Historical Review of the 2019 China Semiconductor Materials Innovation and Development Conference

In 2019, the global semiconductor industry experienced a slowdown in growth. Domestically, the industry faces challenges such as restructuring of the industrial landscape, market iteration, and breakthroughs in technological pathways. The semiconductor materials sector is also entering a critical period of deepened adjustment. How to align with industry demands, strengthen supply-chain collaboration, enhance enterprise competitiveness, and promote the sustained development of the entire industry have become key tasks for the sector. The "China Semiconductor Materials Innovation and Development Conference" will be held in Ningbo, China, from September 10 to 11, 2019. The conference will bring together domestic and international entrepreneurs and experts from integrated circuit manufacturing, packaging and testing, and key materials sectors to discuss how to strengthen international cooperation, accelerate technology upgrades, and foster ecosystem development under the new circumstances. It will also facilitate interaction and matchmaking between upstream and downstream players in the supply chain (Supplier Matchmaking Session) and enable in-depth exchanges between enterprises and local governments (Xin Gang Forum). The guiding bodies of the conference are: the People's Government of Ningbo City, the China Semiconductor Industry Association, and the China Integrated Circuit Industry Technology Innovation Alliance. The organizer of the conference is the Integrated Circuit Materials Industry Technology Innovation Alliance, supported by the Semiconductor Supporting Industries Branch of the China Semiconductor Industry Association. Co-organizers include: the People's Government of Beilun District, Ningbo City, and the Ningbo Electronics Industry Association. Conference dates: September 10–11, 2019. Conference venue: Lijun Hotel, Yingxiu City, Ningbo, No. 1288 Baoshan Road, Beilun District, Ningbo City. Conference agenda: September 10, 09:00–09:30 Opening Ceremony; 09:30–12:00 Keynote Reports: 1. TSMC (Nanjing) Co., Ltd.—Chen Yingjie, Deputy Director of the Micro-Imaging Engineering Department—[“To Do a Good Job, One Must First Sharpen One’s Tools—The Importance of High-Quality Materials for Advanced Integrated Circuit Manufacturing Processes”]; 2. Xinneng (Qingdao) Integrated Circuit Co., Ltd.—Dr. Zhang Rujing, Chairman—[“Historical Opportunities for China’s Semiconductor Materials Supply Chain”]; 3. Hubei Xinqing Technology Semiconductor—Dr. Wang Kai, General Manager—[“Development of Automotive Electronic Components and the Evolution of Semiconductor Materials”]; 4. Shenyang Tuojing Technology Co., Ltd.—Dr. Lü Guangquan, General Manager—[“Synergistic Development of Semiconductor Equipment and Materials and Technological Breakthroughs”]. 13:30–16:00 Invited Reports: 1. TECHCETCALLC—Senior Analyst Dr. Dan S. Tracy—[“Challenges and Opportunities in Emerging Device Material Applications”]; 2. Shanghai Xinsheng Semiconductor Technology Co., Ltd.—Executive Vice President Dr. Fei Lu—[“Large-Scale Domestic Silicon Wafers in China’s Integrated Circuit Supply Chain”]; 3. Zhongjuxin Technology Co., Ltd.—General Manager Chen Gang—[“Reflections on the Development of China’s Fluorine-Containing Electronic Materials Industry”]; 4. Hitachi Chemical Co., Ltd.—Dr. Minoru Nakanaka, Head of the Implementation Center, Information and Communication Business Division—[“Advanced Packaging Driven by Electronic Materials”]; 5. Agilent Technologies (Suzhou) Co., Ltd.—Dr. Qi Wei, Technical Director of the 5G Project—[“5G Millimeter-Wave Packaging Based on Flexible Substrates”]; 6. Hangzhou Kebote Filtration Equipment Co., Ltd.—Partner Khaled Atta—[“Opportunities and Choices for Electronic Materials Packaging Solutions in the Industry”]. September 11, 08:30–12:00 Supply-Demand Matchmaking Session [by invitation]; 09:00–11:30 Xin Gang Salon [by invitation]; 14:00–16:30 Xin Cai Lecture Series [by invitation]; 14:00–17:30 Meeting of the Board of Directors of the Integrated Circuit Materials Industry Technology Alliance [closed-door]; Members’ Meeting of the Semiconductor Supporting Industries Branch of the China Semiconductor Industry Association [closed-door]. Partners:

In 2019, the global semiconductor industry experienced a slowdown in growth. Domestically, the industry faced challenges such as restructuring of the industry landscape, market iteration, and breakthroughs in technological pathways. The semiconductor materials sector is also entering a critical period of deepened adjustment. How to align with industry demands, strengthen supply-chain collaboration, enhance enterprise competitiveness, and promote the sustained development of the entire industry have become key tasks for the sector. The "China Semiconductor Materials Innovation and Development Conference" was held in Ningbo, China, from September 10 to 11, 2019.

The “China Semiconductor Materials Innovation and Development Conference” brought together over 470 participants, including entrepreneurs and expert scholars from both China and abroad, representing sectors such as integrated circuit manufacturing, packaging and testing, and key materials. The conference explored how to strengthen international cooperation, accelerate technological upgrades, and promote ecosystem development under the new circumstances. Additionally, it facilitated interactive matchmaking activities across the upstream and downstream segments of the industry chain (supplier matchmaking sessions) and in-depth exchanges between enterprises and local governments (Xin Gang Forum).

Conference guiding body: Ningbo Municipal People's Government China Semiconductor Industry Association China Integrated Circuit Industry Technology Innovation Alliance

Conference Organizer: Integrated Circuit Materials Industry Technology Innovation Alliance, Supporting Industries Branch of the China Semiconductor Industry Association

Co-organizers of the conference: People's Government of Beilun District, Ningbo City Ningbo Electronic Industry Association

Meeting time: September 10–11, 2019

Meeting location: Ningbo Yingxiu City Lijun Hotel, No. 1288 Baoshan Road, Beilun District, Ningbo City

Meeting Agenda:

September 10

09:00-09:30 Opening Ceremony

09:30-12:00 Keynote Speech

1. TSMC (Nanjing) Co., Ltd. – Deputy Director of the Micro-Imaging Engineering Department, Chen Yingjie – “To do a good job, one must first sharpen one’s tools—The importance of high-quality materials for advanced integrated circuit manufacturing processes.”

2. Xin’en (Qingdao) Integrated Circuit Co., Ltd. – Chairman, Dr. Zhang Rujing – [Historical Opportunities in China’s Semiconductor Materials Industry Chain]

3. Dr. Wang Kai, General Manager of Hubei Xinqing Technology Semiconductor – [Development of Automotive Electronic Components and the Evolution of Semiconductor Materials]

4. Shenyang Tuojing Technology Co., Ltd. – General Manager, Dr. Lü Guangquan – [Synergistic Development and Technological Breakthroughs in Semiconductor Equipment and Materials]

13:30-16:00 Invited Talk

1. TECHCET CA LLC – Senior Analyst Dr. Dan S. Tracy – [Challenges and Opportunities in Emerging Device Material Applications]

2. Shanghai Xinsheng Semiconductor Technology Co., Ltd. – Executive Vice President, Dr. Fei Lu – [Domestic Large-Diameter Silicon Wafers in China’s Integrated Circuit Industry Chain]

3. Zhongjuxin Technology Co., Ltd. – General Manager Chen Gang – [Reflections on the Development of China’s Fluorine-Containing Electronic Materials Industry]

4. Dr. Toshiaki Nonaka, Director of the Assembly Center, Information and Communications Business Division, Hitachi Chemical Co., Ltd.—[Advanced Packaging Driven by Electronic Materials]

5. Angelic Electronics Technology (Suzhou) Co., Ltd. – Dr. Qi Wei, Technical Director of the 5G Project – [5G Millimeter-Wave Packaging Based on Flexible Substrates]

6. Hangzhou Kebote Filtration Equipment Co., Ltd. – Partner Khaled Atta – [Opportunity Selection for Electronic Materials Packaging Solutions in the Industry]

September 11

8:30-12:00 Supply-Demand Matching Meeting [Invitation]

9:00-11:30 Xingang Salon [Invitation]

14:00-16:30 Chip Talent Lecture [Invitation]

14:00–17:30 Integrated Circuit Materials Industry Technology Alliance Board of Directors [Closed Door]

China Semiconductor Industry Association Semiconductor Supporting Industries Branch Members’ Meeting [Closed-Door]

Partners:

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