18

2017 China Semiconductor Materials and Components Development Annual Conference

As an essential component of the semiconductor industry chain, materials and components play a critical foundational role in driving industrial development. Over the past decade or so, thanks to the combined forces of innovation-driven growth and market-led demand, mainland China has begun to establish a nascent supply chain for semiconductor manufacturing materials and components. To accelerate the innovative development of local semiconductor materials and component enterprises, foster closer international cooperation, and build a local supply chain that is innovative, open, collaborative, and mutually beneficial, the Semiconductor Materials and Components Industry Technology Innovation Strategic Alliance and the Supporting Industries Branch of the China Semiconductor Industry Association, with support from the Overall Group of Project 02 and the Integrated Circuit Industry Technology Innovation Strategic Alliance, are hosting the 2017 China Semiconductor Materials and Components Development Annual Conference in Beilun, Ningbo. The conference brings together senior executives from well-known domestic and international semiconductor materials and component companies, integrated circuit manufacturers, integrated circuit packaging firms, high-end equipment manufacturers, as well as relevant experts and scholars, to discuss and exchange ideas on the current state of China’s local semiconductor materials and component supply chain, future technology and market demands, paths for integrating international cooperation with localization, and preferential policies aimed at promoting technological innovation and industrial development. At a time when industry regulators are studying future development plans and evaluating the formulation of industry-specific preferential policies, this gathering of Chinese and foreign experts and entrepreneurs provides an opportunity to pool wisdom and chart a course for future development. Organizer: Semiconductor Materials and Components Industry Technology Innovation Strategic Alliance Supporting Industries Branch of the China Semiconductor Industry Association Co-organizer: People’s Government of Beilun District, Ningbo Address: Hilton Garden Inn Shihua, No. 699 Huangshan Road, Beilun, Ningbo Agenda: Date & Time Content October 22 (Sunday) Before 3:00 p.m. Registration 1:30 p.m.–3:30 p.m. Founding General Assembly of the Alliance Standards Committee 3:45 p.m.–5:30 p.m. Visit to Beilun’s Industrial Investment Environment 5:30 p.m.–6:20 p.m. Buffet Dinner October 23 (Monday) 9:00 a.m.–9:30 a.m. Opening Ceremony [Moderator: Yao Lijun] 1. Welcome Speech by Hu Kui, District Mayor of Beilun District Government 2. Speech by Chen Xian, Vice Chairman of the China Semiconductor Industry Association 3. Speech by Mr. Ma Junru, Head of the Supervision and Evaluation Expert Panel for the Electronic and Information Sector of the National Key Science and Technology Major Projects and Former Director-General of the State Administration of Foreign Experts Affairs 4. Speech by Director Qiu Gang, Deputy Director of the National Project 02 Office and Deputy Inspector of the National Key Science and Technology Major Projects Office 9:30 a.m.–11:30 a.m. Keynote Reports [Moderator: Wang Shumin] 1. Zhang Xin, General Manager of SMIC Northern Region, SMIC International: “Unite as One Chip, Embrace a New Era of China’s Integrated Circuit Industry Development” 2. George Alajajian, Vice President of Applied Materials (AMAT), USA: “Enabling China’s Semiconductor Growth: A Supply Chain Perspective” 3. Liang Zhizhong, Senior Director of Changjiang Electronics: “The Market and Applications of System-in-Package (SiP)” 4. John West, VLSI Research: “Semiconductor Manufacturing Supply Chain—Market Overview” 5. Shi Ying, Secretary-General of the Materials Alliance: “China’s Rapidly Growing Semiconductor Manufacturing Materials Industry” 11:30 a.m.–12:00 p.m. Opening Ceremony [Moderator: Wang Shumin] 1. Inauguration Ceremony of the Semiconductor Materials and Components Alliance (Ningbo) Industry Promotion Center 2. Launching Ceremony of Shengxin Fund 12:00 p.m.–1:00 p.m. Lunch (Buffet) 1:00 p.m.–3:00 p.m. Invited Reports [Moderator: Shi Ying] 1. Bian Yijun, Deputy General Manager of Jiangfeng Electronics: “Win-Win Cooperation and Deepened Development—New Progress in China’s Ultra-High Purity Metals, Sputtering Targets, and Components” 2. Wang Yuchun, Deputy General Manager of Anji Microelectronics: “From Past to Future: The Evolution of Microelectronic Materials” 3. Wang Shaobo, Deputy Director of the 718th Institute of CSSC: “Current Status and Development Trends of China’s Electronic Gases” 4. Chen Tian’an, General Manager of Debang Technology: “Industrial Opportunities and Development Potential of China’s Semiconductor Electronic Materials” 5. Zhao Lixing, President of Beijing Jingyi: “New Demands of Modern Integrated Circuit Equipment on Ancillary Devices” 6. Liu Xianbing, President of Suzhou Kema: “Applications and Prospects of Advanced Structural Ceramic Materials, Components, and Technologies in High-End Equipment Fields such as Pan-Semiconductors” 7. Dr. Zhang Jiping, Hubei Dinglong: “Research on Patent Layout of CMP Polishing Pads” 8. Huang Picheng, Vice President of Pall Corporation, USA: “Control of 14nm Process Defects and Improvement of Yield Rates” 3:30 p.m.–5:30 p.m. Roundtable Discussion [Moderator: Shi Ying] Topic 1: Strengthening Cooperation among Chip Manufacturers, Advanced Packaging Companies, Key Equipment Providers, and Materials & Component Enterprises to Achieve Win-Win Outcomes Topic 2: Promoting International Cooperation, Enhancing Innovation Capacity, and Accelerating Local Supply Chain Development through Science and Technology and Industrial Policies 6:30 p.m.–8:00 p.m. Reception Dinner October 24 (Tuesday) Morning Departure