Qiu Ciyun Praises Local Semiconductor Material Suppliers at ITPC.

　　The International Technology Partners Conference (ITPC), held from November 9 to 12 at the Fairmont Orchid Hotel in Hawaii, is the premier industry summit for the global semiconductor sector. This year’s theme is “New Structures for Innovation.” In the opening keynote address, Dr. Qiu Ciyun, CEO and Executive Director of SMIC—the largest wafer foundry in mainland China—lavished praise on China’s semiconductor industry, particularly offering high recognition as a user of China’s rapidly growing semiconductor material suppliers.

　　Qiu Ciyun believes that after more than a decade of painstaking efforts and relentless perseverance, Chinese semiconductor materials companies have been the first to see their products enter the supply chains of leading semiconductor manufacturing lines on a large scale—this is a source of pride for China’s entire semiconductor industry.

　　Jiangfeng Electronics has rapidly risen to prominence in the research, development, and production of ultra-high-purity metal materials and sputtering targets. Its products have already been mass-produced at the 28nm process node for 300mm wafers by world-class semiconductor companies (such as TSMC, UMC, and Toshiba), placing Jiangfeng Electronics among the global leaders in ultra-large-scale integrated circuit chip manufacturing and filling a significant industrial gap in China’s target material sector. Currently, Jiangfeng Electronics is undertaking the R&D for the nation’s Major National Project 02 (materials related to the 20-14nm technology node). Its technological capabilities have reached an internationally leading level and are having a broad impact across the relevant industry sectors.

　　Shanghai Xinyang’s copper sulfate electroplating solution products have successfully been integrated into SMIC Beijing’s B1 central supply system and have officially become SMIC Beijing’s primary supplier of copper sulfate electroplating solutions. By continuously improving and optimizing its management and production systems, Xinyang has effectively ensured the stability of supply and the reliability of its products, thereby breaking the monopoly held by foreign semiconductor material suppliers and taking a significant step toward the localization of China’s semiconductor materials. As a leading domestic supplier of semiconductor materials, Shanghai Xinyang is poised to soon expand its international business as well. Shanghai Xinyang’s products encompass specialized electronic chemicals and associated equipment required for both front-end and back-end semiconductor processes, including TSV technology, dry etching and cleaning technologies, and wafer bump plating technologies.

　　Anji Microelectronics, which specializes in the supply of advanced electronic chemicals and supporting equipment required for both front-end and back-end semiconductor processes—including technologies such as TSV, dry etching and cleaning, and wafer bump plating—has developed products tailored to 90-40 nanometer IC technology nodes. These products have been in mass production for several years on the production lines of numerous large and leading semiconductor companies both domestically and internationally. Starting from research on the 90-65 nanometer technology node in 2009, Anji successfully mastered the 45-28 nanometer node by 2013. The company has rapidly enhanced its key preparation and large-scale production technologies for polishing slurries. Currently, Anji is engaged in the development and validation of products related to the 32-28 nanometer technology node. Relying on independent R&D and innovation, Anji has completed three iterative upgrades of its products.

　　Qiu Ciyun stated that SMIC is the largest and most technologically advanced integrated circuit foundry in mainland China. SMIC provides wafer fabrication and technical services ranging from 0.35-micron to 28-nanometer processes to customers worldwide. SMIC’s remarkable achievements would not have been possible without the rapidly growing environment of China’s semiconductor industry as a whole. As Chinese domestic IC companies continue to mature and develop, SMIC’s role in the industrial value chain has become increasingly prominent. This positive interaction has, in turn, fostered mutual advancement among upstream and downstream enterprises. SMIC is highly committed to working closely with Chinese design houses and suppliers to achieve even better win-win outcomes.

　　The ITPC, held annually in Hawaii, has been around for 29 years. It was originally established to help ease the U.S.-Japan semiconductor trade dispute. As the semiconductor industry became increasingly globalized, South Korea, Europe, Taiwan, Singapore, and mainland China soon joined the event one after another. Starting in 2012, the organizer SEMI changed the conference’s name from “International Trade Partners Conference (ITPC)” to “International Technology Partners Conference (ITPC),” transforming it into an annual gathering eagerly attended by industry leaders. Its unique core value lies in bringing together top executives from global semiconductor and related industries to jointly discuss strategic investments, market trends, and technological challenges across the semiconductor value chain, thereby fostering business cooperation and exchange among senior executives from companies worldwide involved in the nano- and microelectronics manufacturing supply chain. (Source: IC Design and Manufacturing)