The 2017 China Semiconductor Materials and Components Development Conference was grandly held in Beilun, Ningbo.

　　The “2017 China Semiconductor Materials and Components Development Annual Conference” (hereinafter referred to as the “Annual Conference”) was grandly held on October 22-23, 2017, in Beilun District, Ningbo City. Supported by the Overall Group of Special Project 02 and the Integrated Circuit Industry Technology Innovation Strategic Alliance, the conference was organized by the Integrated Circuit Materials and Components Industry Technology Innovation Strategic Alliance and the Supporting Branch of the China Semiconductor Industry Association, and hosted by the People’s Government of Beilun District, Ningbo City. Attending the event were leaders including Ma Junru, Head of the Supervision and Evaluation Expert Panel for the Electronic and Information Sector of the National Major Science and Technology Projects and former Director-General of the State Administration of Foreign Experts Affairs; Qiu Gang, Deputy Director of the Implementation and Management Office of Special Project 02 and Deputy Inspector of the Major Projects Office of the Ministry of Science and Technology; Wang Zhengping, Academician of the U.S. National Academy of Engineering and Foreign Academician of the Chinese Academy of Engineering; Chen Xian, Vice Chairman of the China Semiconductor Industry Association; Shi Ying, Expert of the Overall Group of Special Project 02 and Secretary-General of the Alliance; Yang Shining, General Manager of Wuhan Yangtze Memory Technologies; Zhang Xin, General Manager of SMIC Northern at SMIC International; George Alajajian, Vice President of Applied Materials in the U.S.; Mao Hongfang, Secretary of the Beilun District Committee of Ningbo City; and Hu Kui, Mayor of Beilun District, Ningbo City. The conference was chaired by Dr. Yao Lijun, Chairman of Ningbo Jiangfeng Electronics, and Dr. Wang Shumin, Chairman of Anji Microelectronics. During the conference, the unveiling ceremony of the “Integrated Circuit Materials and Components Alliance (Ningbo) Industry Promotion Center” and the launch ceremony of the “Shengxin Fund”—an industry guidance fund for the integrated circuit materials and components sector—were also held.

　　To accelerate the innovative development of local semiconductor manufacturing materials and component enterprises, foster closer international cooperation, and build a local supply chain that is innovative, open, collaborative, and mutually beneficial, this year’s conference has brought together nearly 300 senior executives from well-known domestic and international semiconductor materials and component companies, integrated circuit manufacturing and packaging firms, and high-end equipment manufacturers, as well as relevant experts and scholars. Together, they engaged in lively discussions and exchanges on topics including the development trends of China’s local supply chain for semiconductor manufacturing materials and components, future technology and market demands, pathways for integrating international cooperation with localization, and preferential policies aimed at promoting technological innovation and industrial development.

　　In his speech, Deputy Director Qiu Gang said that materials and components are at the upstream of integrated circuit manufacturing—and have always been at the forefront of innovation. As the saying goes, “How can the canal be so clear? Because fresh water keeps flowing in from its source.” The innovative efforts in this field will bring even more surprises to the integrated circuit industry and provide the strongest support for the future manifestation of human wisdom. Over the past few years, driven by the country’s long-term, steadfast, and continuous support under major national projects and guided by the Outline for Promoting the Development of the Integrated Circuit Industry, the materials and components sector has made remarkable progress and achieved impressive results. However, there is still a significant gap compared to the world’s leading standards. We hope that, with the vigorous impetus of the Integrated Circuit Materials and Components Alliance, the industry will proactively look toward the future, step up international cooperation from a high starting point, unleash even more robust innovation capabilities, accelerate the enhancement of China’s core competitiveness, and propel the Chinese materials and components industry toward an even brighter tomorrow.

　　Vice Chairman Chen Xian pointed out that, in recent years, driven by a series of national policies, the issuance of the Outline for Promoting the Development of the Integrated Circuit Industry, and the establishment of the National Big Fund, China’s integrated circuit materials industry has achieved remarkable results and is now facing unprecedented opportunities. The integrated circuit market in China—and the industry itself—will surely experience rapid development. Relevant national ministries and commissions are currently conducting an evaluation of the effectiveness of policies aimed at fostering the development of the integrated circuit industry. The central intention behind this assessment is that industrial policies should promptly support key enterprises, key products, and materials and component products to enter large-scale production lines. We hope that materials and component enterprises will strengthen independent innovation and international cooperation, continuously promoting the industrialization of their achievements.

　　Hu Kui, the district mayor of Beilun District in Ningbo, introduced the overall situation of Beilun District and the progress made since the establishment of Xingang Town, which is focusing on developing the integrated circuit materials and components industry. He emphasized that the development of the integrated circuit industry should be strategically positioned at the high end and provide targeted services, with the aspiration of making the integrated circuit industry a new pillar industry for Beilun.

　　Zhang Xin, General Manager of SMIC Northern, introduced the current state of China’s integrated circuit foundry manufacturing industry, the path toward domestic production of materials and equipment, and the challenges it faces. He also proposed specific measures and requirements for industrial chain integration, expressing his hope that the industry will unite in solidarity, work hard, and embrace a new era of development for China’s integrated circuit industry, ultimately achieving “Chips Connect the World.”

　　George Alajajian, Vice President of Applied Materials in the U.S., delivered a keynote speech emphasizing the imperative need to foster the growth of China’s semiconductor industry and the development of its supply chain. His speech primarily introduced Applied Materials, the semiconductor and display markets, as well as the requirements of the semiconductor/display industry chain, and underscored the importance of big data research.

　　Liang Zhizhong, Senior Director at Changdian Technology, introduced the current status and development trends of system-level packaging technology and the market. He analyzed the opportunities and challenges facing packaging materials and expressed his hope that material companies will seize the opportunities presented by the advancement of system-level packaging technology and industry development, thereby achieving substantial growth in the packaging materials sector.

　　John West, President of VLSI Research, analyzed the product structure of global integrated circuit equipment subsystems and key components, as well as the global industrial distribution and development trends. He examined the case of South Korea, where equipment subsystems and key components have achieved breakthrough rapid growth driven by the development of the country's integrated circuit (IC) industry. He also analyzed the development opportunities for China's integrated circuit manufacturing sector and predicted that China's key components and subsystems are poised to enter a period of rapid growth.

　　In her report, Shi Ying, an expert from the Specialized Overall Group and Secretary-General of the Alliance, presented extensive and detailed data demonstrating the rapid development and steady growth of the semiconductor manufacturing materials market. She analyzed emerging trends in industry development and advocated that China’s materials industry should focus on fostering a supply-chain ecosystem characterized by “close collaboration, mutual support, symbiotic win-win outcomes, and coordinated development.” Grounded in independent innovation, the industry should actively seek international cooperation and pioneer a dynamic development model based on “innovation, cooperation, openness, and mutual benefit.” Material companies should not merely serve as suppliers to the integrated circuit manufacturing industry; rather, they should be capable of becoming true partners in the manufacturing process.

　　Director Ma Junru summarized that, under the guidance and promotion of major national special projects, the integrated circuit industry has achieved significant development. Going forward, we must adopt an application-oriented approach and boldly innovate in areas such as technology, market dynamics, and international and domestic cooperation. In particular, we should place great emphasis on cross-sector innovation and recognize the crucial role of big data in enhancing the quality of materials and components. Drawing on the experiences of the United States and South Korea in developing their integrated circuit equipment, materials, and component industries, we should accelerate the advancement of China's integrated circuit materials and component industry.

　　In the afternoon, Bian Yijun, Deputy General Manager of Ningbo Jiangfeng Electronics; Wang Shaobo, Deputy Director of Institute 718 of China Shipbuilding Industry Corporation; Wang Yuchun, General Manager of Anji Microelectronics; Chen Tian'an, General Manager of Yantai Debang; Zhao Lixing, General Manager of Beijing Jingyi Automation; Liu Xianbing, Chairman of Suzhou Kema; Zhang Jiping, Head of Intellectual Property at Hubei Dinglong; and Huang Picheng, Vice President of Pall Corporation in the U.S., each delivered keynote speeches titled: “Win-Win Cooperation and In-depth Development—New Advances in China’s Ultra-High-Purity Metals, Sputtering Targets, and Components”; “The Current Status and Trends in China’s Electronic Gases”; “The Past and Future of Microelectronic Materials—Focusing on CMP Consumables and Cleaning Solutions”; “Industrial Opportunities and Development of Semiconductor Packaging Materials in China”; “New Requirements for Ancillary Equipment Driven by Modern Integrated Circuit Manufacturing Equipment”; “A Study on Patent Layout for CMP Polishing Pads”; and “Defect Control in 14-Nanometer Technology.”

　　Afterward, the participating experts and scholars held a roundtable discussion on two key topics: 1. How to strengthen cooperation among chip manufacturing, advanced packaging, critical equipment and materials, and components to achieve mutual benefits; 2. Recommendations for science and technology and industrial policies aimed at promoting international cooperation, enhancing innovation capabilities, and accelerating the development of local supply chains.

　　At a time when the competent industry authorities are studying future development plans and evaluating policies to promote industry growth, convening this grand event—bringing together the wisdom of Chinese and foreign experts and entrepreneurs—will undoubtedly play a crucial role in charting the future course for the integrated circuit materials and components industry.

　　On the 22nd, the Alliance also held the inaugural meeting of the Alliance Standards Committee, during which three main issues were discussed: first, the discussion, revision, and adoption of draft institutional documents for the Alliance Standards Committee, including the “Standard Development Procedures Document,” the “Organizational Structure Document for Standardization Work,” the “Intellectual Property Management System Document,” and the “Standardization Management Document”; second, the discussion, revision, and adoption of the draft plan for standardization work (or the Standard System Guide) of the Alliance Standards Committee; and third, the discussion on the approval of the 22 project proposals for alliance group standards that the Alliance had solicited from its member units.