Dow Chemical continues to ramp up CMP production in Taiwan.

Dow Chemical recently held a groundbreaking ceremony for the fourth-phase expansion project of its chemical mechanical polishing (CMP) plant in Hsinchu, northern Taiwan, according to the company.

The company said the new production facilities are scheduled to come online one year later, adding that total investment for the new production lines will reach NT$1 billion (US$31.02 million).

Dow Chemical’s existing production lines are rolling out CMP pads and other solutions for wafer foundry companies, including Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC).

Dow Chemical is building next-generation CMP production capacity in Taiwan to further deepen its deployment in Asia and strengthen its partnership with clients in the region, said the company's vice president and global business director Mario Stanghellin.

Key words: