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Historical Review of the 2020 China Semiconductor Materials Innovation and Development Conference
In recent times, the vigorous development of new information technologies such as 5G applications and artificial intelligence has ushered in new opportunities for integrated circuit technology. However, the global pandemic has brought fresh challenges to the global semiconductor industry chain, and the semiconductor materials sector will also face unprecedented new hurdles. To respond to global technological and market changes, strengthen industrial chain collaboration, enhance supply chain cooperation, bolster enterprise capabilities, and maintain composure amid numerous uncertainties—these have become the overarching trends driving the entire industry toward innovative development. The “2020 China Semiconductor Materials Innovation and Development Conference,” themed on “New Situations, New Challenges, and New Breakthroughs,” will be held from September 14 to 16 in Hefei, China. The conference will bring together entrepreneurs and expert scholars from both China and abroad across fields including integrated circuit manufacturing, packaging and testing, key materials, and equipment manufacturing. Together, they will discuss the new challenges facing the global semiconductor industry under the current circumstances, the emerging trends in the development of the materials industry, and the new demands arising from technological and market shifts. They will explore ways to deepen global industrial chain integration, strengthen local supply chain collaboration, reinforce the overall competitiveness of local materials enterprises, and provide solid support for the sustained development of the semiconductor manufacturing industry. In addition, the conference will also organize special activities focused on industrial chain matchmaking and interaction, as well as dedicated exchanges between government and enterprises.Guiding Units: Implementation and Management Office of Special Project 02, Hefei Municipal People’s Government, China Semiconductor Industry Association, China Integrated Circuit Industry Innovation AllianceOrganizing Units: Overall Expert Group of Special Project 02, Hefei Municipal Development and Reform Commission, Hefei Investment Promotion Bureau, Hefei Xinzhanshi High-tech Industrial Development Zone, China Integrated Circuit Materials Innovation Alliance, Semiconductor Supporting Industries Branch of the China Semiconductor Industry AssociationConference Dates: September 14–16, 2020 (Monday to Wednesday)Conference Venue: Sheraton Hotel Li Gang, Hefei Xinzhanshi (No. 1666 Tongling North Road, Yaohai District, Hefei)Conference Agenda:Date Time EventSeptember 14 (Monday) 10:00–19:00 Registration for Participants13:30–16:00 2020 Annual General Meeting of the Integrated Circuit Materials Industry Technology Innovation Alliance & 3rd Fourth Session of the Board of Directors [Closed Door]18:00–20:00 DinnerSeptember 15 (Tuesday) 09:00–09:30 Opening Ceremony (Moderator: Yao Lijun)09:30–09:45 Industry Signing and Park Promotion09:30 Hefei Key Project Signing09:35 Hefei Investment Environment Promotion09:40 Xinzhanshi High-tech Zone Investment Environment Promotion & Materials Industry Park Launch09:45–12:00 Keynote Reports (Moderator: Wang Shumin)9:45 Tsinghua University – Professor Wei Shaojun, Ph.D. – [Realistically Assessing the Current Trend in IC Industry Development]10:10 Xinsi Research – Chief Analyst Gu Wenjun – [Reflections on the Development of China’s Integrated Circuit Industry under New Circumstances]10:35 Hefei Jinghe Integrated Circuit Co., Ltd. – General Manager Cai Huijia – [Hefei Jinghe Supports Domestic Material Localization]11:00 Yangtze Memory Technologies Co., Ltd. – Chief Operating Officer Cheng Weihua – [Seizing Historical Opportunities to Rapidly Enhance Industrial Capabilities]11:25 Jiangsu Changjiang Electronics Co., Ltd. – CEO Zheng Li – [Advanced Finishing Manufacturing Technology for Integrated Circuits Boosts Innovation in Semiconductor Materials]12:00–13:30 Lunch13:30–14:00 IC Materials Awards Ceremony (Moderator: Shi Ying)14:00–17:00 Invited Reports (Moderator: Xu Congying)1. 14:00 DuPont (China) R&D Management Co., Ltd. – General Manager of Semiconductor Photolithography Technology, China, Dr. Lü Zhijian – [Collaborative Innovation to Promote the Development of the Semiconductor Industry]2. 14:20 Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences – Director of Nanomaterials and Devices Laboratory, Dr. Song Zhitang – [Octahedral Building Blocks and Three-Dimensional Constrained Phase-Change Theory Guide the Design and Development of High-Speed, Low-Power Phase-Change Materials]3. 14:30 Beijing Kehua Microelectronics Materials Co., Ltd. – Chairman Chen Xin – [Opportunities and Challenges for Photoresist Development under New Circumstances]4. 14:50 Youyan Yijin New Materials Co., Ltd. – Senior Technical Director, Dr. Luo Junfeng – [Moving with the Chip: Building World-Class Sputtering Targets]5. 15:10 Hubei Xingfu Electronic Materials Co., Ltd. – Assistant General Manager Cui Huidong – [Phosphorus Chemical Industry Chain and Comprehensive Utilization of Electronic Chemicals and Waste TMAH]6. 15:30 Huahai Chengke New Materials Co., Ltd. – R&D Manager Tan Wei – [High-Thermal-Conductivity (≥3W) Epoxy Molding Compounds]7. 15:50 Suzhou Shengyi Technology Co., Ltd. – Chief Engineer Xiao Shenggao – [Development and Challenges of Domestic IC Packaging Substrate Materials]8. 16:10 Hangzhou Kebite Filtration Equipment Co., Ltd. – Chief Technology Officer Yoshinori Yamada – [Application of Metal Ion Purification Products in Semiconductor Photolithography Chemicals – Nylonpolar]9. 16:30 TECHCETCALLC – Senior Analyst Dr. Dan S. Tracy – [Opportunities and Challenges in the Materials Market]18:00–20:00 Gala DinnerSeptember 16 (Wednesday) 08:30–10:00 Government-Enterprise Exchange and Matchmaking Meeting [Invitation] Jinghe Small-Scale Exchange Meeting08:30–12:00 Supply-Demand Matchmaking Meeting [Closed Door]12:00–13:30 Lunch13:30–17:30 Supply-Demand Matchmaking Meeting [Closed Door]18:00–20:00 DinnerPartners:
Historical Review of the 2019 China Semiconductor Materials Innovation and Development Conference
In 2019, the global semiconductor industry experienced a slowdown in growth. Domestically, the industry faces challenges such as restructuring of the industrial landscape, market iteration, and breakthroughs in technological pathways. The semiconductor materials sector is also entering a critical period of deepened adjustment. How to align with industry demands, strengthen supply-chain collaboration, enhance enterprise competitiveness, and promote the sustained development of the entire industry have become key tasks for the sector. The "China Semiconductor Materials Innovation and Development Conference" will be held in Ningbo, China, from September 10 to 11, 2019. The conference will bring together domestic and international entrepreneurs and experts from integrated circuit manufacturing, packaging and testing, and key materials sectors to discuss how to strengthen international cooperation, accelerate technology upgrades, and foster ecosystem development under the new circumstances. It will also facilitate interaction and matchmaking between upstream and downstream players in the supply chain (Supplier Matchmaking Session) and enable in-depth exchanges between enterprises and local governments (Xin Gang Forum). The guiding bodies of the conference are: the People's Government of Ningbo City, the China Semiconductor Industry Association, and the China Integrated Circuit Industry Technology Innovation Alliance. The organizer of the conference is the Integrated Circuit Materials Industry Technology Innovation Alliance, supported by the Semiconductor Supporting Industries Branch of the China Semiconductor Industry Association. Co-organizers include: the People's Government of Beilun District, Ningbo City, and the Ningbo Electronics Industry Association. Conference dates: September 10–11, 2019. Conference venue: Lijun Hotel, Yingxiu City, Ningbo, No. 1288 Baoshan Road, Beilun District, Ningbo City. Conference agenda: September 10, 09:00–09:30 Opening Ceremony; 09:30–12:00 Keynote Reports: 1. TSMC (Nanjing) Co., Ltd.—Chen Yingjie, Deputy Director of the Micro-Imaging Engineering Department—[“To Do a Good Job, One Must First Sharpen One’s Tools—The Importance of High-Quality Materials for Advanced Integrated Circuit Manufacturing Processes”]; 2. Xinneng (Qingdao) Integrated Circuit Co., Ltd.—Dr. Zhang Rujing, Chairman—[“Historical Opportunities for China’s Semiconductor Materials Supply Chain”]; 3. Hubei Xinqing Technology Semiconductor—Dr. Wang Kai, General Manager—[“Development of Automotive Electronic Components and the Evolution of Semiconductor Materials”]; 4. Shenyang Tuojing Technology Co., Ltd.—Dr. Lü Guangquan, General Manager—[“Synergistic Development of Semiconductor Equipment and Materials and Technological Breakthroughs”]. 13:30–16:00 Invited Reports: 1. TECHCETCALLC—Senior Analyst Dr. Dan S. Tracy—[“Challenges and Opportunities in Emerging Device Material Applications”]; 2. Shanghai Xinsheng Semiconductor Technology Co., Ltd.—Executive Vice President Dr. Fei Lu—[“Large-Scale Domestic Silicon Wafers in China’s Integrated Circuit Supply Chain”]; 3. Zhongjuxin Technology Co., Ltd.—General Manager Chen Gang—[“Reflections on the Development of China’s Fluorine-Containing Electronic Materials Industry”]; 4. Hitachi Chemical Co., Ltd.—Dr. Minoru Nakanaka, Head of the Implementation Center, Information and Communication Business Division—[“Advanced Packaging Driven by Electronic Materials”]; 5. Agilent Technologies (Suzhou) Co., Ltd.—Dr. Qi Wei, Technical Director of the 5G Project—[“5G Millimeter-Wave Packaging Based on Flexible Substrates”]; 6. Hangzhou Kebote Filtration Equipment Co., Ltd.—Partner Khaled Atta—[“Opportunities and Choices for Electronic Materials Packaging Solutions in the Industry”]. September 11, 08:30–12:00 Supply-Demand Matchmaking Session [by invitation]; 09:00–11:30 Xin Gang Salon [by invitation]; 14:00–16:30 Xin Cai Lecture Series [by invitation]; 14:00–17:30 Meeting of the Board of Directors of the Integrated Circuit Materials Industry Technology Alliance [closed-door]; Members’ Meeting of the Semiconductor Supporting Industries Branch of the China Semiconductor Industry Association [closed-door]. Partners:
China’s semiconductor manufacturing industry is currently experiencing a period of rapid growth. As critical components of the semiconductor value chain, materials and parts play an essential, foundational role in driving industrial development. To accelerate innovation and development among local materials and component enterprises, foster closer international cooperation, and build a local supply chain that is innovative, integrated, open, and mutually beneficial, and to bring together the wisdom of Chinese and foreign experts, scholars, and entrepreneurs to jointly chart a course for future development, the “China Semiconductor Materials and Components Innovation and Development Conference” will be held in Ningbo, China, in October 2018. The conference will bring together senior executives from renowned domestic and international semiconductor materials companies, semiconductor component manufacturers, semiconductor fabrication firms, semiconductor packaging and testing companies, semiconductor equipment providers, and manufacturers of specialized testing instruments for semiconductor materials, as well as leading experts and scholars in related fields, to discuss trends in semiconductor manufacturing materials and component technologies, market demand and supply-chain development dynamics, pathways for international cooperation and localization integration, and policies for collaborative innovation across the semiconductor manufacturing value chain. During the conference, there will also be one-on-one matchmaking sessions between materials and component suppliers and high-end semiconductor manufacturing companies.Guiding Organizations: Ningbo Municipal People’s Government, China Semiconductor Industry Association, China Integrated Circuit Industry Technology Innovation Strategic AllianceSupporting Organizations: Ningbo Municipal Commission of Economy and Information Technology, Ningbo Municipal Science and Technology Bureau, Ningbo Municipal Development and Reform CommissionOrganizing Entity: Integrated Circuit Materials and Components Industry Technology Innovation Strategic Alliance, China Semiconductor Industry Association—Supporting Industries BranchCo-organizing Entities: People’s Government of Beilun District, Ningbo City; Ningbo Electronics Industry Association; TECHCET/Critical Materials Council (CMC)Conference Dates: October 29–31, 2018Conference Venue: Yingxiu International Hotel, Beilun District, Ningbo City; No. 1288 Baoshan Road, Beilun District, Ningbo CityConference Schedule:Date Time AgendaOctober 29Before 11:00 a.m. Registration for Participants14:30–17:30 Annual Expanded Meeting of the Alliance Board of Directors [Closed Door]Industry Training Sessions:1. 14:00–16:00 Dr. Dan Tracy, TECHCET/CMC Senior Technical AnalystDr. Ge Guanghan, TECHCET/CMC Senior Technical Analyst2. 16:00–17:00 Dr. Li Weimin, General Manager, Xiamen Jiguang Integrated Circuit Technology Co., Ltd.Dr. Karl Urquhart, R&D Technical Director/Chemical Technology Manager, DFS, USAOctober 3009:00–09:30 Opening Ceremony09:30–10:20 Keynote Speech: Global Market1. 09:30–09:50 Mr. Lei Hongbo, General Manager, Shanghai HuaLi Microelectronics Co., Ltd.2. 09:50–10:10 Dr. Steve Johnston, Director, Global Supply Chain Management and Supplier Technology Development, Intel USA3. 10:10–10:30 Dr. John West, General Manager, VLSI Research Europe10:45–12:004. 10:45–11:05 Dr. Yin Zhiyao, Chairman, Zhongwei Semiconductor Equipment (Shanghai) Co., Ltd.5. 11:05–11:15 Dr. Nic Rossi, Asia-Pacific Supply Chain Operations Head, Lam Research6. 11:15–11:35 Dr. Lin Guanyang, Global R&D and Technical Services Head, Merck Electronic Materials13:30–15:10 Invited Presentations: Materials and Components Sector1. 13:30–13:50 Dr. Chen Tianniu, Global General Manager of Surface Treatment and Cleaning, U.S.-based Huisheng Advanced Technology Co., Ltd. Taiwan Branch2. 13:50–14:10 Dr. Wang Lufeng, Vice President, Jiangsu Nanda Optoelectronic Materials Co., Ltd.3. 14:10–14:30 Dr. Wang Shumin, Chairwoman, Anji Microelectronics (Shanghai) Co., Ltd.4. 14:30–14:50 Mr. Tian Xin, General Manager, Jiangsu Xinhua Semiconductor Materials Technology Co., Ltd.5. 14:50–15:10 Mr. Zhang Yingmin, General Manager, Hangzhou Kebite Filtration Equipment Co., Ltd.15:30–17:30 Invited Presentations: Packaging and Testing Sector6. 15:30–15:50 Dr. Liu Hancheng, Senior Technical Advisor, ASM Pacific Technology7. 15:50–16:10 Mr. Liang Xinfu, Senior Vice President, Jiangsu Changdian Technology Co., Ltd.8. 16:10–16:30 Dr. Hua Fei, Chairwoman, Ningbo Huaxin Electronic Technology Co., Ltd.9. 16:30–16:50 Dr. Chen Tian’an, General Manager, Yantai Debang Technology Co., Ltd.10. 16:50–17:10 Dr. Zhang Yun, Chairwoman, Suzhou Xinhao New Materials Technology Co., Ltd.11. 17:10–17:30 — Integrated Circuit Materials and Components Industry Technology Innovation Strategic Alliance—Secretary-General Shi Ying—[Closing Remarks]October 3109:00–09:10 CMC Opening Address, CMCSeminar Chair—Dean Freeman09:10–10:15 Keynote Speech: Global Perspective1. 09:10–09:45 Mr. Carlos Flores Padilla, Strategic Procurement Manager, ON Semiconductor2. 09:45–10:15 Ms. Lita Shon-Roy, President/CEO, TECHCET/CMC10:30–12:003. 10:30–11:00 Ms. Ma Li, General Manager, Lvling Electronic Materials (Tianjin) Co., Ltd.4. 11:00–11:30 Dr. Huang Picheng, Vice President, Pall Corporation5. 11:30–12:00 Ms. Fu Lin, Senior Market Analyst, Entegris13:30–15:00 Industry Report: Supply Chain – Market1. 13:30–14:00 Ms. Xu Congyi, Senior Manager, Chemical Affairs Department, CIRS, Chen Guanghuan2. 14:00–14:30 Dr. Dan Tracy, Director/Senior Market Analyst, TECHCET/CMC3. 14:30–15:00 Dr. Lü Guangquan, President/CEO, Shenyang Tuojing Technology Co., Ltd.15:30–17:004. 15:15–15:45 Dr. Fu Lin, Senior Market Analyst, VLSI Research5. 15:45–16:15 Mr. Shang Haihan, Director, Yingqiu Semiconductor Technology (Shanghai) Co., Ltd.6.6:15-16:45 TECHCET—Director/Senior Market Analyst Dean Freeman7. 16:45-16:55 Lita Shon-Roy—[Summary Report] November 1, 8:00-12:15 Supplier Coordination Meeting [Closed Door] Partners: Silver: Bronze:
2017 China Semiconductor Materials and Components Development Annual Conference
As an essential component of the semiconductor industry chain, materials and components play a critical foundational role in driving industrial development. Over the past decade or so, thanks to the combined forces of innovation-driven growth and market-led demand, mainland China has begun to establish a nascent supply chain for semiconductor manufacturing materials and components. To accelerate the innovative development of local semiconductor materials and component enterprises, foster closer international cooperation, and build a local supply chain that is innovative, open, collaborative, and mutually beneficial, the Semiconductor Materials and Components Industry Technology Innovation Strategic Alliance and the Supporting Industries Branch of the China Semiconductor Industry Association, with support from the Overall Group of Project 02 and the Integrated Circuit Industry Technology Innovation Strategic Alliance, are hosting the 2017 China Semiconductor Materials and Components Development Annual Conference in Beilun, Ningbo. The conference brings together senior executives from well-known domestic and international semiconductor materials and component companies, integrated circuit manufacturers, integrated circuit packaging firms, high-end equipment manufacturers, as well as relevant experts and scholars, to discuss and exchange ideas on the current state of China’s local semiconductor materials and component supply chain, future technology and market demands, paths for integrating international cooperation with localization, and preferential policies aimed at promoting technological innovation and industrial development. At a time when industry regulators are studying future development plans and evaluating the formulation of industry-specific preferential policies, this gathering of Chinese and foreign experts and entrepreneurs provides an opportunity to pool wisdom and chart a course for future development. Organizer: Semiconductor Materials and Components Industry Technology Innovation Strategic Alliance Supporting Industries Branch of the China Semiconductor Industry Association Co-organizer: People’s Government of Beilun District, Ningbo Address: Hilton Garden Inn Shihua, No. 699 Huangshan Road, Beilun, Ningbo Agenda: Date & Time Content October 22 (Sunday) Before 3:00 p.m. Registration 1:30 p.m.–3:30 p.m. Founding General Assembly of the Alliance Standards Committee 3:45 p.m.–5:30 p.m. Visit to Beilun’s Industrial Investment Environment 5:30 p.m.–6:20 p.m. Buffet Dinner October 23 (Monday) 9:00 a.m.–9:30 a.m. Opening Ceremony [Moderator: Yao Lijun] 1. Welcome Speech by Hu Kui, District Mayor of Beilun District Government 2. Speech by Chen Xian, Vice Chairman of the China Semiconductor Industry Association 3. Speech by Mr. Ma Junru, Head of the Supervision and Evaluation Expert Panel for the Electronic and Information Sector of the National Key Science and Technology Major Projects and Former Director-General of the State Administration of Foreign Experts Affairs 4. Speech by Director Qiu Gang, Deputy Director of the National Project 02 Office and Deputy Inspector of the National Key Science and Technology Major Projects Office 9:30 a.m.–11:30 a.m. Keynote Reports [Moderator: Wang Shumin] 1. Zhang Xin, General Manager of SMIC Northern Region, SMIC International: “Unite as One Chip, Embrace a New Era of China’s Integrated Circuit Industry Development” 2. George Alajajian, Vice President of Applied Materials (AMAT), USA: “Enabling China’s Semiconductor Growth: A Supply Chain Perspective” 3. Liang Zhizhong, Senior Director of Changjiang Electronics: “The Market and Applications of System-in-Package (SiP)” 4. John West, VLSI Research: “Semiconductor Manufacturing Supply Chain—Market Overview” 5. Shi Ying, Secretary-General of the Materials Alliance: “China’s Rapidly Growing Semiconductor Manufacturing Materials Industry” 11:30 a.m.–12:00 p.m. Opening Ceremony [Moderator: Wang Shumin] 1. Inauguration Ceremony of the Semiconductor Materials and Components Alliance (Ningbo) Industry Promotion Center 2. Launching Ceremony of Shengxin Fund 12:00 p.m.–1:00 p.m. Lunch (Buffet) 1:00 p.m.–3:00 p.m. Invited Reports [Moderator: Shi Ying] 1. Bian Yijun, Deputy General Manager of Jiangfeng Electronics: “Win-Win Cooperation and Deepened Development—New Progress in China’s Ultra-High Purity Metals, Sputtering Targets, and Components” 2. Wang Yuchun, Deputy General Manager of Anji Microelectronics: “From Past to Future: The Evolution of Microelectronic Materials” 3. Wang Shaobo, Deputy Director of the 718th Institute of CSSC: “Current Status and Development Trends of China’s Electronic Gases” 4. Chen Tian’an, General Manager of Debang Technology: “Industrial Opportunities and Development Potential of China’s Semiconductor Electronic Materials” 5. Zhao Lixing, President of Beijing Jingyi: “New Demands of Modern Integrated Circuit Equipment on Ancillary Devices” 6. Liu Xianbing, President of Suzhou Kema: “Applications and Prospects of Advanced Structural Ceramic Materials, Components, and Technologies in High-End Equipment Fields such as Pan-Semiconductors” 7. Dr. Zhang Jiping, Hubei Dinglong: “Research on Patent Layout of CMP Polishing Pads” 8. Huang Picheng, Vice President of Pall Corporation, USA: “Control of 14nm Process Defects and Improvement of Yield Rates” 3:30 p.m.–5:30 p.m. Roundtable Discussion [Moderator: Shi Ying] Topic 1: Strengthening Cooperation among Chip Manufacturers, Advanced Packaging Companies, Key Equipment Providers, and Materials & Component Enterprises to Achieve Win-Win Outcomes Topic 2: Promoting International Cooperation, Enhancing Innovation Capacity, and Accelerating Local Supply Chain Development through Science and Technology and Industrial Policies 6:30 p.m.–8:00 p.m. Reception Dinner October 24 (Tuesday) Morning Departure
On December 16, 2020, the Standards Committee of the Integrated Circuit Materials Industry Technology Innovation Alliance (hereinafter referred to as “ICMtia”) held a review meeting for group standards in Ningbo.
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