The Integrated Circuit Materials Industry Alliance and HuaLi Microelectronics Supply-Demand Matchmaking Conference Was Held Solemnly.

On April 15, the Integrated Circuit Materials Industry Alliance and HuaLi Microelectronics held a supply-and-demand matchmaking meeting in Shanghai. The meeting was organized by the Materials Alliance and hosted by Shanghai HuaLi Microelectronics Co., Ltd. Secretary-General Shi Ying of the Materials Alliance attended the meeting, along with HuaLi Microelectronics President Lei Haibo, Dr. Peng Shugen, Director of Advanced Process R&D, Wang Jihua, Head of the Product Quality Department, and Zhou Limin, Director of Procurement, together with process engineers, quality control specialists, user evaluation experts, and over 100 senior representatives from the technical, quality, and marketing departments of 37 member companies of the Alliance. In her opening remarks, Secretary-General Shi Ying pointed out that over the past decade...

　　On April 15, the Integrated Circuit Materials Industry Alliance and HuaLi Microelectronics held a supply-and-demand matchmaking meeting in Shanghai. The meeting was organized by the Materials Alliance and hosted by Shanghai HuaLi Microelectronics Co., Ltd. Shi Ying, Secretary-General of the Materials Alliance, attended the event. Also present were Lei Haibo, President of HuaLi Microelectronics; Dr. Peng Shugen, Director of Advanced Process R&D; Wang Jihua, Director of the Product Quality Department; and Zhou Limin, Director of Procurement, along with process engineers, quality control specialists, user evaluation experts, and over 100 senior representatives from the technical, quality, and marketing departments of 37 member companies of the Alliance.

　　In his opening remarks, Secretary-General Shi Ying pointed out that over the past decade, China’s integrated circuit materials industry has made remarkable progress. Driven particularly by the Major Project 02, the industry has continued to expand in scale and steadily improved its technological level. However, there is still a significant gap to go before the industry can fully support the country’s goal of achieving independent and controllable development in the integrated circuit sector—as outlined in the “Outline”—and ensure the sustained growth of national industries while enhancing the global competitiveness of the entire industrial chain. Therefore, we hope that materials companies will step up their efforts in terms of product technology and management. At the same time, we also encourage integrated circuit manufacturers to provide materials companies with more opportunities for trial and error, continuous improvement, and closer collaboration in the development of new processes and products. Together, we can tackle difficult challenges and jointly define industry standards. As one of China’s leading integrated circuit enterprises, HuaLi Microelectronics boasts a fully automated 12-inch production line and has taken on the responsibility of the “Mass Production and Application Engineering for Domestic Materials and Equipment” under Project 02. For a long time, the company has attached great importance to cooperation with domestic materials firms and the development of a local supply chain. Thus, we sincerely hope that through this matchmaking event, we can jointly assess the current status of domestic materials companies, identify existing problems, and explore viable solutions. In doing so, domestic materials companies can leverage the support of HuaLi Microelectronics to achieve growth, while HuaLi Microelectronics itself can reap benefits from the future expansion of the materials industry, ultimately realizing a win-win situation for both materials companies and HuaLi Microelectronics in the broader industrial chain competition.

　　President Lei Haibo provided an overview of HuaLi Microelectronics, covering topics such as management system certification, basic information on production lines, and efforts to support domestically produced materials. Director Peng Shugen presented HuaLi Microelectronics’ R&D progress, achievements, and the roadmap for process technology development. Minister Wang Jihua reported on HuaLi Microelectronics’ raw material certification and evaluation system, and offered three recommendations for material suppliers regarding the localization of materials: first, enhance management capabilities to ensure a stable supply of materials that meet technical specifications; second, engage in two-way technical exchanges with IC manufacturers to gain a deeper understanding of how the supplied raw materials are used and their underlying mechanisms in the IC manufacturing process; and third, place great emphasis on analytical techniques and let data speak for itself. Zhang Keyun, Director of Shanghai Xinyang Semiconductor, and Li Shaobo, Director of Institute 718, along with other material suppliers, shared their experiences and insights gained from collaborating with HuaLi Microelectronics on aspects including technology development, production management, and customer service. The meeting also included breakout sessions for group discussions, during which dozens of constructive suggestions were put forward.

　　Following this matchmaking event, HuaLi Microelectronics will work together with the companies affiliated with the Materials Alliance to develop a detailed implementation plan and carry it out step by step. The Materials Alliance will also continue to closely monitor and track the progress of the collaboration.

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