01

2017

-

11

Semiconductor Optoelectronic Materials—From 3D to 0D, from Classical Applications to Quantum Information

This work is aimed at next-generation optoelectronic information systems, developing novel preparation technologies for semiconductor optoelectronic functional materials to meet the demands of high speed, integration, and quantization in semiconductor optoelectronic devices. The material preparation employs precision techniques such as molecular beam epitaxy (MBE), metal-organic chemical vapor deposition (MOCVD), and atmospheric-pressure chemical vapor deposition (CVD); device fabrication utilizes standard semiconductor processes and micro- and nano-fabrication technologies. Using MBE, we have prepared high-density 1.3-μm InAs/GaAs quantum-dot materials. Lasers fabricated from these materials achieve a single-layer gain of 7 cm⁻¹ at 1.3 μm and support direct modulation.


  This work is aimed at next-generation optoelectronic information systems, developing novel preparation technologies for semiconductor optoelectronic functional materials to meet the demands of high-speed, integrated, and quantum-based semiconductor optoelectronic devices. The material preparation techniques employed include precision methods such as molecular beam epitaxy (MBE), metal-organic chemical vapor deposition (MOCVD), and atmospheric-pressure chemical vapor deposition (CVD). Device fabrication utilizes standard semiconductor processes and micro- and nano-fabrication technologies. Using MBE, we have prepared high-density 1.3-μm InAs/GaAs quantum-dot materials; lasers fabricated from these materials achieve a single-layer gain of 7 cm⁻¹, direct modulation rates exceeding 40 Gbps, stable output over a temperature range of 10–70℃, and a maximum operating temperature of 200℃. These lasers have already been deployed in fiber-optic communication networks. By combining micro-probe oxidation lithography with atomically hydrogen-assisted MBE or MOCVD, we have fabricated position-controlled quantum-dot arrays with a minimum inter-dot spacing of 50 nm and positioning accuracy of 3 nm, providing a technical solution for integrated single-photon sources used in quantum communications and all-optical quantum computing circuits. Using MOCVD, we have developed 1.3–1.55-μm quantum-dot single-photon sources with single-photon purity reaching the order of 0.001. With these single-photon sources, we have demonstrated quantum key distribution over a 120-km fiber-optic link. Based on a combination of MBE and MOCVD, we have fabricated InGaAs/GaAs/InGaP double-quantum-well lasers that achieve strong single-mode lasing at 1.064 μm with an output power of 500 mW. By leveraging frequency-doubling technology, we have created a continuous-wave 532-nm pure-green laser with an output power of 100 mW, offering an efficient solution for green light sources in laser displays. Using MOCVD, we have prepared InGaAsP/InP avalanche photodetector (APD) materials; APDs fabricated from these materials operate in Geiger mode with a photon detection efficiency exceeding 25% and a dark-count rate below 20 kHz—comparable to international standards. We have also developed a 32×32 single-photon detector array, further advancing the domestic production of single-photon focal-plane detectors. By employing atmospheric-pressure CVD, we have prepared Si-APD epitaxial materials; APD devices fabricated from these materials exhibit a maximum gain of up to 800—the highest reported globally—and a responsivity ranging from 300 to 600 A/W with excellent linearity, making them suitable for applications such as laser 3D imaging radar and laser-guided fuses. In summary, this study has carried out research and development of semiconductor optoelectronic materials, yielding a variety of high-performance materials—from three-dimensional bulk structures to zero-dimensional quantum dots—to meet diverse needs spanning from classical optoelectronic devices to quantum information systems.

Key words:

Related News

undefined

undefined