The main factory building of Huaian Dekema Semiconductor has been topped out; Secretary-General Shi Ying attended the ceremony.

On the morning of June 21, the topping-out ceremony for the main plant building and the unveiling ceremony for the Design & R&D Center of Huaian Dekema Semiconductor Co., Ltd. were held in Huaiyin District, marking the project’s entry into a new phase of simultaneous construction and R&D, thus laying a solid foundation for its smooth commissioning and achieving desired results in the next stage. Attending the ceremony were Shi Ying, Secretary-General of the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials and Components Industry; Cai Lixin, Acting Mayor of Huaian City; Gu Kun, Vice Mayor; Xia Shaozeng, Chairman of Huaian Dekema Semiconductor Co., Ltd.; as well as representatives from the construction company and partner enterprises. It is reported that the Huaian Dekema project has a total investment of 15 billion yuan, with the first phase aiming to produce 240,000 12-inch semiconductor wafers annually.

　　On the morning of June 21, the topping-out ceremony for the main plant building and the unveiling ceremony for the Design & R&D Center of Huaian Dekema Semiconductor Co., Ltd. were held in Huaiyin District, marking the project’s entry into a new phase of simultaneous construction and R&D, thus laying a solid foundation for its smooth commissioning and full-scale operation in the next stage. Attending the ceremony were Shi Ying, Secretary-General of the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials and Components Industry; Cai Lixin, Acting Mayor of Huaian City; Gu Kun, Vice Mayor of Huaian City; Xia Shaozeng, Chairman of Huaian Dekema Semiconductor Co., Ltd.; as well as representatives from the construction company and partner enterprises.

　　It is reported that the Huaian Dekema Project has a total investment of 15 billion yuan. The first phase of the project is a 12-inch semiconductor chip wafer fab with an annual production capacity of 240,000 wafers. The project will primarily focus on the design and manufacture of image sensor chips developed through independent R&D. Upon completion, it will fill the gap in China's capability for independent design and manufacturing of sensor chips. In the future, the project will be centered around the Huaian 12-inch wafer fabrication base and implement a development strategy known as "Two Bases, One Institute, and Two Centers," ultimately achieving an IDM industrial layout centered on Huaian, integrating semiconductor CIS manufacturing, design, services, and sales.

　　Xia Shaozeng, head of Deke Ma Semiconductor in Huaian, introduced that China is the world’s largest consumer of chips. Among these, image sensors (CIS) are the only product—aside from CPUs and memory—that boasts annual sales exceeding 10 billion U.S. dollars. Moreover, CIS represents the fastest-growing market over the next five years and is widely used in consumer electronics and industrial electronics fields such as smartphones, smart cars, AR/VR, drones, robots, IoT, security surveillance, and action cameras.

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