2006, the Chinese Academy of Sciences, the Shenzhen Municipal People’s Government, and the Chinese University of Hong Kong held friendly consultations and jointly established the Shenzhen Institute of Advanced Technology of the Chinese Academy of Sciences (Shenzhen Institute of Advanced Technology) in Shenzhen—a new type of national research institution that is internationally aligned and closely integrated with industry. The Guangdong Province Advanced Electronic Packaging Materials Innovation Research Team was led and introduced by the Shenzhen Institute of Advanced Technology. The team leader is Professor Chingping Wong.

Technical Status and Prospects of 450mm Wafer CMP Equipment

The typical lifecycle for upgrading wafer sizes is around 10 years. For example, the 200mm wafer was introduced in 1991, while the 300mm wafer—now widely used—was first adopted by Intel in 2001 and initially employed in 130nm-process processors. A 450mm wafer boasts more than twice the silicon area and yields significantly more chips per wafer compared to a 300mm wafer; consequently, the unit cost of each chip is substantially reduced. Moreover, larger wafers enhance the efficiency of resource utilization—such as energy and water—and help mitigate the impacts of environmental pollution, the greenhouse effect, global warming, and water scarcity. In 2007, ISMI (

The Zhongguancun Administrative Committee, together with the industry alliance, successfully held a briefing on Zhongguancun Customs policies.

On January 14, a symposium and exchange meeting between Zhongguancun Customs and integrated circuit enterprises, organized by the Industry Division of the Zhongguancun Administrative Committee, was successfully held at the Zhongguancun Exhibition Center. More than 50 representatives from integrated circuit design, manufacturing, key materials, and equipment sectors in the Beijing area attended the symposium. The meeting was chaired by Deputy Director Xu Jian from the Industry Division of the Zhongguancun Administrative Committee. Also in attendance were Zhang Huagang, Deputy Commissioner of Zhongguancun Customs; Dong Min and Wei Jia from the Processing Trade Division; and Fang Rong from the Industry Division of Zhongguancun. Officials from Zhongguancun Customs provided a detailed explanation of the customs’ innovative policies aimed at promoting the development of the integrated circuit industry, as well as the newly introduced credit management mechanism and the policies supporting the integrated development of the Beijing-Tianjin-Hebei region.

Beijing Kehua’s 248-nanometer photoresist has received a procurement order from SMIC.

Since receiving approval for the National Key Project 02 in 2010, Beijing Kehua Microelectronics Materials Co., Ltd. has, building on its previous work, initiated research and development of both products and processes for 248nm photoresist. In 2012, the company completed construction of a 248nm photoresist production line as well as an analysis, testing, and application-testing platform for 248nm photoresist. Over the following two years, Beijing Kehua worked closely with leading domestic integrated circuit customers, continuously conducting product tests and optimizing formulations and processes. Finally, in December 2014, the company successfully completed verification and customer review at SMIC’s site and secured commercial orders. From the early-stage technology...

Academician Wang Xi, Chairman of the Materials Alliance, and his delegation conducted a research visit to Juhua’s electronic chemicals industry.

On December 6, 2014, Academician Wang Xi, Deputy Head of the National “02” Special Project Overall Group and Chairman of the Materials Alliance, along with his delegation, visited Quzhou City, Zhejiang Province, to investigate the development of the electronic chemicals industry at Juhua Group Corporation (hereinafter referred to as Juhua or Juhua Group). Du Shiyuan, Acting Mayor of Quzhou City, and Wang Fengtao, General Manager of Juhua Group, held a meeting and exchange with Academician Wang Xi and Secretary-General Shi Ying on Juhua’s plans for developing the electronic chemicals industry. Accompanied by Wu Zhou’an, Assistant to the General Manager, the expert group conducted an in-depth field visit to Juhua’s Science and Technology Innovation Center and Zhejiang Kaisheng Fluorochemical Co., Ltd. (hereinafter referred to as Kaisheng), the subsidiary responsible for the electronic chemicals business, and listened to briefings on Juhua’s development of the electronic chemicals industry.

The project “Research on Key Materials with High-K for Ultra-Large-Scale Integrated Circuits,” undertaken by Nanjing University, has successfully passed acceptance testing.

The “Research on Key Materials with High-K Dielectrics for Ultra-Large-Scale Integrated Circuits” (2009ZX02039) project, which recently passed acceptance testing, is an important forward-looking research project established under the National Major Science and Technology Special Project 02, “Manufacturing Technologies and Complete Process Systems for Ultra-Large-Scale Integrated Circuits.” This project primarily focuses on the needs of CMOS technology for ultra-large-scale integrated circuits at the 32–22nm technology node. It aims to develop high-k material precursors and their synthesis processes with independent intellectual property rights, as well as to establish key technologies for preparing high-k materials via atomic layer deposition (ALD) that are compatible with semiconductor manufacturing processes, and to develop advanced high-k materials with excellent performance. Prototype devices will be used to validate these materials.

Industry-investment interaction is boosting the rapid development of China's integrated circuit materials industry.

Announcement by Zhejiang Juhua Co., Ltd. Regarding the Establishment of a Wholly-Owned Subsidiary and the Implementation of a High-Purity Electronic Gas Project

Stock Abbreviation: Juhua Shares Stock Code: 600160 Announcement No.: Lin 2014-71 The Board of Directors and all directors of this company hereby guarantee that the contents of this announcement do not contain any false records, misleading statements, or material omissions, and individually and jointly assume responsibility for the truthfulness, accuracy, and completeness of its contents. Zhejiang Juhua Co., Ltd. (hereinafter referred to as “the Company” or “this Company”)—in order to adapt to the rapid development trend of the electronic information industry market, accelerate the cultivation of its electronic chemicals business, leverage synergies from product variety and scale aggregation, foster new profit growth points, promote transformation and upgrading, and optimize industrial structure—has, upon approval by the Company’s Board of Directors...

Qiu Ciyun Praises Local Semiconductor Material Suppliers at ITPC.

The International Technology Partners Conference (ITPC), held from November 9 to 12 at the Fairmont Orchid Hotel in Hawaii, is the premier industry summit for the global semiconductor sector. This year’s theme is “New Structures for Innovation.” In the opening keynote address, Dr. Qiu Ciyun, CEO and Executive Director of SMIC—the largest wafer foundry in mainland China—discussed China’s semiconductor industry.

Chengdu Shidai Lifu—Building the No.1 Local Brand of CMP Polishing Pads

Chengdu Shidai Lifu Technology Co., Ltd. was established in December 2012 with a registered capital of 35 million yuan. The company is located in the Logistics Park of the Shuangliu Economic Development Zone in Chengdu. Its primary business activities include the development of advanced semiconductor materials and related technologies, as well as the research, manufacturing, and sales of integrated circuits, LEDs, and precision glass polishing consumables. The company boasts a 5,000-square-meter production facility, a 500-square-meter dust-free laboratory, and an R&D center. On September 13, 2013, the company obtained the ISO9001:2008 quality management system certification, and successfully renewed its certification on September 11, 2014, thereby incorporating design and R&D into the company’s quality management system.

Debang Technology: Driving Growth Through Innovation to Build a Competitive Electronic Materials Enterprise

Yantai Debang Technology Co., Ltd., established in 2003, is a high-tech enterprise boasting a strong team of technical experts and highly independent innovation capabilities. The company is dedicated to the specialized R&D, production, and sales of specialty polymer interface materials with advanced functional properties for industrial and electronic applications. The company has set up multiple research platforms, including a postdoctoral workstation, a provincial academician workstation, a provincial international science and technology cooperation research center, and a provincial engineering technology research center for microelectronic packaging materials and system integration. It has received numerous awards, such as “Top 100 Enterprises with the Greatest Entrepreneurial Potential” and “Key Overseas Chinese Entrepreneurial Team” from the China Overseas Chinese Entrepreneurs’ Park. The company continues to increase its investment in scientific and technological innovation and encourages its employees.