18

2016

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04

Characteristics and Application Scope of Grinding and Polishing Materials and Polishing Liquids

For metal, hardware, and stainless steel workpieces, the requirements for grinding and polishing materials are also very high. At the same time, both the selection and use of grinding and polishing materials and polishing liquids are subject to specific guidelines. Han Tong Grinding would like to introduce you to our polishing liquid—a composite polishing material made from highly pure silica and other composite abrasives, forming a primary particle-sized composite polishing liquid. Special modified additives are incorporated into the emulsion to ensure uniform dispersion. This polishing liquid for grinding and polishing materials boasts exceptional properties, including high permeability, high strength, strong adhesion, active film-forming capability, excellent weather resistance, and pronounced thixotropy: 1. High purity, effectively minimizing contamination of electronic products; 2.


For metal, hardware, and stainless steel workpieces, the requirements for grinding and polishing materials are also very high. At the same time, both the selection and use of grinding and polishing materials and polishing liquids are subject to specific guidelines. Han Tong Grinding would like to introduce you to our polishing liquid—a composite polishing material made from highly pure silica and other composite abrasives, forming a primary particle-sized composite polishing liquid. It also contains specially modified dispersants that are evenly distributed throughout the emulsion.

     The polishing liquid for grinding and polishing materials exhibits the following properties: high permeability, high strength, strong adhesion, film-forming activity, excellent weather resistance, and pronounced thixotropy.

     1. High purity, effectively reducing contamination of electronic products.

     II. The polishing material features a high polishing rate, achieving rapid polishing by utilizing uniformly dispersed nanoparticles such as silicon dioxide.

3. High-flatness machining—this product’s polishing utilizes nanotechnology. SiO2 The particles of the material do not cause physical damage to the workpiece, achieving highly planar processing.

Precautions for using polishing liquids on polished materials: Since the product tends to gradually thicken or even become gel-like after being stored for a period of time, it is recommended to use it in a water-to-solution ratio when applying. =1 1 Dilute it proportionally, and it is recommended to use a dispersing device to mix thoroughly (for better results) before adding it. When adding, also pay attention to the viscosity of the system to avoid severe flocculation caused by excessively low base material viscosity or low shear rates.

     The main application areas of polishing liquids include:

     First, polishing slurries—polishing materials—are widely used in nanoscale chemical-mechanical polishing applications, such as the polishing of silicon wafers, compound crystals, precision optical components, hard disk platters, gemstones, and other materials at the nanometer and sub-nanometer levels.

Second, polishing liquid products can be used as an additive and also find applications in areas such as water-based adhesives and high-weather-resistant exterior wall coatings.

 

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