Shanghai Xinyang’s product—ultra-pure copper sulfate—has successfully entered Shanghai HuaLi Microelectronics.

After two and a half years of rigorous testing and validation, Shanghai Xinyang’s ultra-pure copper sulfate product has successfully entered Shanghai HuaLi Microelectronics, becoming its official supplier! Shanghai HuaLi Microelectronics is currently the most advanced chip-manufacturing facility under state-owned control, equipped with cutting-edge production equipment and capable of achieving a process technology node as fine as 40nm. Under stringent and lengthy verification and audit procedures, Xinyang’s ultra-pure copper sulfate product has successfully secured an order from HuaLi, making Xinyang the first—and currently the only—domestic supplier of bulk-formula chemicals to HuaLi. This milestone underscores Xinyang’s technological leadership in the front-end wafer manufacturing sector and highlights the high regard that China’s most advanced chip-manufacturing enterprise has for Xinyang’s products.

ICPT 2015 was successfully held in Phoenix, USA.

The venue of the conference—the International Conference on Planarization/CMPTechnology (ICPT)—was successfully held from September 30 to October 2 in Phoenix, USA. Researchers and engineers from around the world gathered to discuss key issues in the planarization process and engage in extensive technical exchanges and information sharing. The conference brought together over 400 participants, including numerous Chinese scholars and industry experts. Attendees discussed topics related to CMOS in semiconductors...

The 2015 Shanghai FD-2015 Shanghai FD-SOI Summit Forum and International RF-SOI Workshop were held in Shanghai. The SOI Summit Forum and International RF-SOI Workshop were held in Shanghai.

On September 15 and 16, the “2015 Shanghai FD-SOI Summit” and the “2015 International RF-SOI Workshop,” jointly hosted by the International SOI Industry Consortium, the Shanghai Institute of Microsystem and Information Technology (SIMIT) of the Chinese Academy of Sciences, VeriSilicon Co., Ltd., and the Shanghai Institute of Microtechnology and Industrial Research (SITRI), were successfully held in Shanghai. The conferences were themed “FD-SOI Design” and “An Interconnected World,” bringing together over 200 industry leaders from the global SOI sector.

Xiamen Hosts Domestic Integrated Circuit Industry Cooperation and Matchmaking Conference

On September 23, the Integrated Circuit Industry Cooperation and Matchmaking Conference, jointly hosted by the Electronic Information Department of the Ministry of Industry and Information Technology and the Xiamen Municipal Bureau of Economy and Information Technology, was held at the Xiamen Hotel. The conference aimed to implement the "National Outline for Promoting the Development of the Integrated Circuit Industry," establish a platform for communication among upstream and downstream enterprises in the integrated circuit industry chain, promote the application of key equipment and materials for integrated circuits, and enhance the industry's core competitiveness. Peng Hongbing, Deputy Director of the Electronic Information Department of the Ministry of Industry and Information Technology; Yan Xiaodong, Deputy Director of the Fujian Provincial Bureau of Economy and Information Technology; Ye Tianchun, Director of the Institute of Microelectronics of the Chinese Academy of Sciences; Li Dongliang, Vice Mayor of Xiamen; and Xie Song, Deputy Director of the Management Committee of the Xiamen Torch High-Tech Zone, attended the conference and delivered speeches. The Materials Alliance is supported by the Electronic Information Department of the Ministry of Industry and Information Technology.

NCAP and YOLE jointly organized a seminar on advanced packaging and system integration technologies.

From April 21 to 22, 2016, NCAPCHINA (Nanjing Advanced Packaging R&D Center Co., Ltd.) and Yole Development, a renowned French market research firm, successfully co-hosted a two-day seminar on advanced packaging and system integration technologies at the Kailai Hotel in Wuxi. The seminar featured keynote speakers from globally recognized companies, including ASE Group, ASM Pacific Technology, Besi, BroadPak, EV Group, JCAP, and HuaTian Technology.

Dr. Yao Lijun, Vice Chairman of the Materials Alliance, was invited to attend the military parade ceremony.

Dr. Yao Lijun, Vice Chairman of the Materials Alliance and Chairman of Ningbo Jiangfeng Electronic Materials Co., Ltd., is soon to travel to Beijing to attend the military parade commemorating the 70th anniversary of the victory of the Anti-Japanese War. Dr. Yao Lijun founded Ningbo Jiangfeng Electronic Materials Co., Ltd. in August 2005 after returning to China. The company has successively undertaken national-level research and industrialization projects, including the National Major Special Project 02, the National 863 Major Special Project, the NDRC’s High-Tech Industry Development Program, and the Ministry of Industry and Information Technology’s Electronic Development Fund. It is the only domestic enterprise engaged in the R&D and production base for ultra-high-purity metal materials and sputtering targets used in integrated circuit chip manufacturing. The company produces...

CMP Industry Technology Development Trends

In recent years, with the rapid advancement of CMP industry technology, the future application prospects and existing challenges of advanced CMP technologies have become a hot topic of great concern. Currently, CMP research is focused on the following areas: CMP technologies and markets for nodes below 10nm, new types of CMP abrasives, CMP in TSVs, wafer thinning, advanced thin films used in front-end and back-end processes, advanced cleaning and surface-preparation technologies, as well as chemicals and materials for TSV applications, among others. To achieve sustained development and wider adoption in cutting-edge technologies, CMP must overcome critical technological bottlenecks. This article will draw upon insights from Mik at Linx Consulting.

The 2nd Biannual Council Meeting of the Materials Alliance was held in Shanghai.

On August 28, the second session of the second council meeting of the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance (hereinafter referred to as the “Materials Alliance”) was held in Shanghai. The council summarized the Materials Alliance’s work for the first half of 2015 and laid out plans for the second half of the year. The meeting was chaired by Secretary-General Shi Ying, and Academician Wang Xi, Chairman of the Board, attended and delivered a speech. More than 80 representatives from the alliance’s member units also attended the meeting. The council fully recognized the Materials Alliance’s achievements in the first half of 2015, including supporting government and industry initiatives such as the “02 Special Project,” promoting mass production and application, organizing industrial and academic exchange activities, fostering regional cooperation, and completing the 2014 industry tasks.

The Materials Alliance promotes cooperation and exchange between materials companies and Suzhou Keshiny Photovoltaic.

To accelerate the pace of cooperation between materials companies and Suzhou Kexinyang Optoelectronics Technology Co., Ltd. in the area of domestically produced materials, from July 1 to 14, 2015, the Materials Alliance organized one-on-one collaboration talks between materials companies—including Suzhou Ruihong, Shanghai Xinyang, Yantai Debang Technology, Weifang Xingtaike, Suzhou Jingrui Chemical, and Maikai Special Materials—and Suzhou Kexinyang Optoelectronics. The assistant to the chairman of Kexinyang Optoelectronics, the CTO and R&D team, and the procurement manager held discussions with the heads of each materials company as well as their marketing and technical directors, focusing on how existing products from the materials companies could be applied within Kexinyang Optoelectronics, and how new developments could be carried out in response to Kexinyang Optoelectronics’ process requirements and project needs.

The domestic special gas industry development seminar was successfully held.

On July 13, 2015, a seminar on the development of China’s specialty gas industry—titled “How Domestic Gas and Materials Enterprises Can Rapidly Grow Stronger Through Mergers, Reorganizations, and Other Integration Strategies”—was successfully held at Guizhou Weidun Jinglin Electronic Materials Co., Ltd. The seminar was chaired by Ms. Shi Ying, Secretary-General of the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance (referred to as the “Materials Alliance”). More than 20 experts from domestic companies engaged in the specialty gas industry attended the meeting. During the seminar, Director Sun Dejun from the Investment Department of Nanjing University Optoelectronics in Jiangsu first presented an overview of the current status of domestic and international enterprises in the specialty gas industry, based on thorough prior industry research.

Hebei Zhongci Electronic Technology Co., Ltd.

Hebei Zhongci Electronic Technology Co., Ltd. (hereinafter referred to as Zhongci Company) was established in August 2009 with a registered capital of 10 million yuan. It is a state-controlled joint-stock company affiliated with the 13th Research Institute of China Electronics Technology Group Corporation. Drawing on more than 40 years of experience in the development and production of ceramic packaging housings accumulated by the 13th Research Institute of China Electronics Technology Group, Zhongci Company is dedicated to the research and development and product manufacturing of multilayer ceramic packaging technology for semiconductors. The company boasts several complete production lines for ceramic substrates and housings, possesses strong material-development capabilities, employs advanced design methodologies, has a robust technical team, features cutting-edge process equipment, and delivers high-quality products. The optical communication ceramics developed by Zhongci Company...

Shenzhen Danbang Technology Co., Ltd.

Shenzhen Danbang Technology Co., Ltd. (stock code: 002618) was established in 2001 with a registered capital of 182.64 million yuan. It is a national high-tech enterprise specializing in the R&D and production of flexible circuits and materials, as well as an industrialization base for achievements from the National High-Tech Research and Development Program. The company boasts a state-level R&D center for flexible circuits and materials and is China's largest manufacturer and supplier of flexible circuits and materials, providing comprehensive services for 3D chip packaging interconnection solutions using flexible circuits. Danbang Science and Technology Park is located in the northern area of Shenzhen High-Tech Industrial Park, with a total investment of 260 million yuan and a total construction area of 30,000 square meters. The company employs...

Shennan Circuit Co., Ltd.

Shennan Circuit Co., Ltd. was established in 1984 and is a high-tech enterprise primarily engaged in the production of high-precision, high-density, and highly reliable double-sided and multilayer printed circuit boards. It is a state-owned high-tech enterprise under the China Aviation Industry Corporation, the chairman unit of the China Printed Circuit Association (CPCA), a vice-chairman unit of the Packaging and Testing Industry Innovation Alliance, a high-tech enterprise under the National Torch Program, and a National Enterprise Technology Center. Currently, Shennan Circuit has two factories in Shenzhen, and its Wuxi factory in East China completed connection and went into operation at the end of 2014. At the same time, the company has completed its shareholding system reform. The company employs over 3,000 people.

The Materials Alliance organized a team of experts to visit Guizhou University.

On July 12, Shi Ying, Secretary-General of the Materials Alliance, and her delegation visited Guizhou University (referred to as "Guizhou University") to examine the university's latest progress in research and application of new materials. The expert delegation included Song Zhishang, Director of the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences; Zhang Xing, Dean of the School of Information Science and Technology, Peking University; and Yang Guoqiang, Deputy Director of the Institute of Chemistry, Chinese Academy of Sciences. The delegation first listened to a report by Professor Xie Quan, Dean of the College of Big Data and Information Engineering (referred to as "Big Data College"), on the college’s previous work and future development plans. They then engaged in discussions with members of relevant research teams regarding the implementation of Guizhou University’s development strategy.

Guizhou Weidun Jinglin Electronic Materials Co., Ltd.

Guizhou Weidun Jinglin Electronic Materials Co., Ltd. was established through the shareholding reform of the former Guizhou Weidun Jinglin Electronic Materials Co., Ltd. The company was registered and established in March 2006 and listed on the National SME Share Transfer System (“New Third Board”) in December 2014. Weidun Jinglin is a specialized manufacturer of high-purity electronic chemicals and high-end pharmaceutical intermediate chemical reagents, primarily engaged in the R&D, production, and sales of these products. The company is recognized as a High-Tech Enterprise in Guizhou Province, a Provincial Enterprise Engineering Technology Center in Guizhou Province, an Innovative Enterprise in Guizhou Province, and a Pilot Unit for Intellectual Property Rights in Guiyang City. The company’s production base...

The national key science and technology project "300-mm Silicon Wafers for 40-28 nm Integrated Circuit Manufacturing" has been launched in Shanghai.

On July 28, the launch ceremony for the “300-mm Silicon Wafers for 40- to 28-nanometer Integrated Circuit Manufacturing” project under the National Key Science and Technology Major Project on Advanced Manufacturing Equipment and Complete Process Technologies for Ultra-Large-Scale Integrated Circuits (commonly referred to as “Project 02”) was held in the Lingang Development Zone of Pudong, Shanghai. Attending the event were Cao Jianlin, Deputy Minister of the Ministry of Science and Technology and Head of the Leading Group for Project 02; Zhou Bo, First Administrative Officer of Project 02 and Vice Mayor of Shanghai; Ma Junru, Director of the Advisory Committee for Project 02; and Academician Wang Xi, Deputy Head of the Overall Team for Project 02 and Chairman of the Materials Alliance. The integrated circuit industry is the core of the information technology industry. Since the implementation of “Project 02,” China has...

Jiangfeng Electronics Listed Among the Top 100 Taxpayers in Yuyao City for the First Half of 2015

Recently, the Finance Bureau, the State Taxation Bureau, and the Local Taxation Bureau of Yuyao City jointly published in the Yuyao Daily the “Top 100 Taxpayers in Yuyao City for the First Half of 2015.” Ningbo Jiangfeng Electronic Materials Co., Ltd. was honorably listed, ranking 63rd. Jiangfeng Electronics takes its responsibilities seriously and never forgets to give back to society. Being recognized as one of Yuyao City’s Top 100 Taxpayers fully demonstrates the company’s strong capabilities and its sense of corporate citizenship, making outstanding contributions to Yuyao’s economic and social development. This achievement is the result of the hard work and dedication of every Jiangfeng employee. This honor belongs to each and every “Jiangfeng person.” It is our great pride to be able to contribute to society. May Jiang...

Determination of the 450℃ Isothermal Section of the Ag-Cu-Sn Ternary System in the Ag-Cu-Rich Region

Keywords: Ag-Cu-Sn ternary diffusion couple phase diagram, electron probe. Ag-Cu-Sn mid-temperature solder alloys, with their excellent resistance to temperature, creep, and corrosion, are widely used in the field of electronic packaging. However, due to their inherent brittleness, these alloys are difficult to fabricate, resulting in low yield rates. Therefore, establishing the Ag-Cu-Sn phase diagram is of great significance for guiding the design and preparation of Ag-Cu-Sn solder alloys. In this study, we utilized the principle of local equilibrium in ternary diffusion couples and employed scanning electron microscopy and electron probe microanalysis to determine the phase equilibrium relationships and compositions of the Ag-Cu-Sn ternary diffusion couple at 450℃, thereby constructing the phase diagram.