Hua Hai Cheng Ke: Building the No. 1 Brand in Electronic Packaging Materials

Jiangsu Huahai Chengke New Materials Co., Ltd. is a high-tech enterprise specializing in the R&D, production, sales, and technical services of semiconductor packaging materials. The company has built one pilot-scale production line and two large-scale production lines for epoxy molding compounds that meet internationally advanced standards. Its current annual production capacity is 10,000 tons. Additionally, the company has established a research center for novel electronic packaging materials, boasting strong R&D capabilities and comprehensive testing facilities. The company’s product portfolio covers semiconductor device packaging materials, materials for large-scale, ultra-large-scale, and extremely large-scale integrated circuits, specialized motor packaging materials, LED packaging materials, and more. The company also provides integrated services including product testing, application support, and performance evaluation.

Jiangsu Huahai Chengke New Materials Co., Ltd. is a high-tech enterprise specializing in the R&D, production, sales, and technical services of semiconductor packaging materials. The company has built a pilot production line for epoxy molding compounds that meets internationally advanced standards. 1 Strip and large production line 2 Article, existing production capacity 10000 ton / year, and has established a research center for new electronic packaging materials, boasting strong R&D capabilities and comprehensive testing methods. The company’s products cover semiconductor device packaging materials and large-scale / Ultra-large scale / Ultra-large-scale integrated circuit materials, special motor encapsulation materials, LED Encapsulation materials and more, along with end-to-end supporting service capabilities that integrate product testing, application, evaluation, and technical support into a single, comprehensive service offering.

Over the past two years, the company has developed and completed new products, leveraging its strong R&D team and robust technological capabilities. 20 Multiple, mastering core technologies with independent intellectual property rights and holding patents. 16 Item. Successfully developed. Management Information System Encapsulation molding compound, QFN the encapsulating material, LED White epoxy encapsulant for brackets ( The only one in China ) The new products developed by the company have reached internationally advanced technological levels and are leading domestically. While placing great emphasis on the development of new products and new technologies, the company is also actively promoting the commercialization of these innovations and expanding its market presence. The company... 2013 Annual sales revenue increased year-on-year. 165% ，2014 Annual planned sales revenue grows again year-on-year. 88% 。

Leveraging its own strengths, the company will continue to pursue technological innovation and market development with a perfect team, cutting-edge technology, and advanced manufacturing equipment, and has plans for the future. 3 By the end of this year, we will expand our epoxy molding compound production capacity to... 2 Ten thousand tons / This year, we have become the leading domestic brand in microelectronic materials and a world-class supplier of microelectronic materials. (Submitted by Jiangsu Huahai Chengke New Materials Co., Ltd.)

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