The groundbreaking ceremony for the first phase of Hefei Jiangfeng’s “Large-Scale LCD Panel Industry Sputtering Target and Equipment Component Production Project” was held.

On the morning of June 28, the groundbreaking ceremony for Phase I of the “Large-Scale Liquid Crystal Display Panel Sputtering Target and Equipment Component Production Project” of Hefei Jiangfeng Electronic Materials Co., Ltd. was officially held in Hefei’s Xinzhancheng District. Wang Weidong, member of the Standing Committee of the Hefei Municipal Party Committee and Minister of the Organization Department, attended the ceremony by invitation and announced the official start of the project. Officials from the Hefei Municipal Party Committee’s Organization Department, the Municipal Development and Reform Commission, the Municipal Economic and Information Technology Commission, and the Science and Technology Bureau also participated in the groundbreaking ceremony. The total investment for Phase I of the project is 207.13 million yuan, with a construction area of 12,000 square meters. According to the plan, Phase I of the project will officially begin production by the end of June next year, and will be capable of mass-producing large-size liquid crystal display (LCD) panels of G6 and G series.

Dow Chemical continues to ramp up CMP production in Taiwan.

Dow Chemical recently held a groundbreaking ceremony for the fourth-phase expansion project of its chemical mechanical polishing (CMP) plant in Hsinchu, northern Taiwan, according to the company.

Notice from the Ministry of Science and Technology, the Ministry of Finance, and the State Administration of Taxation on Revising and Issuing the “Guidelines for the Identification and Management of High-Tech Enterprises”

Next-Generation Chemical Mechanical Polishing (CMP) Pads

Description: Next-generation chemical-mechanical polishing (CMP) pads for the semiconductor and electronics industries. Stock polishes for silicon, gallium arsenide, indium phosphide, disk media, glass, silicon carbide, and fine sapphire.

The symposium on promoting technological advancement in the key component industry was successfully held in Beijing.

On June 13, a symposium on promoting technological advancement in the critical components industry was successfully held in Beijing. Attending the meeting were Xie Min, Inspector of the Office of Major Special Projects at the Ministry of Science and Technology; Liang Sheng, Director of the Implementation and Management Office for Special Project 02; Qiu Gang, Division Chief of the Office of Major Special Projects at the Ministry of Science and Technology; Ye Tianchun, Chief Technical Advisor for Special Project 02 and Director of the Institute; Yang Jun and Li Wei, Deputy Division Chiefs of the Office of Major Special Projects at the Ministry of Science and Technology; as well as over 60 participants, including experts from the overall team of Special Project 02, representatives from SMIC, and heads of more than 30 domestic enterprises specializing in components used in integrated circuit manufacturing. The meeting was organized by the Materials Alliance under the commission of the Implementation and Management Office for Special Project 02, with the aim of further accelerating technological progress in the critical components industry.

Opinions of the Ministry of Education and Six Other Departments on Strengthening the Cultivation of Integrated Circuit Talent

Jiao Gao [2016] No. 1 To the Education Departments (Education Commissions), Development and Reform Commissions, Science and Technology Departments (Science and Technology Commissions), Departments in charge of Industry and Information Technology, Finance Departments (Bureaus), Human Resources and Social Security Departments (Bureaus), and Foreign Expert Affairs Bureaus of all provinces, autonomous regions, and municipalities directly under the central government; to the Education Divisions (Bureaus) of relevant departments (units); to the higher education institutions affiliated with central government departments; and to relevant units: The integrated circuit industry is the core of the information technology industry and a strategic, fundamental, and leading industry that underpins economic and social development and safeguards national security. At present and for the foreseeable future, China’s integrated circuit industry is at an important strategic juncture—both an opportunity period and a critical phase for overcoming challenges. To proactively adapt to and lead the economic...

Academician Wang Xi, Chairman of the Materials Alliance, has been elected Vice Chairman of the 9th National Committee of the China Association for Science and Technology!

The 9th National Congress of the China Association for Science and Technology concluded in Beijing on June 2. Wan Gang, Vice Chairman of the National Committee of the Chinese People's Political Consultative Conference and Minister of Science and Technology, was elected Chairman of the 9th National Committee of the China Association for Science and Technology. Eighteen comrades, including Academician Wang Xi, Director of the Shanghai Institute of Microsystem of the Chinese Academy of Sciences and Chairman of the Materials Alliance, were elected as Vice Chairmen of the 9th National Committee of the China Association for Science and Technology. The China Association for Science and Technology (CAST) is a mass organization of science and technology workers in China, composed of national societies, associations, research societies, and local science and technology associations. Its organizational structure spans across most natural science disciplines and the majority of industrial sectors, making it an organization with significant...

[National 12th Five-Year Plan Science and Technology Achievement Exhibition] Breakthroughs in Integrated Circuit Materials Cluster

The National Science and Technology Achievement Exhibition for the 12th Five-Year Plan, themed "Innovation Drives Development, and Technology Leads the Future," was held from June 1 to 7 at the Beijing Exhibition Hall. Companies specializing in materials—including Jiangfeng Electronics, Anji Microelectronics, Beijing Kehua, Youyan Semiconductor, Tianjin Huanou, Nanjing Guosheng, Shanghai Xin'ao, Nanjing University Optoelectronics, Debang Technology, Jiangsu Zhongpeng, Shenzhen Nan Circuit, Xingsen Quick, Danbang Technology, Hebei Zhongci, Ningbo Kangqiang, and Youyan Yijin—participated in the exhibition’s “02 Special Project” zone. Under the support and guidance of the “02 Special Project,” the overall technological level of the integrated circuit and advanced packaging materials industries has been significantly enhanced, with key application technology nodes for core materials reaching 9.

Jiangfeng Electronics Selected as a Provincial Enterprise Research Institute

According to the Zhejiang Provincial Department of Science and Technology, the “Zhejiang Jiangfeng Ultra-High-Purity Sputtering Target Research Institute” of Ningbo Jiangfeng Electronic Materials Co., Ltd. has successfully been selected as a provincial-level enterprise research institute—the only one from Yuyao City this year. As China’s largest, most fully equipped, and most technologically advanced production base for ultra-high-purity metal materials and sputtering targets, Jiangfeng Electronic began establishing its enterprise research institute in 2014 and was designated as a “Ningbo Municipal Enterprise Research Institute” in 2015. As a national intellectual property advantage enterprise, Jiangfeng Electronic also houses a provincial-level high-tech enterprise R&D center, a provincial academician expert workstation, and a provincial postdoctoral research workstation, as well as Ning…

Plasma pretreatment for gallium nitride chemical mechanical polishing

Osaka University in Japan has developed a plasma pre-treatment for chemical mechanical polishing (CMP) on gallium nitride (GaN) that avoids the formation of enlarged etch pits [Hui Deng et al., Appl. Phys. Lett., vol. 107, p051602, 2015]. Surfa

Gallium arsenide on V-groove silicon template for photonics and electronics

Researchers in Hong Kong and the USA have developed indium arsenide (InAs) quantum-dot (QD) microdisk lasers directly integrated on silicon (Si), with performance comparable to the best reported for similar devices on gallium arsenide (GaAs).

Electrografting plays an important role in 3D TSV technology.

In today’s rapidly evolving 3D technology landscape, silicon through-silicon vias (TSVs)—an electronic interconnect technology used between stacked chips—can provide signals with shorter transmission paths than traditional wire bonding. Moreover, TSVs enable a greater number of input/output (I/O) connections. By leveraging the diameter and aspect ratio of TSVs, even higher integration densities can be achieved. As a result, this technology allows for performance improvements at lower power consumption compared to wire-bonding techniques. So, what role does metal deposition play in 3D silicon through-silicon vias (TSVs), and why is it so critical? According to Bruno Morel, CEO of Aveni, metal deposition is the key to achieving successful TSV performance.

China’s domestically developed “Loongson” CPUs have extremely low cost-performance ratios—so what exactly is the problem?

With the widespread adoption of computers and the growing popularity of DIY (an abbreviation for "Do It Yourself"), ordinary people can now purchase CPUs from Intel and AMD through various channels and assemble their own PCs by pairing them with components such as motherboards, memory, hard drives, and power supplies. In today’s highly transparent CPU pricing environment, there’s an intriguing phenomenon: foreign CPUs offer superior performance at lower prices, whereas domestic CPUs don’t necessarily cost less than foreign ones—but their performance typically ranges only from 20% to 40% of that of foreign CPUs. Take Intel and a certain domestically produced CPU as examples: Intel’s Celeron and Pentium CPUs are priced between 250 and 500 yuan.

IFTLE 282 Unique GaN Packaging Solutions from HRL

Wide-bandgap semiconductors are extremely attractive for power electronics applications. GaN is a binary III-V wide-bandgap (3.4 eV) material. Since GaN transistors can operate at much higher temperatures and work at much higher voltages,

Characteristics and Application Scope of Grinding and Polishing Materials and Polishing Liquids

For metal, hardware, and stainless steel workpieces, the requirements for grinding and polishing materials are also very high. At the same time, both the selection and use of grinding and polishing materials and polishing liquids are subject to specific guidelines. Han Tong Grinding would like to introduce you to our polishing liquid—a composite polishing material made from highly pure silica and other composite abrasives, forming a primary particle-sized composite polishing liquid. Special modified additives are incorporated into the emulsion to ensure uniform dispersion. This polishing liquid for grinding and polishing materials boasts exceptional properties, including high permeability, high strength, strong adhesion, active film-forming capability, excellent weather resistance, and pronounced thixotropy: 1. High purity, effectively minimizing contamination of electronic products; 2.

The Integrated Circuit Materials Industry Alliance and HuaLi Microelectronics Supply-Demand Matchmaking Conference Was Held Solemnly.

On April 15, the Integrated Circuit Materials Industry Alliance and HuaLi Microelectronics held a supply-and-demand matchmaking meeting in Shanghai. The meeting was organized by the Materials Alliance and hosted by Shanghai HuaLi Microelectronics Co., Ltd. Secretary-General Shi Ying of the Materials Alliance attended the meeting, along with HuaLi Microelectronics President Lei Haibo, Dr. Peng Shugen, Director of Advanced Process R&D, Wang Jihua, Head of the Product Quality Department, and Zhou Limin, Director of Procurement, together with process engineers, quality control specialists, user evaluation experts, and over 100 senior representatives from the technical, quality, and marketing departments of 37 member companies of the Alliance. In her opening remarks, Secretary-General Shi Ying pointed out that over the past decade...

The Materials Alliance successfully hosted the “2016 International Conference on Advanced Electronic Packaging Materials.”

The International Symposium on Advanced Packaging Materials (APM) is one of the most important international technical symposia dedicated to electronic packaging and materials. The conference aims to provide a crucial platform for scholars, experts, and technical personnel from both domestic and international academic and industrial circles to exchange ideas and share the latest advancements in electronic packaging technologies and materials. From March 13 to 14, 2016, the International Symposium on Advanced Packaging Materials (APM) 2016 was held.

The 10 member units of the Materials Alliance have won awards in the 10th (2015) China Semiconductor Innovation Products and Technologies Competition.