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Historical Review of the 2018 China Semiconductor Materials and Components Innovation & Development Conference

China’s semiconductor manufacturing industry is currently experiencing a period of rapid growth. As critical components of the semiconductor value chain, materials and parts play an essential, foundational role in driving industrial development. To accelerate innovation and development among local materials and component enterprises, foster closer international cooperation, and build a local supply chain that is innovative, integrated, open, and mutually beneficial, and to bring together the wisdom of Chinese and foreign experts, scholars, and entrepreneurs to jointly chart a course for future development, the “China Semiconductor Materials and Components Innovation and Development Conference” will be held in Ningbo, China, in October 2018. The conference will bring together senior executives from renowned domestic and international semiconductor materials companies, semiconductor component manufacturers, semiconductor fabrication firms, semiconductor packaging and testing companies, semiconductor equipment providers, and manufacturers of specialized testing instruments for semiconductor materials, as well as leading experts and scholars in related fields, to discuss trends in semiconductor manufacturing materials and component technologies, market demand and supply-chain development dynamics, pathways for international cooperation and localization integration, and policies for collaborative innovation across the semiconductor manufacturing value chain. During the conference, there will also be one-on-one matchmaking sessions between materials and component suppliers and high-end semiconductor manufacturing companies.Guiding Organizations: Ningbo Municipal People’s Government, China Semiconductor Industry Association, China Integrated Circuit Industry Technology Innovation Strategic AllianceSupporting Organizations: Ningbo Municipal Commission of Economy and Information Technology, Ningbo Municipal Science and Technology Bureau, Ningbo Municipal Development and Reform CommissionOrganizing Entity: Integrated Circuit Materials and Components Industry Technology Innovation Strategic Alliance, China Semiconductor Industry Association—Supporting Industries BranchCo-organizing Entities: People’s Government of Beilun District, Ningbo City; Ningbo Electronics Industry Association; TECHCET/Critical Materials Council (CMC)Conference Dates: October 29–31, 2018Conference Venue: Yingxiu International Hotel, Beilun District, Ningbo City; No. 1288 Baoshan Road, Beilun District, Ningbo CityConference Schedule:Date Time AgendaOctober 29Before 11:00 a.m. Registration for Participants14:30–17:30 Annual Expanded Meeting of the Alliance Board of Directors [Closed Door]Industry Training Sessions:1. 14:00–16:00 Dr. Dan Tracy, TECHCET/CMC Senior Technical AnalystDr. Ge Guanghan, TECHCET/CMC Senior Technical Analyst2. 16:00–17:00 Dr. Li Weimin, General Manager, Xiamen Jiguang Integrated Circuit Technology Co., Ltd.Dr. Karl Urquhart, R&D Technical Director/Chemical Technology Manager, DFS, USAOctober 3009:00–09:30 Opening Ceremony09:30–10:20 Keynote Speech: Global Market1. 09:30–09:50 Mr. Lei Hongbo, General Manager, Shanghai HuaLi Microelectronics Co., Ltd.2. 09:50–10:10 Dr. Steve Johnston, Director, Global Supply Chain Management and Supplier Technology Development, Intel USA3. 10:10–10:30 Dr. John West, General Manager, VLSI Research Europe10:45–12:004. 10:45–11:05 Dr. Yin Zhiyao, Chairman, Zhongwei Semiconductor Equipment (Shanghai) Co., Ltd.5. 11:05–11:15 Dr. Nic Rossi, Asia-Pacific Supply Chain Operations Head, Lam Research6. 11:15–11:35 Dr. Lin Guanyang, Global R&D and Technical Services Head, Merck Electronic Materials13:30–15:10 Invited Presentations: Materials and Components Sector1. 13:30–13:50 Dr. Chen Tianniu, Global General Manager of Surface Treatment and Cleaning, U.S.-based Huisheng Advanced Technology Co., Ltd. Taiwan Branch2. 13:50–14:10 Dr. Wang Lufeng, Vice President, Jiangsu Nanda Optoelectronic Materials Co., Ltd.3. 14:10–14:30 Dr. Wang Shumin, Chairwoman, Anji Microelectronics (Shanghai) Co., Ltd.4. 14:30–14:50 Mr. Tian Xin, General Manager, Jiangsu Xinhua Semiconductor Materials Technology Co., Ltd.5. 14:50–15:10 Mr. Zhang Yingmin, General Manager, Hangzhou Kebite Filtration Equipment Co., Ltd.15:30–17:30 Invited Presentations: Packaging and Testing Sector6. 15:30–15:50 Dr. Liu Hancheng, Senior Technical Advisor, ASM Pacific Technology7. 15:50–16:10 Mr. Liang Xinfu, Senior Vice President, Jiangsu Changdian Technology Co., Ltd.8. 16:10–16:30 Dr. Hua Fei, Chairwoman, Ningbo Huaxin Electronic Technology Co., Ltd.9. 16:30–16:50 Dr. Chen Tian’an, General Manager, Yantai Debang Technology Co., Ltd.10. 16:50–17:10 Dr. Zhang Yun, Chairwoman, Suzhou Xinhao New Materials Technology Co., Ltd.11. 17:10–17:30 — Integrated Circuit Materials and Components Industry Technology Innovation Strategic Alliance—Secretary-General Shi Ying—[Closing Remarks]October 3109:00–09:10 CMC Opening Address, CMCSeminar Chair—Dean Freeman09:10–10:15 Keynote Speech: Global Perspective1. 09:10–09:45 Mr. Carlos Flores Padilla, Strategic Procurement Manager, ON Semiconductor2. 09:45–10:15 Ms. Lita Shon-Roy, President/CEO, TECHCET/CMC10:30–12:003. 10:30–11:00 Ms. Ma Li, General Manager, Lvling Electronic Materials (Tianjin) Co., Ltd.4. 11:00–11:30 Dr. Huang Picheng, Vice President, Pall Corporation5. 11:30–12:00 Ms. Fu Lin, Senior Market Analyst, Entegris13:30–15:00 Industry Report: Supply Chain – Market1. 13:30–14:00 Ms. Xu Congyi, Senior Manager, Chemical Affairs Department, CIRS, Chen Guanghuan2. 14:00–14:30 Dr. Dan Tracy, Director/Senior Market Analyst, TECHCET/CMC3. 14:30–15:00 Dr. Lü Guangquan, President/CEO, Shenyang Tuojing Technology Co., Ltd.15:30–17:004. 15:15–15:45 Dr. Fu Lin, Senior Market Analyst, VLSI Research5. 15:45–16:15 Mr. Shang Haihan, Director, Yingqiu Semiconductor Technology (Shanghai) Co., Ltd.6.6:15-16:45 TECHCET—Director/Senior Market Analyst Dean Freeman7. 16:45-16:55 Lita Shon-Roy—[Summary Report] November 1, 8:00-12:15 Supplier Coordination Meeting [Closed Door] Partners: Silver: Bronze: