Electrografting plays an important role in 3D TSV technology.

In 3D In today’s era of continuously evolving manufacturing processes, silicon through-silicon vias (TSVs) serve as an electronic interconnect technology between stacked chips. TSV ) It can provide a shorter transmission path for signals than traditional wire bonding. In addition, TSV It can also support more inputs. / Output ( I/O ). Relying on TSV Its diameter and aspect ratio enable higher density. Consequently, this technology can achieve performance improvements with lower power consumption than wire bonding. To... 3D Through-Silicon Vias (TSV) TSV ) So, what are the functions and significance of metal deposition processes? aveni Chief Executive Officer Bruno Morel Indicates that metal deposition was successful. TSV One of the key processes for performance. Similar to planar devices, metal deposition serves as the “wiring” within the chip layers. In chip stacking, metal deposition is crucial for establishing interconnections between chips. Device speed and signal integrity are directly linked to the quality of metal deposition.

TSV In the conventional metal deposition processes used in the barrier and seed steps, traditional top-down deposition techniques such as chemical vapor deposition are employed. Cardiovascular disease ) Physical Vapor Deposition ( PVD ) or atomic layer deposition ( ALD ), all of which depend on tools in TSV The ability to conformally distribute chemical components on both the sidewalls and the bottom surface. When used to achieve high aspect ratios. TSV During metallization, some challenges may arise for conventional processes. For example, limited transport of reactants to the narrow, fine structures of circuits—and the balance between reactants and inhibiting species—can lead to pinching. If reactants accumulate more rapidly at the tops of the circuit’s finer structures, where they have easier access, the deposited film will narrow the width and eventually close off the fine circuit structures, resulting in voids.

Morel Indicates, aveni Patented electrografting eG The technology employs ultra-conformal thin-film growth, which produces high-quality films and enables the pinch-off of the two top ends of through-holes. (pinching off) and minimizing the gaps caused by clamping. eG able to TSV Deposition is typically carried out in narrow, high-aspect-ratio circuit features. We have already... 40:1 A co-planar barrier was deposited in the ultra-narrow circuit’s fine structural features, and process records from multiple customer sites were documented ( FOR ) is the same.

In addition, compared to traditional technologies, eG The technology requires a smaller overlayer. (overburden) It is used for metal filling. The overlayer is deposited to compensate for the difference in fill rates between narrow feature areas and fine structures of wide circuits; it is also referred to as the loading effect. The overlayer can produce thicker films in flat regions and requires more chemical-mechanical polishing. CMP ). Due to aveni of the eG The technology enables bottom-up deposition of thin films while simultaneously inhibiting film growth in flat areas, thus requiring fewer overlayers and resulting in shorter structures. CMP Time and cost savings.

Morel indicates, "In aveni We have a fully equipped characterization and analysis laboratory that enables us to use a variety of analytical techniques to characterize the properties of our thin films. We measure resistivity, adhesion, stress, and photoelectron spectroscopy ( XPS ) Secondary Ion Mass Spectrometry (SIMS) SIMS ) and scanning electron microscopy ( SEM ) / Transmission electron microscope ( TEM ) to characterize our thin films. We also collaborate with customers and research institutions to quantify the process and compare it with other methods, and we have already collected a wealth of data that demonstrates eG Characteristic data on process stability and reliability.» French Atomic Energy Commission, Laboratory of Electronics and Information Technology ( CEA-Leti ) Recently, right here in Singapore. 2015 Presented a paper at the Electronic Packaging Technology Conference, which compared the technologies used for... 10:1 Aspect ratio TSV A replacement process for the barrier layer and seed layer. The solution involves depositing a diffusion barrier layer and a seed layer separately using two distinct conformal deposition techniques. The first technique is based on metalorganic chemical vapor deposition (MOCVD). Metal-Organic Chemical Vapor Deposition ) Titanium nitride Process, the second one uses aveni copper of eG3D Seed layer. Complete integration and thorough electrical testing were performed, during which... eG demonstrates in 300 Excellent electrical results obtained at the millimeter level.

aveni The non-acidic process will still use additives, but it requires fewer additives than the traditional acidic chemical process. As for... ALD Compared to the speed, ALD Its essence lies in repeatedly using self-limiting precursors and depositing high-quality thin films at a slow, controllable rate. Morel Indicates that, taking into account aveni The elegance and simplicity of the technology, in addition to enabling the production of high-quality thin films, aveni Believe its speed is far faster than. ALD 。 Morel states, “We believe that compared to traditional gas-phase processes, eG It can achieve significant cost savings. Although individual circumstances may vary, our technology doesn't require vacuum equipment, unlike plasma- or vapor-based processes. It’s a wet-chemistry-based process that’s compatible with electrochemical deposition tools meeting industry standards.

Morel indicates that the market is looking for aveni has a strong interest in technical capabilities and already has numerous key customers with aveni Contact. aveni There is CEA-Leti (Within its 3D IRT Nanoelectronics In the project) and Teledyne DALSA The company's TSV Process Record ( FOR ). In addition, aveni It is also recognized as a leading provider of advanced interconnect technologies for device manufacturing and contract manufacturing customers. aveni The feedback we keep receiving is: aveni The technology makes future devices possible. aveni It can successfully coat and fill the intricate fine structures of advanced circuits that cannot be achieved by conventional methods.

aveni Primarily focuses on the semiconductor market and microelectromechanical systems (MEMS). MEMS ) and metallization applications in the sensor market, while 3D TSV It's just one of the parts. MEMS/ Sensors are not yet a mainstream market; therefore, the limitations of existing technologies have historically shown that when the aspect ratio exceeds... 10:1 of the TSV Metalization cannot be successfully carried out. Morel Indicates, “In reality, aveni of the eG Technology can for TSV Provides breakthrough capabilities, enabling greater aspect ratios (up to... 40:1 ) Able to integrate into MEMS and sensor design. This will be beneficial to many industries, such as the automotive sector, because there’s a relatively long timeline—from vehicle design all the way through to the point when the components can be used in consumer products (on the order of years). Together with our... 3D TSV “We are capable of providing advanced metallization for single- and dual-die-level interconnects in both memory and logic devices—this is precisely why our customers consistently choose to do business with us.”