“Research and Industrialization of Sputtering Targets for 300mm Silicon Wafer Processes” – The 02 Special Project undertaken by the alliance’s member units has passed acceptance.

The “300mm Silicon Wafer Sputtering Target R&D and Industrialization” project under the National Key Science and Technology Special Project “Manufacturing Equipment and Complete Process Technologies for Ultra-Large-Scale Integrated Circuits” (the “02 Special Project”) has successfully passed the project acceptance organized by the Implementation Management Office of the 02 Special Project on March 28, after nearly five years of collaborative research and development involving industry, academia, research institutions, and end-users. All performance indicators of the project have met the requirements specified in the contract. The completion of this project has broken the monopoly held by the United States and Japan over high-end sputtering targets used in integrated circuits, playing a significant role in promoting technological advancement in China’s electronic information products and fostering the comprehensive development of the entire integrated circuit industry chain. “Sputtering Targets for 300mm Silicon Wafer Processes”

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National Key Science and Technology Special Project “Manufacturing Equipment and Complete Process Technologies for Ultra-Large-Scale Integrated Circuits” (“ 02 Specialized”)” 300mm The “R&D and Industrialization of Sputtering Targets for Silicon Wafer Processing” project, after nearly... 5 After joint research and development efforts involving industry, academia, research, and application over the past year, all indicators have met the requirements stipulated in the contract. 3 Moon 28 Passed on the day 02 Project acceptance organized by the Special Implementation Management Office. The completion of this project has broken the monopoly held by the United States and Japan on high-end targets used in integrated circuits, playing a significant role in promoting technological advancement in the nation’s electronic information products and fostering the comprehensive development of the entire integrated circuit industry chain.

“ 300mm The “R&D and Industrialization of Sputtering Targets for Silicon Wafer Processing” project is led by Zhongse Dongfang as the responsible entity, in collaboration with other parties. 6 a company and 2 Jointly completed by universities and colleges. The project includes: 6 This topic, at 2009 The initiative was launched at the beginning of the year, with participating entities including not only raw material producers but also target material manufacturers, as well as target material users involved in the certification process. The project adopts an evaluation approach characterized by “downstream entities assessing upstream ones, systems assessing components, applications assessing technologies, and the market assessing products,” thereby breaking through barriers in high-purity... Al/ Alloy (5N5) 、 Ti (5N) 、 Cu (6N) 、 Ta (4N5) Key preparation technologies such as wet metallurgy, electrolysis, casting, and electron-beam melting for metals—our team has independently designed and manufactured specialized equipment for the purification of high-purity aluminum and titanium raw materials, and has developed large-size, high-purity metals. / Alloy ingot, breaking through high purity. Al/ Alloy, You 、 With Cu 、 You From key technologies including forging, rolling, heat treatment, the microstructure and texture of metallic grains, diffusion bonding and finished-product machining, to cleaning—target materials have, for the first time, enabled the production of extremely large-scale integrated circuits. 300mm High-purity for silicon wafer processing With Cu 、 You Localization of the entire process—from raw materials and ingot casting to target material preparation. The technological level has reached the international advanced standard, and our products have been certified by users including SMIC, JCET, and Nantong Fujitsu, with sales already underway. 2 Over 100 million yuan, applying for a patent 48 Item: Develop industry standards 5 Item: Develop new products and new processes. 26 Item: Cultivating doctoral students 9 Name, Master's 16 Name, Technical Expert 17 Name.

Yang Jun, Deputy Director of the Office for Managing Major National Science and Technology Projects at the Ministry of Science and Technology, stated that, 02 The special project is one of the major initiatives identified in the nation’s medium- and long-term science and technology plan. The projects are undertaken by leading domestic enterprises, and the project led by China Nonferrous Oriental has been executed exceptionally well—this is something to be truly proud of. We hope that all enterprises will carefully summarize their experiences and lay a solid foundation for achieving the next set of goals.

02 Ye Tianchun, head of the special overall expert panel, stated that... 02 The layout of special projects is crucial to each key link in the nation’s integrated circuit industry chain. As these special projects advance, all links in the industry chain will gradually become more interconnected, while also enhancing the technological capabilities, competitiveness, and innovation capacity of the participating organizations. He hopes that all project implementers will continue to maintain the cooperative relationships they have established, further strengthening their efforts in areas such as resource integration, business models, and investment and financing, thereby achieving long-term economic and social benefits.

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