Zhongpeng New Materials: Upholding an innovative spirit and aspiring to the grand vision of the Kunpeng.

Jiangsu Zhongpeng New Materials Co., Ltd. is a manufacturer of electronic packaging materials that integrates research and development, production, and sales. It is one of the largest domestically-owned R&D and production bases for epoxy molding compounds and phenolic molding compounds in China. Currently, the company ranks second among its peers nationwide, and is the number one domestically-owned enterprise in the country. Zhongpeng New Materials currently has a production capacity of 14,000 tons for epoxy molding compounds. Its products are primarily used in primary packaging for semiconductor discrete devices—including Doid, TO, DIP, SOT, SSOP, LQFP, DFN, QFN, and BGA—as well as power devices, specialty devices, and large-scale and ultra-large-scale integrated circuits. Phenolic molding...

Existing production capacity of Zhongpeng New Materials’ epoxy molding compound 14000 ton, the product is mainly used for Crazy 、 TO 、 DIP 、 SOT 、 SSOP 、 LQFP 、 DFN 、 QFN 、 BGA First-level packaging for semiconductor discrete devices, power devices, special-purpose devices, and large- and ultra-large-scale integrated circuits. Phenolic molding compounds are primarily used in the encapsulation of coil bobbins, commutators, carbon brush holders, switches, capacitors, terminal blocks, automotive electrical components, and the like.

The company has established a provincial-level R&D center equipped with cutting-edge technology development and testing instruments that meet international standards. It boasts a domestically leading, fully integrated pilot-production line and hosts a provincial-level postdoctoral research workstation. The company is supported by a highly skilled R&D team and collaborates with the Institute of Chemistry, Chinese Academy of Sciences, and Nanjing University in industry-academia-research partnerships, thereby creating an R&D innovation platform that ranks among the best in China.

In recent years, the company has successively undertaken 20 Multiple national and provincial-level science and technology projects, including national ones. 02 Major Special Project 3 Item: Special Fund Project for the Commercialization of Scientific and Technological Achievements in Jiangsu Province 1 Item: Cultivating National Semiconductor Innovation Products 2 One, high-tech products from Jiangsu Province 6 One.

In the future, Zhongpeng New Materials will continue to uphold the spirit of innovation and strive to realize, as soon as possible, its vision of becoming a “semiconductor packaging material supplier at world-class level.” (Submitted by Jiangsu Zhongpeng New Materials Co., Ltd.)

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