Introduction to the Innovative Research Team for Advanced Electronic Packaging Materials in Guangdong Province

In accordance with the central government’s overall strategic goal of building an innovation-driven nation and the National Medium- and Long-Term Science and Technology Development Plan, and in alignment with the Chinese Academy of Sciences’ requirements for adjusting its scientific and technological layout, and focusing on Shenzhen’s implementation of an innovation-oriented city strategy, in February 2006, the Chinese Academy of Sciences, the Shenzhen Municipal People’s Government, and the Chinese University of Hong Kong held friendly consultations and jointly established the Shenzhen Institute of Advanced Technology of the Chinese Academy of Sciences (Shenzhen Institute of Advanced Technology) in Shenzhen—a new type of national research institution that is internationally aligned and closely integrated with industry. The Guangdong Province Advanced Electronic Packaging Materials Innovation Research Team was led and introduced by the Shenzhen Institute of Advanced Technology. The team leader is Professor Chingping Wong.

In accordance with the central government’s overall strategic goal of building an innovative nation and the National Medium- and Long-Term Science and Technology Development Plan, and in alignment with the requirements for adjusting the Chinese Academy of Sciences’ scientific and technological layout, and focusing on Shenzhen’s implementation of its innovative city strategy, 2006 Year 2 In the month of [month], the Chinese Academy of Sciences, the Shenzhen Municipal People's Government, and the Chinese University of Hong Kong held friendly consultations and jointly established the Shenzhen Institute of Advanced Technology of the Chinese Academy of Sciences (Shenzhen Institute of Advanced Technology) in Shenzhen. —— A new type of national research institution that aligns with international standards and industry needs.

The Guangdong Province Advanced Electronic Packaging Materials Innovation Research Team was initiated and introduced by the Shenzhen Institute of Advanced Technology. The team leader is Wang Zhengping. Chingping Wong Professor, Member of the U.S. National Academy of Engineering, Foreign Academician of the Chinese Academy of Engineering, expert in electronic packaging materials, and hailed by the industry as... “ The Father of Modern Semiconductor Packaging ” Has published academic papers related to the field of electronic packaging. 1000 Multiple applications for U.S. patents 60 Other items: Over the past five years, I have undertaken and participated in various projects. 100 Item. The core members of the team include numerous experts and scholars in the field of electronic packaging materials, such as Li Shiwei, Xu Jianbin, Lü Daoqiang, Yuan Minghui, Sun Rong, and Liao Weixin. All team members have extensive experience in project research or product development at renowned universities, research institutes, or multinational corporations both domestically and abroad, and have successfully developed new products. 40 Other items. The team includes members of the U.S. National Academy of Engineering and foreign academicians of the Chinese Academy of Engineering. 1 Person, IEEEFellow2 Person, National Young Top-notch Scientist 1 People, including recipients of the State Council Special Allowance and other core personnel, totaling: 50 Others.

The team combines three-dimensional integrated circuits ( 3D IC ) In line with the development trend of system-level packaging, adhere to “ Materials Development – Pilot-scale process – Industrial application ” The R&D model closely integrates material synthesis and formulation, processing technology, and equipment development. It adheres to the principle of using basic research to drive industrialization, focusing on tackling key scientific challenges related to the thermal, electrical, mechanical, and optical properties of high-density system-level packaging polymer composites. The breakthrough will be achieved through five critical materials urgently needed by China’s integrated circuit industry: ( 1 High-density flip-chip underfill, ( 2 ) Thermal interface material, ( 3 ) Three-dimensional silicon through-hole polymer insulating material, ( 4 ) Embedded Capacitor Materials and Application Technologies, ( 5 ) High-speed, high-frequency organic substrate base materials. Currently, breakthroughs in the core technologies for these key materials have been achieved. In particular, buried capacitor materials and three-dimensional silicon-through-hole polymer insulating materials have completed user validation and have entered the stage of engineering production and product promotion. Meanwhile, leveraging the team’s extensive experience in nanomaterial development, we have successfully prepared engineered samples of electronic-grade, monodisperse spherical silica microparticles and silver nanowires with exceptionally high aspect ratios.

In short, the team will focus on cultivating high-end talent for the integrated circuit industry and take it upon itself to develop key materials for electronic packaging in China. We are eager to collaborate closely with companies throughout the upstream and downstream segments of the industrial chain, providing domestically produced solutions for electronic materials to support the growth of China’s integrated circuit industry, continuously fostering a new era of prosperity for China’s electronic materials sector, and offering both talent and technical services to help Chinese IC enterprises gain a stronger foothold in international competition.

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