Connecting Global Intellectual Resources to Boost China’s Materials Development—The Integrated Circuit Materials Industry Intelligence Exchange and Networking Conference Successfully Held in Shanghai

The Integrated Circuit Materials Industry Technology Innovation Strategic Alliance (hereinafter referred to as “ Materials Alliance ” ) hosted by “ Integrated Circuit Materials Industry Intelligence and Friendship Association ” Yu 2015 Year 3 Moon 16 held in Shanghai. The event features “ Leveraging global intellectual resources to boost China’s materials development. ” On this topic, we will discuss the latest technological advancements in the field of integrated circuit materials, the development opportunities for China’s integrated circuit materials industry, and the prospects for mutually beneficial, win-win cooperation and collaborative development. The nation. 02 Head of the Specialized Overall Group, Director Ye Tianchun of the Institute of Microelectronics, Chinese Academy of Sciences, National... 02 Academician Wang Xi, Deputy Head of the Specialized Overall Group, Chairman of the Materials Alliance, and Director of the Shanghai Institute of Microsystem, Chinese Academy of Sciences; Member of the U.S. National Academy of Engineering; Foreign Academician of the Chinese Academy of Engineering; U.S. Georgia Institute of Technology Director Professor Wang Zhengping, Academician, United States IBM Company New York Watson Dr. Lin Qinghuang from the R&D Center and 20 Multiple overseas experts, 40 Representatives from multiple alliance member organizations, some of them 02 Specialized experts, etc. 100 Several experts from both domestic and international fields of integrated circuit materials and related areas attended the event.

In his speech, Academician Wang Xi stated: Since its establishment, the Materials Alliance has carried out a great deal of effective work in promoting industrial and technological exchanges, fostering supply-demand cooperation across the industrial chain, accelerating market development, and enhancing industrial technologies. It has also achieved remarkable results in strategic research on industrial development as well as in providing advisory services for relevant science and technology programs and industrial planning. This recently organized “Rongzhi” networking event represents a valuable exploration in the areas of technological and talent cooperation. Although China’s integrated circuit materials industry has made significant progress, it still faces numerous challenges—particularly in certain core materials that constrain industry development, such as... 12 Inch silicon wafer, 193 The issues surrounding photoresists and other cutting-edge materials remain unresolved, the layout for research and development of advanced materials still needs further refinement, and the situation in which material companies face difficulties entering the market has yet to see fundamental improvement. We hope that material enterprises will seize the favorable opportunities presented by the release of the “Outline,” the establishment of the Big Fund, and the creation of industrial funds by local governments, and in the future... 5–10 Let’s do a good job running our own businesses and make our own contributions to the development of China’s integrated circuit industry.

In his speech, Director Ye Tianchun stated: From the perspective of the national integrated circuit industry chain layout—design, manufacturing, equipment, and materials—the materials industry is the first link to benefit from, demonstrate the greatest growth potential, and yield the fastest results in the development of the entire integrated circuit value chain. It is foreseeable that as global integrated circuit manufacturing shifts on a large scale to mainland China over the next few years, this will bring tremendous market opportunities for the development of the local materials supply chain. We hope that materials companies will seize these opportunities by focusing on integrating domestic and international resources, strengthening cooperation with internationally advanced multinational corporations, deepening integration with global high-end intellectual resources, and rapidly growing stronger and bigger. The Rongzhi Networking Event has established an excellent platform for promoting talent exchange and collaboration, enabling the overseas experts present here to gain insight into the latest developments in domestic technology and industrial trends through this channel. We would be even more delighted to see experts actively engage in the cause of developing China’s integrated circuit industry.

Academician Wang Xi, representing the Materials Alliance, was hailed by the industry as... “ The Father of Modern Semiconductor Packaging ” received from Academician Wang Zhengping IBM Dr. Lin Qinghuang, recipient of the title “Master Inventor,” presented the Certificate of Special Expert Appointed by the Materials Alliance. Academician Wang delivered a speech titled: “ Electronic Packaging Technology and Materials ” The report provides a detailed overview of the latest research trends in integrated circuit packaging technology, the current state and existing challenges facing China’s semiconductor packaging materials industry, as well as corresponding countermeasures and development opportunities. Academician Wang also introduced the relevant work being carried out by the innovative team for advanced electronic packaging materials at the Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences. Dr. Lin, meanwhile, ... “ Development Opportunities for Next-Generation Micro- and Nano-Electronic Manufacturing Technologies and Related Materials ” The presentation reviewed the history of the invention and development of integrated circuit technology, provided a detailed introduction to the latest advancements in lithography technologies, and highlighted the challenges faced by materials due to the application of new devices and novel structures, as well as emerging trends in new materials research. The two specially appointed experts will offer technical advice and meticulous guidance to support the future business development of the Materials Alliance.

Secretary-General Shi Ying introduced to the domestic and international guests attending the meeting the basic information about the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance, the alliance’s mission, and the alliance’s role in... “ Collaborative innovation, cooperative development ” Under the guidance of our mission, we organize and carry out activities such as supply-demand cooperation across the industrial chain, academic and industrial exchange events, the formulation of industrial development roadmaps, and strategic research on industrial development planning. Currently, China’s materials industry is experiencing an unprecedented strategic opportunity. Industrial development requires talent and technology, as well as the expansion of overseas operations and collaboration with foreign research institutions and enterprises. We hope that the alliance can serve as a window and a conduit, playing the role of a platform and a bridge to facilitate technological exchanges and talent cooperation between domestic and international enterprises and related institutions. On the premise of respecting intellectual property rights and mutual interests, the alliance can integrate global intellectual resources and accelerate the rapid development of China’s integrated circuit materials industry.