The 2nd General Assembly of the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials Industry was held in Beijing.

On February 10, 2015, the second general assembly of the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials Industry was held in Beijing. Leaders and experts—including Ye Tianchun, Director of the Institute of Microelectronics at the Chinese Academy of Sciences and head of the overall group for National Project 02; and Academician Wang Xi, deputy head of the overall group for National Project 02—attended the meeting and delivered speeches. Ms. Shi Ying, Secretary-General of the Alliance, chaired the meeting and presented the work report. More than 70 representatives from member units of the Alliance participated in the meeting. The meeting fully recognized the Alliance’s achievements over the past two years in promoting supply-demand cooperation in the integrated circuit materials industry, supporting the relevant work of Project 02 and government departments, organizing industry forums as well as academic and industrial exchange activities, and exploring...

2015 February 10, The second general assembly of the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials Industry was held in Beijing. Leaders and experts—including Ye Tianchun, Director of the Institute of Microelectronics at the Chinese Academy of Sciences and head of the overall group for National Project 02, and Academician Wang Xi, deputy head of the overall group for National Project 02—attended the meeting and delivered speeches. Ms. Shi Ying, Secretary-General of the Alliance, chaired the meeting and presented the work report. More than 70 representatives from member units of the Alliance participated in the event. Proposal.

The meeting fully affirmed the remarkable achievements the Alliance has made over the past two years in promoting supply-demand cooperation in the integrated circuit materials industry, supporting the work of the “02 Special Project” and relevant government departments, organizing industry forums as well as academic and industrial exchange activities, exploring avenues for cooperation between the Alliance and international organizations and enterprises, developing and formulating a roadmap for the development of the materials industry, and strengthening the Alliance’s own institutional development. achievements, and discussed and examined the key priorities for future work. The meeting reviewed and... The proposals—including “Establishing an Advanced Packaging Materials Application Verification Platform through the Alliance Based on HuaJin Semiconductor,” “Hiring Academician Wang Zhengping and Dr. Lin Qinghuang as Special Consultants to the Alliance,” and “First Amendment to the Strategic Alliance Agreement for Technological Innovation in the Integrated Circuit Materials Industry”—were adopted. Discussions also covered the work plan for the 2015 C-MRS Microelectronics and Optoelectronics Sub-venue, as well as the establishment and activity schedule of the Flat Polishing Technology Alliance (CMPUG-CHINA).

The conference elected the second council, consisting of 49 directors. Select Academician Wang Xi was appointed as the Chairman of the Alliance; Wu Hanming, Vice President of R&D at SMIC; Li Qi, Deputy General Manager of Shanghai HuaHong Hongli Electronics Co., Ltd.; and Zhou Qigang from Youyan Semiconductor Materials Co., Ltd. were elected. Directors, including Yao Lijun, Chairman of Ningbo Jiangfeng Electronic Materials Co., Ltd., and Sun Jiangyan, Chief Engineer of Shanghai Xinyang Semiconductor Materials Co., Ltd., were appointed as Vice Chairpersons. Wang Shumin, Chairman of Anji Microelectronics (Shanghai) Co., Ltd., Chen Xin, Chairman of Beijing Kehua Microelectronics Materials Co., Ltd., Wang Shaobo, Deputy Director of the 718th Research Institute of China Shipbuilding Industry Corporation, Zheng Kangding, Chairman of Ningbo Kangqiang Electronics Co., Ltd., Yang Zhicheng, General Manager of Shenzhen Nan Circuit Co., Ltd., Feng Qili, Chairman of Jiangsu Zhongpeng New Materials Co., Ltd., Zheng Hongyu, Deputy Director of Hebei Zhongci Electronic Technology Co., Ltd., and Shangguan Dongkai, Chairman of HuaJin Semiconductor Packaging Leading Technology R&D Center Co., Ltd., were elected as Executive Directors. Ms. Shi Ying was elected as the Secretary-General of the Alliance.

Ye Tianchun, head of the National Special Project 02 General Group and Director of the Institute of Microelectronics at the Chinese Academy of Sciences, highly praised the achievements made by the Materials Alliance and stated: 02 The Specialized Overall Group will vigorously promote the development of the materials industry and continue to support the work of the Alliance. He also expressed his hope that the Materials Alliance could leverage its own strengths, proactively provide expert advice to major national funds and other financial investment institutions, and make good use of and integrate existing resources to build a shared platform that supports technological innovation in the materials industry. Furthermore, he urged materials companies to seize the golden opportunity presented by China’s integrated circuit industry over the next 5 to 10 years, fully harnessing the favorable ecosystem created by the “three-chain integration” of the industrial chain, innovation chain, and financial chain, and collectively contribute to building flagship enterprises in the materials industry.

Academician Wang Xi, Chairman of the Alliance, conveyed the guiding instructions from State Council leaders on doing a good job with the nation’s major special projects. He also called on the Alliance to build on and further enhance its existing strengths, with a particular focus on collaborating closely with the National Integrated Circuit “Big Fund” to promote the integration of the integrated circuit materials industry and achieve breakthroughs in establishing large-scale enterprises in key areas. At the same time, he expressed his hope that the Alliance would play a supporting role in the formulation and implementation and management of science and technology and industrial development plans related to integrated circuit materials—beyond the scope of the 02 Special Project.

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