Exploring avenues for international cooperation to jointly create a bright future for the industry—The Materials Alliance’s first group visit to Japan achieves success.

From April 20 to 25, 2014, led by Academician Wang Xi, Chairman of the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance, the Alliance, together with its 12 member units, traveled to Japan for an inspection tour. During this visit, the Alliance co-hosted the "4th Japan-China Electronic Materials Technology Exchange Conference" with the Japan-China Science and Technology Friendship Exchange Association. The delegation also visited the headquarters of six Japanese companies—Tokyo University’s Faculty of Engineering, FUJIFILM, Toppan Printing, Tokyo Kasei, Tokyo Electron, DISCO Technology, and Mitsubishi Chemical—and held three collaborative exchange meetings with RSTechnology, SEAJ, and SEMI Japan. Chairman Wang Xi represented the Materials...

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2014 Year 4 Moon 20–25 On [date], the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance, led by its Chairman, Academician Wang Xi, joined forces with... 12 Member organizations of the consortium conducted a study tour to Japan. During the visit, the consortium co-hosted the “4th Japan-China Electronic Materials Technology Exchange Conference” with the Japan-China Science and Technology Friendship Exchange Association, and subsequently paid visits to the Faculty of Engineering at the University of Tokyo. FUJIFILM Offset printing, Tokyo Electrochemical, Tokyo Electron, DISCO Technology, Mitsubishi Chemical, and others 6 Headquarters of Japanese companies, and RS Technology 、 SEAJ 、 SEMI Japan Wait to hold 3 Joint negotiation and exchange meeting.

Chairman Wang Xi, representing the Materials Alliance, in... 4 Moon 21 Delivered a speech at the 4th Japan-China Electronic Materials Technology Conference; representatives from both China and Japan. 14 The speakers and attendees shared the latest trends in integrated circuit manufacturing and design technologies. MEMS thin-film magnetic sensors, phase-change memory ( PCRAM ), graphene supercapacitors, advanced lithography materials, CMP The current technological status of industries such as abrasive materials, electronic chemicals, encapsulating materials, and electronic gases, as well as... Interposer Technology and challenges, among other things. In his presentation titled “An Overview of China’s Integrated Circuit Materials Industry,” Secretary-General Shi Ying pointed out: Since... 2008–2009 年全球金融危机以来，集成电路材料市场格局发生了深刻的变化，台湾、日本、韩国分处前三位，中国已超过北美位居第四位。伴随着中国经济的持续增长和集成电路产业的快速发展，中国市场将保持强劲发展势头。她同时指出，日本集成电路材料在全球产业链中占据着重要地位，研发实力雄厚、产业规模宏大，但却面临本国制造业持续萎缩的局面，而中国是一个值得日本材料界重视的新兴市场。中国集成电路材料业虽然目前的技术水平和产业规模还不能与日本同行相比，但在研发投入、知识产权积累、产业发展、团队建设等各方面都表现出良好的增长势头，企业正以饱满的热情和开放的态度进行技术开发和产业化发展。相信两国企业、研究机构之间存在诸多潜在的合作机会。材料联盟和日中科技友好协会应加强合作，为双方企业搭建交流平台，促进合作共赢。石瑛秘书长的上述观点和倡议得到了中日双方与会代表的认同。

During our subsequent visit and exchanges with our Japanese counterparts, we gained a deep appreciation for the formidable strength of Japanese enterprises. Most Japanese companies have a development history spanning several decades—or even over a century—and throughout their growth, they have consistently followed a clear path marked by continuous technological innovation and a globally oriented industrial layout that is closely aligned with customer needs. We were profoundly impressed by the companies’ financial strength, sophisticated management practices, strong team cohesion, and robust corporate culture. During this visit, we introduced the Materials Alliance and China’s rapidly growing integrated circuit materials industry to our Japanese peers, fostering mutual understanding and laying a solid foundation for further substantive cooperation in the future. The event was organized with the support of the Japan-China Science and Technology Friendship Association. SEMI and SEAJ The assistance and support provided have accumulated valuable experience for the alliance in collaborating with various relevant parties to promote technological and industrial development.

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