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Historical Review of the 2020 China Semiconductor Materials Innovation and Development Conference

In recent times, the vigorous development of new information technologies such as 5G applications and artificial intelligence has ushered in new opportunities for integrated circuit technology. However, the global pandemic has brought fresh challenges to the global semiconductor industry chain, and the semiconductor materials sector will also face unprecedented new hurdles. To respond to global technological and market changes, strengthen industrial chain collaboration, enhance supply chain cooperation, bolster enterprise capabilities, and maintain composure amid numerous uncertainties—these have become the overarching trends driving the entire industry toward innovative development. The “2020 China Semiconductor Materials Innovation and Development Conference,” themed on “New Situations, New Challenges, and New Breakthroughs,” will be held from September 14 to 16 in Hefei, China. The conference will bring together entrepreneurs and expert scholars from both China and abroad across fields including integrated circuit manufacturing, packaging and testing, key materials, and equipment manufacturing. Together, they will discuss the new challenges facing the global semiconductor industry under the current circumstances, the emerging trends in the development of the materials industry, and the new demands arising from technological and market shifts. They will explore ways to deepen global industrial chain integration, strengthen local supply chain collaboration, reinforce the overall competitiveness of local materials enterprises, and provide solid support for the sustained development of the semiconductor manufacturing industry. In addition, the conference will also organize special activities focused on industrial chain matchmaking and interaction, as well as dedicated exchanges between government and enterprises.Guiding Units: Implementation and Management Office of Special Project 02, Hefei Municipal People’s Government, China Semiconductor Industry Association, China Integrated Circuit Industry Innovation AllianceOrganizing Units: Overall Expert Group of Special Project 02, Hefei Municipal Development and Reform Commission, Hefei Investment Promotion Bureau, Hefei Xinzhanshi High-tech Industrial Development Zone, China Integrated Circuit Materials Innovation Alliance, Semiconductor Supporting Industries Branch of the China Semiconductor Industry AssociationConference Dates: September 14–16, 2020 (Monday to Wednesday)Conference Venue: Sheraton Hotel Li Gang, Hefei Xinzhanshi (No. 1666 Tongling North Road, Yaohai District, Hefei)Conference Agenda:Date Time EventSeptember 14 (Monday) 10:00–19:00 Registration for Participants13:30–16:00 2020 Annual General Meeting of the Integrated Circuit Materials Industry Technology Innovation Alliance & 3rd Fourth Session of the Board of Directors [Closed Door]18:00–20:00 DinnerSeptember 15 (Tuesday) 09:00–09:30 Opening Ceremony (Moderator: Yao Lijun)09:30–09:45 Industry Signing and Park Promotion09:30 Hefei Key Project Signing09:35 Hefei Investment Environment Promotion09:40 Xinzhanshi High-tech Zone Investment Environment Promotion & Materials Industry Park Launch09:45–12:00 Keynote Reports (Moderator: Wang Shumin)9:45 Tsinghua University – Professor Wei Shaojun, Ph.D. – [Realistically Assessing the Current Trend in IC Industry Development]10:10 Xinsi Research – Chief Analyst Gu Wenjun – [Reflections on the Development of China’s Integrated Circuit Industry under New Circumstances]10:35 Hefei Jinghe Integrated Circuit Co., Ltd. – General Manager Cai Huijia – [Hefei Jinghe Supports Domestic Material Localization]11:00 Yangtze Memory Technologies Co., Ltd. – Chief Operating Officer Cheng Weihua – [Seizing Historical Opportunities to Rapidly Enhance Industrial Capabilities]11:25 Jiangsu Changjiang Electronics Co., Ltd. – CEO Zheng Li – [Advanced Finishing Manufacturing Technology for Integrated Circuits Boosts Innovation in Semiconductor Materials]12:00–13:30 Lunch13:30–14:00 IC Materials Awards Ceremony (Moderator: Shi Ying)14:00–17:00 Invited Reports (Moderator: Xu Congying)1. 14:00 DuPont (China) R&D Management Co., Ltd. – General Manager of Semiconductor Photolithography Technology, China, Dr. Lü Zhijian – [Collaborative Innovation to Promote the Development of the Semiconductor Industry]2. 14:20 Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences – Director of Nanomaterials and Devices Laboratory, Dr. Song Zhitang – [Octahedral Building Blocks and Three-Dimensional Constrained Phase-Change Theory Guide the Design and Development of High-Speed, Low-Power Phase-Change Materials]3. 14:30 Beijing Kehua Microelectronics Materials Co., Ltd. – Chairman Chen Xin – [Opportunities and Challenges for Photoresist Development under New Circumstances]4. 14:50 Youyan Yijin New Materials Co., Ltd. – Senior Technical Director, Dr. Luo Junfeng – [Moving with the Chip: Building World-Class Sputtering Targets]5. 15:10 Hubei Xingfu Electronic Materials Co., Ltd. – Assistant General Manager Cui Huidong – [Phosphorus Chemical Industry Chain and Comprehensive Utilization of Electronic Chemicals and Waste TMAH]6. 15:30 Huahai Chengke New Materials Co., Ltd. – R&D Manager Tan Wei – [High-Thermal-Conductivity (≥3W) Epoxy Molding Compounds]7. 15:50 Suzhou Shengyi Technology Co., Ltd. – Chief Engineer Xiao Shenggao – [Development and Challenges of Domestic IC Packaging Substrate Materials]8. 16:10 Hangzhou Kebite Filtration Equipment Co., Ltd. – Chief Technology Officer Yoshinori Yamada – [Application of Metal Ion Purification Products in Semiconductor Photolithography Chemicals – Nylonpolar]9. 16:30 TECHCETCALLC – Senior Analyst Dr. Dan S. Tracy – [Opportunities and Challenges in the Materials Market]18:00–20:00 Gala DinnerSeptember 16 (Wednesday) 08:30–10:00 Government-Enterprise Exchange and Matchmaking Meeting [Invitation] Jinghe Small-Scale Exchange Meeting08:30–12:00 Supply-Demand Matchmaking Meeting [Closed Door]12:00–13:30 Lunch13:30–17:30 Supply-Demand Matchmaking Meeting [Closed Door]18:00–20:00 DinnerPartners: