The Materials Alliance successfully hosted the “2016 International Conference on Advanced Electronic Packaging Materials.”

The International Symposium on Advanced Packaging Materials (APM) is one of the most important international technical symposia dedicated to electronic packaging and materials. The conference aims to provide a crucial platform for scholars, experts, and technical personnel from both domestic and international academic and industrial circles to exchange ideas and share the latest advancements in electronic packaging technologies and materials. From March 13 to 14, 2016, the International Symposium on Advanced Packaging Materials (APM) 2016 was held.

　　The International Symposium on Advanced Packaging Materials (APM) is one of the most important international technical symposia dedicated to electronic packaging and materials. The conference aims to provide a key platform for scholars, experts, and technical personnel from both domestic and international academic and industrial circles to exchange ideas and share the latest advancements in electronic packaging technologies and materials.

　　Subsequently, the conference featured in-depth exchanges and discussions on topics including advanced semiconductor electronic materials, micro- and nano-electronic packaging materials, and cutting-edge electronic packaging technologies—covering such subjects as packaging reliability and thermal management solutions—and provided a platform for scholars and industry professionals from both home and abroad to learn from and interact with one another.

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