Good News | Dinghui Microelectronics Receives Another Prestigious Award!

On March 20, the 2021 Integrated Circuit Industry Chain Collaborative Innovation and Development Exchange Conference, organized by the China Integrated Circuit Innovation Alliance, was held simultaneously in Beijing and Shanghai. The conference featured discussions on the current status and future prospects of the integrated circuit industry, as well as recommendations on relevant industrial policies.

To further encourage technological innovation in the integrated circuit industry, guide and strengthen collaboration across the industrial chain, and promote the commercialization of innovative achievements, the China Integrated Circuit Innovation Alliance has announced the winners of the 4th “IC Innovation Awards.” The awards recognize organizations that have achieved outstanding results in technological innovation within the integrated circuit industry, the advancement of commercialization of research outcomes, and industrial chain cooperation, as well as individuals who have made significant contributions. Hubei Dinghui Microelectronics Materials Co., Ltd.’s project, “Polishing Pad for CMP Oxide on 12-Inch Wafers for Integrated Circuits,” has won the “Technological Innovation Award.”

Hubei Dinghui Microelectronics Materials Co., Ltd. is a wholly-owned subsidiary of Hubei Dinglong Holding Co., Ltd. (stock code: 300054). Over the years, through technological R&D and innovation, the company has mastered CMP polishing pads for integrated circuit chips and core process technologies that are protected by independent intellectual property rights.

Currently, Hubei Dinghui Microelectronics Materials Co., Ltd., as a domestic supplier of CMP polishing pads covering the entire manufacturing process, operates a 12-inch wafer CMP evaluation laboratory. The company also holds the status of a key supplier for four core CMP global planarization process material systems and is capable of providing customized products for advanced manufacturing processes. With mature and advanced manufacturing capabilities, the company has achieved industrial-scale production of a full range of polishing pads, and its products are now being supplied in large volumes and with stable quality to integrated circuit enterprises producing both 8-inch and 12-inch wafers.

The fact that our company’s CMP project has stood out and made the list in the national integrated circuit industry demonstrates Hubei Dinghui Microelectronics’ comprehensive strength in this sector. Dinghui Microelectronics has also undertaken the R&D of CMP polishing pads for the 20-14nm technology node under the nation’s “02 Special Project,” achieving high-level breakthroughs in the development of key materials and advanced processes, thereby laying a solid foundation for China’s integrated circuit industry to achieve independent development.

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