The China Integrated Circuit Materials Industry Technology Innovation Strategic Alliance Has Been Established.

Photo of the First Board of Directors of the Materials Alliance: The first board of directors of the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance was held in Shanghai on January 8, 2013. At the meeting, Academician Wang Xi, Director of the Shanghai Institute of Microsystem and Information Technology of the Chinese Academy of Sciences, Chairman of Shanghai Xin'ao Technology Co., Ltd., and Deputy Head of the Overall Expert Group for Project 02, was elected as the Chairman of the Alliance. Also elected were Li Xuwu, Vice President of R&D at SMIC; Lei Haibo, Vice President of Operations at Shanghai HuaHong NEC Electronics Co., Ltd.; Zhou Qigang, Chairman of Youyan Semiconductor Materials Co., Ltd.; and Sun Jiangyan, Chief Engineer at Shanghai Xinyang Semiconductor Materials Co., Ltd.

Group photo of the first board of directors of the Materials Alliance

The first council meeting of the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance was held on... 2013 Year 1 Moon 8 The event was held in Shanghai. The meeting elected the director of the Shanghai Institute of Microsystem and Information Technology of the Chinese Academy of Sciences and chairman of Shanghai New-Ao Technology Co., Ltd., 02 Academician Wang Xi, Deputy Head of the Specialized Overall Expert Group, was appointed as the Chairman of the Alliance; Li Xuwu, Vice President of R&D at SMIC Integrated Circuit Manufacturing Co., Ltd., and Shanghai HuaHong were elected. NEC Lei Haibo, Vice President of Operations at the Electronics Co., Ltd.; Zhou Qigang, Chairman of Youyan Semiconductor Materials Co., Ltd.; Sun Jiangyan, Chief Engineer at Shanghai Xinyang Semiconductor Materials Co., Ltd.; and Yao Lijun, Chairman of Ningbo Jiangfeng Electronic Materials Co., Ltd., serve as Vice Chairpersons. Chen Xin, Chairman of Beijing Kehua Microelectronics Materials Co., Ltd., and Anji Microelectronics were elected... ( Shanghai ) Chairwoman Wang Shumin of the Limited Liability Company, Chairman Shen Haoping of Tianjin Huan’ou Semiconductor Materials Technology Co., Ltd., and China Shipbuilding Industry Corporation No. 718 Vice Director Wang Shaobo of the Institute, General Manager Yang Zhicheng of Shenzhen Shennan Circuit Co., Ltd., and Chairman Feng Qili of Jiangsu Zhongpeng New Materials Co., Ltd. were appointed as executive directors; Assistant to the General Manager of Youyan Semiconductor Materials Co., Ltd. was elected... 02 Ms. Shi Ying, a member of the special overall expert panel, serves as the Secretary-General.

The council reviewed and approved the proposal submitted by Wang Xi, Yang Deren, Peng Shugen, Su Wei, Liu Zhiguo, Zhao Chao, Sun Jiangyan, Wang Shumin, Xu Congying, and Chen Tian’an, among others. 10 The comrades formed the first Expert Advisory Committee of the Alliance, with Academician Wang Xi serving as the chairperson and Professor Yang Deren serving as the vice chairperson.

The Council has reviewed and approved the “Administrative Measures for the Alliance Expert Advisory Committee,” the “Administrative Measures for the Alliance Secretariat,” the “Administrative Measures for Alliance Funding,” the “Administrative Measures for Alliance Projects,” the “Administrative Measures for Alliance Intellectual Property Rights,” and the “Administrative Measures for the Dissolution and Liquidation of the Alliance.” These measures take effect immediately.

The alliance will integrate innovative resources across the nation’s integrated circuit materials sector, implement the country’s medium- and long-term science and technology development plan, and leverage the national major science and technology project “Manufacturing Equipment and Complete Process Technologies for Ultra-Large-Scale Integrated Circuits” as a technology-driven platform and key link. Relying on the talent, technological expertise, and market resources of the alliance’s member organizations, the alliance will accelerate the industrialization of scientific and technological achievements and achieve localized supply of materials used in China’s integrated circuit manufacturing. By establishing effective collaboration mechanisms, the alliance will enhance its overall strengths, foster the concentration of talent and the development of critical technologies in China’s integrated circuit materials sector, continuously improve its independent innovation capabilities, support China’s innovation in integrated circuit technologies, and contribute to the global advancement of integrated circuit materials technology.

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