[National 12th Five-Year Plan Science and Technology Achievement Exhibition] Breakthroughs in Integrated Circuit Materials Cluster

The National Science and Technology Achievement Exhibition for the 12th Five-Year Plan, themed "Innovation Drives Development, and Technology Leads the Future," was held from June 1 to 7 at the Beijing Exhibition Hall. Companies specializing in materials—including Jiangfeng Electronics, Anji Microelectronics, Beijing Kehua, Youyan Semiconductor, Tianjin Huanou, Nanjing Guosheng, Shanghai Xin'ao, Nanjing University Optoelectronics, Debang Technology, Jiangsu Zhongpeng, Shenzhen Nan Circuit, Xingsen Quick, Danbang Technology, Hebei Zhongci, Ningbo Kangqiang, and Youyan Yijin—participated in the exhibition’s “02 Special Project” zone. Under the support and guidance of the “02 Special Project,” the overall technological level of the integrated circuit and advanced packaging materials industries has been significantly enhanced, with key application technology nodes for core materials reaching 9.

　　Under the support and guidance of Project 02, the overall technological level of the integrated circuit and advanced packaging materials industries has been significantly enhanced. The technology nodes for key material applications have reached 90-65 nanometers. Some products—such as sputtering targets, CMP polishing slurries, electronic gases, and process chemicals—can now meet the requirements of 28-nanometer processes. In coordination with the implementation of Project 02, the Strategic Alliance for Technological Innovation in the Integrated Circuit Materials Industry has facilitated the mass production and application of domestically produced materials. Over a hundred types of materials have entered mass sales, and the procurement proportion of 19 materials has exceeded 50%. Among the 8 to 12 major domestic manufacturers, the cumulative procurement of domestically produced materials has surpassed 1.2 billion yuan. Specifically, three materials—CMP copper polishing slurries, tantalum targets, and related components—have each accumulated procurement amounts exceeding 50 million yuan; two materials—NF3 and CMP barrier-layer polishing slurries—have together accumulated procurement amounts reaching 200 million yuan. Major materials companies have collectively filed 3,574 invention patent applications and been granted 1,422 authorized invention patents.

　　Welcome to visit and exchange ideas in the Special Exhibition Area 02.

Key words: