Next-Generation Chemical Mechanical Polishing (CMP) Pads

Description: Next-generation chemical-mechanical polishing (CMP) pads for the semiconductor and electronics industries. Stock polishes for silicon, gallium arsenide, indium phosphide, disk media, glass, silicon carbide, and fine sapphire.

Description:

Next-generation chemical mechanical polishing (CMP) pads for the semiconductor and electronics industry.

Stock polish for silicon, gallium arsenide, indium phosphide, disk media, glass, silicon carbide, sapphire
Final polishing of silicon, gallium arsenide, indium phosphide, disk media, glass, silicon carbide, sapphire
Polysilicon CMP, Tungsten CMP, Copper CMP, Barrier Metal CMP
MEMS CMP, TSV CMP
Polishing after Grinding Process

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