Hotspot Focus
The “300mm Silicon Wafer Sputtering Target R&D and Industrialization” project under the National Key Science and Technology Special Project “Manufacturing Equipment and Complete Process Technologies for Ultra-Large-Scale Integrated Circuits” (the “02 Special Project”) has successfully passed the project acceptance organized by the Implementation Management Office of the 02 Special Project on March 28, after nearly five years of collaborative research and development involving industry, academia, research institutions, and end-users. All performance indicators of the project have met the requirements specified in the contract. The completion of this project has broken the monopoly held by the United States and Japan over high-end sputtering targets used in integrated circuits, playing a significant role in promoting technological advancement in China’s electronic information products and fostering the comprehensive development of the entire integrated circuit industry chain. “Sputtering Targets for 300mm Silicon Wafer Processes”
Leasing services tailored for technology-oriented enterprises represent one of the pioneering financial service initiatives launched by Zhongguancun Technology Leasing Co., Ltd. Most of the member units of the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials Industry are small and medium-sized technology enterprises. In the course of their business development, these enterprises have substantial funding needs for activities such as technological R&D, procurement of equipment and instruments, development of user markets, and expansion into new business areas—areas that closely align with the scope of services offered by Zhongguancun Technology Leasing Co., Ltd. To foster cooperation between the two parties, on the afternoon of July 7, 2014, Secretary-General Shi Ying of the Alliance specially invited Zhang Rui, Deputy Director General of the Leasing Division at Zhongguancun Technology Leasing (Beijing) Co., Ltd., to join the Materials Alliance.
The 4th meeting of the 1st Council of the Materials Alliance was held in Chengdu.
On July 7, the Materials Alliance held its first fourth session of the Board of Directors in Chengdu, coinciding with the “Microelectronics and Optoelectronics Materials Division” of the 2014 China Materials Conference, which was hosted by the Alliance from July 4 to 7, 2014 in Chengdu. The meeting was chaired by Secretary-General Shi Ying. The meeting fully affirmed the Alliance’s work in the first half of 2014, discussed and deliberated on the Alliance’s key tasks for the second half of 2014, reviewed and approved applications from nine companies—including Angelic Electronics and Duofluoride Chemical—to join the Alliance, and reviewed and approved the registration and establishment of the Zhongguancun Multi-Dimensional Integrated Circuit Materials Industry Technology Innovation Strategic Alliance under the Materials Alliance. Before concluding the meeting, the Alliance also invited Zhongguancun Science & Technology Leasing.
From April 20 to 25, 2014, led by Academician Wang Xi, Chairman of the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance, the Alliance, together with its 12 member units, traveled to Japan for an inspection tour. During this visit, the Alliance co-hosted the "4th Japan-China Electronic Materials Technology Exchange Conference" with the Japan-China Science and Technology Friendship Exchange Association. The delegation also visited the headquarters of six Japanese companies—Tokyo University’s Faculty of Engineering, FUJIFILM, Toppan Printing, Tokyo Kasei, Tokyo Electron, DISCO Technology, and Mitsubishi Chemical—and held three collaborative exchange meetings with RSTechnology, SEAJ, and SEMI Japan. Chairman Wang Xi represented the Materials...
High-purity electronic gases are crucial foundational materials essential to the electronic information industry, playing a vital supporting role in sectors such as integrated circuits, flat-panel displays, LEDs, and photovoltaic manufacturing. To reverse China’s long-term reliance on imports for high-purity electronic gases used in integrated circuit manufacturing and lay the foundation for establishing a domestically controlled and self-reliant integrated circuit industry chain, the “02 Special Project” launched the “Research and Industrialization of High-Purity Electronic Gases” initiative in 2013. This project focuses on developing key specialty electronic gases used in critical processes in integrated circuit manufacturing—including ion implantation, diffusion, etching, deposition, and cleaning—while achieving breakthroughs in the purification, refining, and high-precision separation of electronic gases.
On May 24, 2014, the Supply-Demand Matchmaking Conference for the Mass Production and Application of Domestically Produced Semiconductor Materials was grandly held in Wuxi. The conference was organized by the Materials Alliance and hosted by HuaRun Microelectronics Co., Ltd. Researcher Ye Tianchun, leader of the General Expert Group for National Major Science and Technology Project 02 and Director of the Institute of Microelectronics of the Chinese Academy of Sciences, attended the conference and delivered a speech. Academician Wang Xi, Deputy Leader of the General Expert Group for Project 02 and Chairman of the Materials Alliance, delivered the opening address. Shi Ying, Secretary-General of the Materials Alliance, chaired the meeting. Chen Shuo, Chairman of HuaRun Microelectronics, presented a keynote report and led representatives from HuaRun Microelectronics, HuaRun Shanghua, HuaRun Huajing, and HuaRun Ansheng—subsidiaries of the group—to discuss R&D and quality issues related to material verification.
Reflections on the Development of the Electronic Gases Industry
I. Applications of Electronic Gases in the Modern Electronics Industry The modern electronics industry has become a core industrial system that underpins the sustainable development of the national economy and safeguards national strategic security. The advancement of the electronics industry—represented by ultra-large-scale integrated circuits and solid-state semiconductor lighting—has transformed human modes of production, daily life, and thinking, significantly promoting the progress of human civilization and greatly boosting the sustainable growth of the global economy. The level of development and industrial scale of integrated circuit technology have become important indicators for measuring a country’s overall technological prowess, degree of modernization, and economic strength. Electronic gases are essential to the manufacturing of integrated circuits and solid-state…
The development of integrated circuits requires a well-established materials system for support.
First, establishing a comprehensive materials ecosystem is an inevitable requirement for industrial development. From the perspective of the integrated circuit industry’s overall development, manufacturing is the key to driving growth across the entire sector. Only by scaling up manufacturing can China’s integrated circuit materials industry create sufficient market space. However, without a corresponding industrial ecosystem, it will be extremely difficult for the integrated circuit manufacturing sector to thrive in isolation. The industrial ecosystem can be understood as comprising two dimensions—horizontal and vertical. Horizontally, it encompasses integrated circuit design, manufacturing, packaging, equipment, materials, as well as specialized financial and intermediary services. Among these, materials play a crucial role in the ecosystem. Vertically, looking at integrated circuit materials, we need both large, leading enterprises...
Jiangsu Zhongpeng New Materials Co., Ltd. is a manufacturer of electronic packaging materials that integrates research and development, production, and sales. It is one of the largest domestically-owned R&D and production bases for epoxy molding compounds and phenolic molding compounds in China. Currently, the company ranks second among its peers nationwide, and is the number one domestically-owned enterprise in the country. Zhongpeng New Materials currently has a production capacity of 14,000 tons for epoxy molding compounds. Its products are primarily used in primary packaging for semiconductor discrete devices—including Doid, TO, DIP, SOT, SSOP, LQFP, DFN, QFN, and BGA—as well as power devices, specialty devices, and large-scale and ultra-large-scale integrated circuits. Phenolic molding...
Shanghai Xin'ao and Soitec Announce Collaboration to Produce 200mm SOI Wafers
On May 26, 2014, Shanghai Xin'ao and the French company Soitec jointly announced that they had reached an agreement to establish an international partnership aimed at addressing the growing business needs of both companies in China and the global shortage of 200mm SOI capacity tailored for RF and power semiconductor applications. In addition to providing Soitec with world-class SOI wafer manufacturing capabilities in China, this agreement will also significantly boost the industrial-scale production capacity of SOI wafers. A key initial step in this collaboration is the establishment of an SOI ecosystem in China. The newly signed agreement between the two partners includes licensing and technology transfer arrangements. Accordingly, Xin'ao will adopt Soi
Hua Hai Cheng Ke: Building the No. 1 Brand in Electronic Packaging Materials
Jiangsu Huahai Chengke New Materials Co., Ltd. is a high-tech enterprise specializing in the R&D, production, sales, and technical services of semiconductor packaging materials. The company has built one pilot-scale production line and two large-scale production lines for epoxy molding compounds that meet internationally advanced standards. Its current annual production capacity is 10,000 tons. Additionally, the company has established a research center for novel electronic packaging materials, boasting strong R&D capabilities and comprehensive testing facilities. The company’s product portfolio covers semiconductor device packaging materials, materials for large-scale, ultra-large-scale, and extremely large-scale integrated circuits, specialized motor packaging materials, LED packaging materials, and more. The company also provides integrated services including product testing, application support, and performance evaluation.
The “Microelectronics and Optoelectronics Materials Division” of the 2014 China Materials Conference, organized by the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance (Materials Alliance), was successfully held from July 4 to 7, 2014, at Sichuan University. Approximately 100 participants attended the conference, including members of the Materials Alliance’s Expert Advisory Committee, directors, representatives from member units, as well as experts, scholars, and business leaders from related fields. The conference featured a total of 14 invited keynote reports, 25 plenary presentations, and 40 poster presentations. Hot topics discussed included new materials for 16-nanometer FinFETs, silicon-based III-V high-mobility materials, silicon-germanium materials, and MOSFET devices.
Foshan Huater Gas: Aiming to Become a Multinational Gas Company Rooted in China
Foshan Huate Gas Co., Ltd. was established in 1993 and has now grown into a medium-sized enterprise with more than 10 subsidiaries across mainland China and Hong Kong, employing over 1,000 people. It is one of the largest manufacturers of specialty gases in China. In recent years, the company has continuously increased its investment in R&D, establishing R&D platforms such as the “Foshan Electronic Gas Engineering Technology Research and Development Center” and the “Joint Laboratory for R&D of Special Electronic Gases.” The company has successively undertaken Guangdong Provincial Department of Education’s industry-academia-research collaboration projects as well as the National Key Science and Technology Project 02. Additionally, it has participated in the formulation of 10 national standards, including the standard “Carbon Tetrafluoride for the Electronics Industry,” and currently holds 2 patents.
Dalian Bonded Zone KeliDe Chemical Technology Development Co., Ltd. was established in 2001. It is a national-level high-tech enterprise specializing in the research, development, and production of optoelectronic materials such as high-purity electronic gases, high-purity metal-organic compounds, and high-purity metal alkoxides. Its products are primarily used in semiconductor technology fields including large-scale integrated circuits, semiconductor lighting, liquid crystal display panels, and solar cells. Since its establishment, the company has set up an independently incorporated R&D center for specialized electronic gases, staffed by experienced technical experts and a team of energetic young researchers dedicated to developing technologies applied in semiconductor manufacturing processes.
China Materials Conference 2014—“Microelectronics and Optoelectronics Materials Division”
The “Microelectronics and Optoelectronics Materials Division” of the 2014 China Materials Conference, organized by the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance (Materials Alliance), was successfully held from July 4 to 7, 2014, at Sichuan University. Approximately 100 participants attended the conference, including members of the Materials Alliance’s Expert Advisory Committee, directors, representatives from member units, as well as experts, scholars, and business leaders from related fields. The conference featured a total of 14 invited keynote reports, 25 plenary presentations, and 40 poster presentations. Hot topics discussed included new materials for 16-nanometer FinFETs, silicon-based III-V high-mobility materials, silicon-germanium materials, and MOSFET devices.
Haidian District Talent Service Center: Guide to Applying for Work and Residence Permits
This service must be handled uniformly by personnel from the unit’s human resources department. Please read the “Service Guide” carefully before starting the application process. I. Accepting Agencies: The Haidian District Talent Service Center Headquarters and the Shangdi Subcenter. II. Basis for Acceptance: 1. Notice on Implementing Several Opinions Regarding the Beijing Work and Residence Permit System (Jing Zheng Ban Fa [2003] No. 29); 2. Notice on Doing a Good Job in the Renewal of the Beijing Work and Residence Permit (Jing Ren Fa [2006] No. 56). III. Eligibility Requirements: (1) Qualification Requirements for Applying Units: The applicant unit must be registered and tax-paying in Haidian District, Beijing, and have independent legal personality.
On the afternoon of April 10, 2014, representatives from the Secretariat of the Integrated Circuit Materials Alliance attended the “In-depth Interpretation Meeting on 2014 Talent Attraction Policies,” jointly organized by Tsinghua Science Park and the Zhongguancun Industry Technology Alliance Promotion Association. The policy interpretation meeting featured Deputy Director Lan Shenghua from the High-Level Talent Service Management Office of the Haidian District Bureau of Human Resources and Social Security in Beijing, as well as Ms. Guan Xin from the Enterprise Services Department of the Haidian District Talent Service Center, who provided detailed explanations and interpretations of the 2014 Haidian District policies related to “Talent Attraction and Work-Residence Permits” and the corresponding application procedures. Nearly 100 corporate representatives participated in the meeting. The Haidian District Bureau of Human Resources and...
Made in China, Leading the Future
Ningbo Jiangfeng Electronic Materials Co., Ltd. is engaged in the research, development, and production of ultra-high-purity metals and sputtering targets for ultra-large-scale integrated circuits. Since its establishment eight years ago, the company has received strong support from science and technology policies, notably the National 02 Special Project, enabling rapid business growth. Currently, Jiangfeng Electronic’s production capacity ranks among the top globally in the target materials sector. Our products have successfully entered the markets of world-class semiconductor companies in North America, Japan, South Korea, Southeast Asia, and Taiwan, and are already being used in mass production at the 28-nanometer technology node for 300-millimeter wafers. At present, our technological level has nearly reached the international cutting edge, making us a global leader in ultra-high-purity metals and sputtering targets.
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