Chengdu Shidai Lifu—Building the No.1 Local Brand of CMP Polishing Pads

Chengdu Shidai Lifu Technology Co., Ltd. was established. 2012 Year 12 Month, registered capital 3500 Ten thousand yuan, located in the Logistics Park of the Shuangliu Economic Development Zone in Chengdu. The company primarily engages in the development and technical services of advanced semiconductor materials technologies, as well as integrated circuits. LED and the R&D, manufacturing, and sales of precision glass polishing consumables. The company possesses 5000 Square-meter production facility, 500 A dust-free laboratory and R&D center covering square meters. The company is located at... 2013 Year 9 Moon 13 Already obtained ISO9001:2008 Certificate of Qualification for Quality System Certification, and with 2014 Year 9 Moon 11 Successfully renewed the certification today, incorporating design and R&D into the company’s quality system scope.

The company’s R&D technical team is composed primarily of core R&D personnel from leading enterprises in Silicon Valley, USA, and boasts proprietary intellectual property rights. The international team led by Ms. Zhang Lijuan comprises key technical personnel who played an important role in the initial stages of R&D, all of whom have... 10 To 20 Years of experience in chemical-mechanical polishing, including over [number] years of work in the field of semiconductor chemical-mechanical polishing. 20 American experts with over [number] years of experience Harvey Pinder, is currently in CMP An internationally-minded team that stands unmatched in its field. The company’s Chairman, Yi Xingwang, and General Manager, Li Changjun, both boast over 20 years of extensive experience in finance, production, quality control, and project management at large state-owned enterprises.

Under the leadership of the R&D technology team, the company has successfully developed two types of substrate materials: hollow and solid. TL1212/I、TL1212/II、TL1232 and several other products, each used for 8 Inch-chip manufacturing Oxide 、 Tungsten , wafer recycling and for 12 Inch-level chip manufacturing, etc. CMP Process polishing, as verified by customer and industry peers, 8 Inch CMP The comprehensive performance of the series of polishing pads fully meets the requirements for chips. CMP The requirements are fully comparable to, and even superior to, similar foreign products. It is now in mass production, with an annual production capacity of up to... 8 Ten thousand pieces. For use in 12 The copper-process and oxide-layer polishing pads in inches are currently undergoing testing.

In terms of technological advantages, Shidai Lifu’s polishing pads feature structural improvements—such as in their physical design—compared to currently available products on the market. According to... CaiHong The study suggests that contact wear caused by the bending of the polishing pad body and the roughness-induced peaks is responsible for the formation of butterfly-shaped depressions on copper wires. dishing The primary reason is that if the polishing pad itself has low hardness, high compressibility, and high surface roughness, it is more likely to cause substrate bending and the formation of coarse peaks, leading to contact wear. This theory has also been recognized within the industry. To address this issue, we employ advanced manufacturing processes that allow us to precisely control the distribution and size of pores, as well as utilize cutting-edge polymers to achieve an optimal balance between the polishing pad’s hardness and modulus properties, thereby significantly reducing... 65nm Copper process with fine line width dishing and erosion , sprint 10nm Zero in linewidth technology erosion technical barriers. Currently, the company has obtained two invention patents and two utility model patents, with two additional patents pending application in Taiwan.

The company in 2013 Year 11 The moon has already obtained the materials for 8 Orders for polishing pads used in the oxide layer process for chip manufacturing have once again been secured this year for... 8 Order for tungsten wire polishing pads used in chip manufacturing. Currently, Shidai Lifu polishing pads are available in most regions of China as well as in Singapore. 8 and 12 The wafer fab has launched a comprehensive online evaluation, and it is expected to secure orders from two new customers by the end of this year. Meanwhile, Times Lifu’s sapphire substrates and wafer-recycling polishing pads have also entered the final stage of customer evaluation, and orders from customers are anticipated early next year.

Under the premise of the state policy fully supporting the independent development of the semiconductor industry chain, Shidai Lifu is... 2014 Year 4 The moon has obtained the national “Technology and Complete Process for Manufacturing Ultra-Large-Scale Integrated Circuits,” namely: 02 Specialized support has been undertaken. 2014–2017 Year 02 Major Science and Technology Special Project 20–14 nm Technology node CMPSTI/SIO2 Process layers and metal interconnects With Cu Process Layer Polishing Pad R&D Project, Project Number: 2014ZX02301003-003-002.

Guided by the corporate philosophy of “Innovation Builds the Brand, and Technology Leads the Future,” the company has developed a world-class, domestically leading brand of precision polishing materials through a strategic approach focused on technological innovation, management innovation, and talent innovation.