The alliance is urgently convening an expert review meeting for the draft roadmap on industrial technology development.

On November 14–15, 2013, the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance (hereinafter referred to as the “Alliance”) convened a meeting in Shanghai to review the draft of the Alliance’s “Technology Development Roadmap for the Integrated Circuit Materials Industry” (hereinafter referred to as the “Roadmap”). The meeting was chaired by Secretary-General Shi Ying. More than 60 representatives attended the meeting, including members of the review expert panel and representatives from the 11 specialized working groups under the Roadmap. The expert panel comprised members of the Alliance’s Expert Advisory Committee (hereinafter referred to as the “Advisory Committee”) and members of the Alliance’s Board of Directors, including Professor Yang Deren, Deputy Director of the Advisory Committee and Director of the Semiconductor Materials Research Institute at Zhejiang University, as well as members of the Advisory Committee from Nanjing University.

On November 14–15, 2013, the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance (hereinafter referred to as the “Alliance”) convened a meeting in Shanghai to review the draft of the Alliance’s “Technology Development Roadmap for the Integrated Circuit Materials Industry” (hereinafter referred to as the “Roadmap”). The meeting was chaired by Secretary-General Shi Ying. More than 60 representatives attended the meeting, including members of the review expert panel and representatives from the 11 specialized working groups under the Roadmap. The expert panel comprised members of the Alliance’s Expert Advisory Committee (hereinafter referred to as the “Advisory Committee”) and members of the Alliance’s Board of Directors, including Professor Yang Deren, Deputy Director of the Advisory Committee and Director of the Semiconductor Materials Research Institute at Zhejiang University; Professor Liu Zhiguo from Nanjing University, Researcher Zhao Chao from the Institute of Microelectronics of the Chinese Academy of Sciences, Professor Zhang Wei from Fudan University, Dr. Xu Congying, Vice President of Nanda Optoelectronics, and Dr. Wang Shumin, Chairwoman and CEO of Anji Microelectronics, among others.

The conference lasted one and a half days. In 11 specialized working groups—covering markets, substrate materials, masks, photoresists, polishing materials, target materials, electronic gases, chemicals, specialized packaging materials, and new materials—the participating experts presented draft versions of the “Roadmap,” totaling over 700 pages. The main contents of the Roadmap include an analysis of the domestic integrated circuit materials market, an analysis of related industries, an overview of the current state of the materials industry, the competitive landscape of the materials sector, the industrial development environment both domestically and internationally, relevant plans, technology and industry development roadmaps, as well as policy and measure recommendations. The expert review panel listened carefully to each specialized working group’s draft report, fully recognizing the significant progress made in the preparation of the Roadmap. They asked detailed questions about any ambiguities or issues raised in the reports and offered constructive suggestions for revisions. Additionally, they provided specific recommendations regarding the overall preparation, publication, and distribution of the Roadmap.

Secretary-General Shi Ying thanked everyone for their hard work and requested that, over the next month, they continue to refine relevant information—including, but not limited to, extending the corresponding plans and forecasts through 2020 and aligning them with national planning; supplementing information on the management practices, R&D investment, product and technology strategies, and successful experiences of international competitors; and providing actionable recommendations on building an innovation platform for China’s integrated circuit materials industry and enhancing its innovation capabilities.

Previously, the consortium had convened two meetings related to the drafting of the “Roadmap”—the kickoff meeting for the “Roadmap” drafting, held in Beijing on August 23, 2013, and the working group leaders’ meeting, held in Quzhou on September 28. A total of 40 enterprises and institutions participated in this effort, including major domestic integrated circuit materials users such as SMIC, HuaHong NEC, HuaRun ShangHua, ChangElec, Tongfu Microelectronics, as well as key materials R&D entities including Shanghai Xin'ao, Youyan Silicon Shares, Beijing Kehua, Nanjing University Optoelectronics, Shanghai Xinyang, Anji Microelectronics, Jiangfeng Electronics, Yantai Debang, and the Shanghai Institute of Microsystem Technology, Chinese Academy of Sciences.

Key words: