The 7th meeting of the 2nd Council of the Materials and Components Alliance was successfully held in Ningbo.

On the afternoon of August 17, 2017, the second seventh meeting of the Board of Directors of the Integrated Circuit Materials and Components Industry Technology Innovation Strategic Alliance (hereinafter referred to as the “Alliance”) was successfully held in Ningbo. More than 180 people attended the meeting, including the Alliance’s Secretary-General, Vice-Chairpersons, Executive Directors, representatives from member units, and representatives from newly applying organizations seeking membership. Secretary-General Shi Ying chaired the meeting and delivered a report summarizing the Alliance’s work progress for the first half of 2017 and outlining plans for the second half of the year. Each specialist working group leader then presented reports on topics such as supplier pre-assessment and the 2017 C-

　　 On the afternoon of August 17, 2017, the second seventh meeting of the Board of Directors of the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials and Components Industry (hereinafter referred to as the “Alliance”) was successfully held in Ningbo. More than 180 people attended the meeting, including the Alliance’s Secretary-General, Vice Chairpersons, Executive Directors, representatives from member units, and representatives from newly applying organizations seeking membership.

Council on-site

Secretary-General Shi Ying chaired the meeting.

Board of Directors voting session venue

　　Secretary-General Shi Ying chaired the meeting and delivered a report summarizing the progress made by the Board of Directors in the first half of 2017 as well as outlining plans for the second half of the year. Each specialist working group provided detailed reports on topics including preliminary supplier assessments, the 2017 C-MRS sub-conference on microelectronics and optoelectronics, progress on the materials and components roadmap, advances in group standardization efforts, the product series promotion plan for the alliance’s website, and the proposed agenda for the Materials and Components Supply Chain Conference. The meeting acknowledged the alliance’s achievements and progress in supporting the work of the Special Project 02 in the materials and components sector, organizing industry and academic exchange activities, launching an enterprise quality improvement initiative, advancing intellectual property research, collecting data and analyzing industry operations, initiating group standardization within the alliance, continuously promoting supply-demand cooperation across the industrial chain, and enhancing the alliance’s public image. The meeting also deliberated and discussed plans for the second half of 2017.

　　The meeting reviewed and unanimously approved the addition of Wang Zhiyue (Chief Expert at China Electronics Technology Group Electronic Equipment Corporation Ltd., expert on the General Expert Panel of Special Project 02) and Huang Picheng (Vice President of U.S.-based PALL Corporation, Chairman of the Technical Committee of the China International Semiconductor Materials Symposium) as experts to the Expert Advisory Committee. It also approved the addition of Li Shaoping from Hubei Xingfu Electronic Materials Co., Ltd. as a member of the Alliance’s Board of Directors, the change of Ni Lihua’s representation on the Board of Directors to Shanghai Huali Microelectronics Co., Ltd., and the change of Wang Su’s representation on the Board of Directors to Shanghai Xinyang Semiconductor Materials Co., Ltd. Furthermore, the composition of the Alliance’s Group Standards Committee was approved. The meeting reviewed and voted to approve the membership applications of 18 companies, including Nanjing San Chao New Materials Co., Ltd., Shanghai Jiaguan Semiconductor Technology Co., Ltd., Xiamen Kehua Hengsheng Co., Ltd., Shanghai Gaosheng Integrated Circuit Equipment Co., Ltd., Lianyungang Huideshi Quartz Glass Co., Ltd., Quzhou Hangyang Gas Co., Ltd., Shanghai Philhua Shichuang Technology Co., Ltd., Shandong Haike Holding Co., Ltd., Ruining High-Tech Materials (Ganzhou) Co., Ltd., Shanghai Feikai Optoelectronic Materials Co., Ltd., Jiangsu Teng’ao Electronic Technology Co., Ltd., Dalian Datte Gas Co., Ltd., Yantai Yinuo Electronic Materials Co., Ltd., Guangdong Leading Rare Materials Co., Ltd., Wuxi Dike Electronic Materials Technology Co., Ltd., Jiangsu Dena Chemical Co., Ltd., Fujian Del Technology Co., Ltd., and Cangzhou Xinlian Chemical Co., Ltd.

　　The delegates engaged in a lively discussion on the work to be carried out in the second half of 2017. They expressed their hope that the alliance would organize a successful conference on semiconductor materials and component supply chains and further enhance coordination and exchanges among government departments, user organizations, and overseas enterprises, thereby fostering greater cooperation. After the meeting, all the delegates participated in the event jointly hosted by the alliance and the Ningbo Municipal People's Government, titled “Major Project Achievements Arrive in Ningbo and the Launch of (Ningbo) Xin Gang Town.”

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