20

2017

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07

The “China Materials Conference 2017” Advanced Microelectronics and Optoelectronics Materials Subsession was successfully held.

From July 8 to 12, 2017, the "China Materials Conference 2017" was grandly held at the Ningxia International Convention Center in Yinchuan City, Ningxia Hui Autonomous Region. The conference featured a total of 35 sub-forums and 2 international forums, with themes covering material fields such as energy materials, environmental materials, advanced structural materials, functional materials, and basic materials research. The number of participants exceeded 5,000. Concurrent with the conference was the "Advanced Microelectronics and Optoelectronics Materials Sub-forum," organized by the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials and Components Industry and jointly supported by the Shanghai Institute of Microsystem and Information Technology of the Chinese Academy of Sciences and the Beijing Multi-Dimensional Electronic Materials Technology Development and Promotion Center.


  From July 8 to 12, 2017, the "China Materials Conference 2017" was grandly held at the Ningxia International Convention Center in Yinchuan City, Ningxia Hui Autonomous Region. The conference featured a total of 35 sub-conferences and 2 international forums, with themes covering material fields such as energy materials, environmental materials, advanced structural materials, functional materials, and fundamental materials research. The number of participants exceeded 5,000.

  The “Advanced Microelectronics and Optoelectronics Materials Sub-venue,” organized by the Strategic Alliance for Technological Innovation in Integrated Circuit Materials and Components Industry and jointly supported by the Shanghai Institute of Microsystem and Information Technology of the Chinese Academy of Sciences and the Beijing Multi-Dimensional Electronic Materials Technology Development and Promotion Center, was held concurrently. This sub-venue aims to facilitate exchanges and cooperation among experts, scholars, and industry representatives in China’s microelectronics and optoelectronics materials fields, share the latest research findings in these areas, and achieve mutual promotion and joint advancement, thereby further enhancing China’s academic standards and technological innovation capabilities in the field of microelectronics and optoelectronics materials.

  Academician Wang Xi, Director of the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, served as the Chair of the “Advanced Microelectronics and Optoelectronics Materials Subsession.” Academician Wang Zhengping from the Chinese University of Hong Kong served as the Honorary Chair of the subsession. Researcher Zhao Chao from the Institute of Microelectronics, CAS, Dr. Lin Qinghuang from IBM, and Professor Yang Deren from Zhejiang University jointly served as Vice Chairs of the subsession. At the invitation of Academician Wang Xi, Researcher Zhao Chao delivered the opening address on behalf of Academician Wang Xi. More than 80 delegates from across the country gathered to discuss the latest achievements in the fields of microelectronics and optoelectronics materials. The three-day academic exchange featured keynote speeches, invited reports, oral presentations, and poster sessions. These presentations covered a wide range of topics within the field of microelectronics and optoelectronics materials, including substrate materials such as Si, Ge, SOI, GOI, SiC, and compound semiconductors; high-k and low-k materials, GeSi, GeSn, PCRAM, RRAM, STT-MRAM, and other materials used in integrated circuit and optoelectronic device fabrication; novel display materials; process materials for integrated circuit manufacturing, such as photoresists, DSA, CVD and ALD precursors, CMP polishing materials, process chemicals, and targets; advanced packaging materials; carbon-based functional materials like carbon nanotubes and graphene; new two-dimensional materials; novel storage materials and technologies; material testing techniques and methods; and material design theories and computational simulations.

  Academician Ming Liu from the Institute of Microelectronics of the Chinese Academy of Sciences delivered a keynote speech titled “Development Trends and Challenges in Non-Volatile Memory.” Using detailed data analysis, Academician Liu highlighted the importance of developing memory technologies in China, outlined the current status and challenges facing both international and domestic memory industries, and discussed the academic research trends in non-volatile memory as well as the Institute of Microelectronics’ recent progress in this field. Academician Liu believes that China’s memory industry has entered a golden age. Although the industrialization of domestic memory faces numerous challenges, it also presents many opportunities. We should seize this moment to catch up with the world’s advanced levels.

  Professor Song Haizhi from the University of Electronic Science and Technology delivered a keynote speech titled “Semiconductor Optoelectronic Materials—From 3D to 0D, From Classical Applications to Quantum Information.” In his talk, Professor Song provided a detailed overview of the development history of semiconductor optoelectronic materials and shared his team’s research achievements in this field over the past several years. His team has developed semiconductor photodetectors, lasers, optical amplifiers, and other materials ranging from 3D to 0D. Looking ahead, they will continue their exploration to fully advance semiconductor optoelectronic materials—from classical applications into the realm of quantum information.

  Researcher Wei Yaya from the Institute of Microelectronics of the Chinese Academy of Sciences delivered a keynote speech titled “New Opportunities and Challenges in the Development of Lithography Materials.” In his presentation, Researcher Wei Yaya provided a detailed overview of the performance requirements that various current lithography technologies place on photoresist materials. He pointed out that the photoresist industry is highly profitable, yet our country still lags significantly behind foreign counterparts in terms of photoresist materials. Therefore, it is critically important to carry out research in this area, achieve breakthroughs in domestically produced materials, and ultimately realize the localization of lithography materials—thus reducing costs and breaking free from reliance on foreign suppliers. At the same time, Researcher Wei Yaya shared the Institute of Microelectronics’ approaches and recent progress in photoresist research. He expressed his hope that more outstanding young researchers will join the field of photoresist research and dedicate themselves wholeheartedly to achieving the goal of domesticating photoresist materials.

  Dr. Zhang Wenjia from Shanghai Jiao Tong University delivered a keynote speech on behalf of the research team, titled “Optoelectronic Chips, Polymer Waveguides, and Modules for Next-Generation High-Speed Short-Range Optical Interconnect Systems.” Dr. Zhang argued that with the rapid growth of cloud computing, big data, and the Internet of Things, information interconnection bandwidth is experiencing explosive growth. As a result, traditional electrical interconnect technologies can no longer meet the demands of future high-speed data communication. Therefore, it has become an inevitable trend for optical communication technologies to replace electrical interconnect technologies in short-distance application scenarios. The presentation focused on inter-chip and inter-board interconnect systems in supercomputing and data centers, exploring the challenges and development directions related to short-range optical interconnects in areas such as optoelectronic integrated chips, polymer optical waveguides, and high-speed module technologies.

  Fifteen renowned scholars from both home and abroad delivered compelling invited talks, including Researcher Song Zhitang, Researcher Di Zengfeng, and Researcher Ou Xin from the Shanghai Institute of Microsystem and Information Technology of the Chinese Academy of Sciences; Researcher Niu Zhichuan, Researcher Pan Jiaocheng, and Researcher Li Chuanbo from the Institute of Semiconductors of the Chinese Academy of Sciences; Professor Li Shiwei from the Hong Kong University of Science and Technology; Researcher Li Zhihua and Researcher Luo Jun from the Institute of Microelectronics of the Chinese Academy of Sciences; Professor Hao Xiaotao from Shandong University; Professor Wen Lianggong from Beijing University of Aeronautics and Astronautics; Professor Yu Hongyu from the Southern University of Science and Technology; and Professor Pi Xiaodong from Zhejiang University. In addition, 22 distinguished scholars presented outstanding oral presentations, including Professor Zhang Wei from Xi'an Jiaotong University, Professor Zhao Weiwei from Harbin Institute of Technology, Professor Lu Xubing from South China Normal University, Researcher Li Fengyu from the Institute of Chemistry of the Chinese Academy of Sciences, Professor Chen Lei from Hefei University of Technology, and Professor Gao Jinwei from South China Normal University. Furthermore, several prominent scholars, such as Academician Wang Zhengping from the Chinese University of Hong Kong, Professor Shi Fang from Nanjing University, and Researcher Sun Rong from the Shenzhen Institute of Advanced Technology of the Chinese Academy of Sciences, participated in the discussions at this sub-session.

  This “Session on Advanced Microelectronics and Optoelectronic Materials” featured 4 keynote speeches, 15 invited talks, 22 oral presentations, and 18 poster presentations, with over 80 participants in attendance. Niu Mengsi from Professor Hao Xiaotao’s research group at Shandong University received the Outstanding Poster Award from the Materials Society, while Huang Kai from the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, won the Best Poster Award for this session. Researcher Zhao Chao from the Institute of Microelectronics, Chinese Academy of Sciences, presented the honorary certificates to the winning students on behalf of the session’s organizing committee. The presentations at this conference were exceptionally engaging, and the atmosphere in the venue was vibrant. Attendees actively asked questions, fostering rich exchanges among participants and playing a positive role in enhancing the academic level and technological innovation capabilities in China’s microelectronics and optoelectronic materials fields.

  

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  Researcher Zhao Chao from the Institute of Microelectronics of the Chinese Academy of Sciences delivered the opening remarks for the sub-venue on behalf of Academician Wang Xi.

  

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  Academician Ming Liu from the Institute of Microelectronics of the Chinese Academy of Sciences delivered a keynote speech titled “Development Trends and Challenges in Non-Volatile Memory.”

  

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  Professor Song Haizhi from the University of Electronic Science and Technology gave a presentation titled:

  Keynote Speech: “Semiconductor Optoelectronic Materials—From 3D to 0D, from Classical Applications to Quantum Information”

  

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  Researcher Wei Yiyi from the Institute of Microelectronics of the Chinese Academy of Sciences delivered a keynote speech titled “New Opportunities and Challenges in the Development of Lithography Materials.”

  

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  Dr. Zhang Wenjia from Shanghai Jiao Tong University delivered a presentation titled:

  Keynote Speech: “Optoelectronic Chips, Polymer Waveguides, and Modules for Next-Generation High-Speed Short-Range Optical Interconnect Systems”

  

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  Researcher Song Zhitang from the Shanghai Institute of Microsystem, Chinese Academy of Sciences, delivered an invited talk.

  

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  Professor Li Shiwei from the Hong Kong University of Science and Technology delivered an invited talk.

  

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  Researcher Pan Jiaoqing from the Institute of Semiconductors, Chinese Academy of Sciences, delivered an invited talk.

  

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  Researcher Ou Xin from the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, delivered an invited talk.

  

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  Researcher Niu Zhichuan from the Institute of Semiconductors of the Chinese Academy of Sciences delivered an invited talk.

  

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  Researcher Di Zengfeng from the Shanghai Institute of Microsystem, Chinese Academy of Sciences, delivered an invited talk.

  

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  Professor Hao Xiaotao from Shandong University delivered an invited talk.

  

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  Researcher Li Chuanbo from the Institute of Semiconductors of the Chinese Academy of Sciences delivered an invited talk.

  

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  Researcher Li Zhihua from the Institute of Microelectronics of the Chinese Academy of Sciences delivered an invited talk.

  

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  Researcher Jun Luo from the Institute of Microelectronics of the Chinese Academy of Sciences delivered an invited report.

  

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  Professor Yu Hongyu from the Southern University of Science and Technology delivered an invited talk.

  

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  Professor Wen Lianggong from Beijing University of Aeronautics and Astronautics delivered an invited talk.

  

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  Professor Pi Xiaodong from Zhejiang University delivered an invited talk.

  

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  Niu Mingsi from Shandong University received the Outstanding Wall Exhibition Award at the China Materials Conference.

  

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  Huang Kai from the Shanghai Institute of Microsystem, Chinese Academy of Sciences, received the Best Poster Award at the sub-conference.

  

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  Venue photos

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