Hotspot Focus
Entegris, Inc. (NASDAQ: ENTG), a leader in yield-enhancing materials and solutions for highly advanced manufacturing environments, has expanded its wafer shipper product family with the SmartStack 300mm Contactless Horizontal.
The “Materials Industrialization” project has been officially approved. This project is a sub-project under the National Key Science and Technology Special Project “Manufacturing Equipment and Complete Process Technologies for Ultra-Large-Scale Integrated Circuits” (Project 02). The project’s implementation period is from 2015 to 2018. It will focus on the R&D of a complete set of CMP equipment capable of “dry-in, dry-out” for 300mm wafers in the 28-14nm technology node, along with associated supporting materials and processes, and will achieve industrial-scale production. The anticipated product performance indicators are expected to reach internationally advanced levels. Introduction to the 45th Research Institute of China Electronics Technology Group Corporation: Established in 1958, the 45th Research Institute of China Electronics Technology Group Corporation is a domestic institution specializing in electronic components.
On November 20, the research project on the development strategy for the integrated circuit industry in Zhongguancun, undertaken by the Materials Alliance, successfully passed its mid-term review. After listening to presentations on the project’s background, research progress, mid-term achievements, and plans for the next phase of work, the expert panel unanimously endorsed the project’s mid-term results. The experts attending the review meeting included Zheng Minzheng, Qian Peixin, Zhang Xisheng, and He Rongfeng. The meeting was chaired by Xu Jian, Deputy Director of the Industry Division of the Zhongguancun Administrative Committee. Shi Ying, Secretary-General of the Materials Alliance, and members of the project team also attended the review meeting. Zhongguancun is one of China’s leading regions in the integrated circuit industry, and a preliminary industrial cluster has already taken shape. To seize the opportunities presented by national and northern initiatives...
On November 12, in Shanghai, China, Shanghai Huali Microelectronics Co., Ltd. (“Huali Microelectronics”), one of China’s most advanced 12-inch wafer foundries, and MediaTek Inc.—a global leader in IC design (hereinafter referred to as “MediaTek”)—jointly announced that, following less than a year of close collaboration, they have recently begun tape-out for the first 28nm mobile communication chip solution. Shu Qi, Vice President of Huali Microelectronics, stated: “With the tape-out of our first 28nm design—a result of our collaboration with MediaTek—we have accumulated extensive experience in process management, optimization, and yield improvement.”
On November 11, the signing ceremony for the investment cooperation agreement of Shanghai Silicon Industry Investment Co., Ltd., China’s first company focused on the silicon materials industry and its ecosystem development, was held in Shanghai. This also marks the first investment made by the National Integrated Circuit Industry Investment Fund (Big Fund) in the field of integrated circuit materials. Shanghai Silicon Industry Investment Co., Ltd. has a registered capital of 2 billion yuan, and its investors include the National Integrated Circuit Industry Investment Fund Co., Ltd., Shanghai Guosheng (Group) Co., Ltd., Shanghai Wuyuefeng Integrated Circuit Equity Investment Partnership, Shanghai Xinwei Electronics Co., Ltd., and Shanghai Jiading Industrial Zone Development (Group) Co., Ltd.
On November 12, the “Special Symposium on Talent Development and Innovative Development of the Integrated Circuit Industry Chain,” hosted by the National Major Project Group for Program 02 and the China Semiconductor Industry Association, and organized by the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance (referred to as the “Materials Alliance”), was successfully held in Shanghai. The conference featured in-depth discussions centered around “strengthening industry-academia-research cooperation, accelerating the cultivation of mid-level and backbone talents, and boosting innovative development of the industry.” The meeting was chaired by Shi Ying, Secretary-General of the Materials Alliance. Attendees included Ye Tianchun, Chief Engineer of the National Program 02; Xu Xiaotian, Executive Vice Chairman of the China Semiconductor Industry Association; Hou Yongfeng, Director of the Science and Technology Division of the Department of Higher Education at the Ministry of Education; and Zhejiang...
In 2014, the overall size of China’s semiconductor manufacturing materials market was 53.5 billion yuan. Based on the current industry situation and projected development trends, the overall market size for semiconductor manufacturing materials in China is expected to reach 59 billion yuan in 2015 and 64.7 billion yuan in 2016. While the industry continues to maintain steady growth, several existing issues have prompted us to reflect. First, the overall industry scale remains small, and product quality levels are relatively low. Although in recent years the semiconductor manufacturing materials industry has seen continuous growth in product sales revenue and enterprises have steadily expanded their operational scales, the proportion of materials used in integrated circuit manufacturing in total product sales revenue remains relatively low.
Chairman Chen Xin of Beijing Kehua was invited to attend the 12th Scientists’ Forum.
The 12th China Scientists Forum was grandly held in Beijing from October 24 to 25, 2015. Chen Xin, Chairman of Beijing Kehua, was invited to attend as a VIP guest. The opening ceremony of the 12th Scientists Forum—the China Scientists Forum—was founded in 2002. It was named and chaired by Academician Zhou Guangzhao, a renowned scientist, former Vice Chairman of the Standing Committee of the Ninth National People's Congress, and Honorary Chairman of the China Association for Science and Technology. To date, the forum has been held twelve times. This year’s forum was jointly organized by the China Future Research Society, the China High-Tech Industrialization Research Association, and Discovery Magazine. The conference’s theme was “Mass Entrepreneurship and Innovation Empowered by Science and Technology and Capital.”
The “2015 Cross-Strait Entrepreneurial Zijinshan Summit” was held from November 3 to 4 at the Jinling Conference Center in Nanjing. Shi Ying, Secretary-General of the Materials Alliance, was invited to participate in the exchange activities of the “Information and Home Appliance Industry Cooperation Promotion Group” and delivered an insightful presentation titled “Current Status and Development Prospects of Semiconductor Manufacturing Materials and Equipment Industries” at the “IC and Panel Sub-forum.” In her presentation, she introduced to the attendees the recent progress, outstanding achievements, and future development visions of mainland China in the field of semiconductor materials. She also put forward the view that cross-strait cooperation could help build a competitive advantage across the entire semiconductor manufacturing value chain, a perspective that received unanimous approval from the participants. Through representatives from both sides...
From October 22 to 23, the 6th Sino-German Workshop of Cooperation, jointly organized by the Shanghai Institute of Microsystem and Information Technology of the Chinese Academy of Sciences and the Jülich Research Centre in Germany, was successfully held at the Shanghai Institute of Microsystem. This workshop was co-hosted by the Chinese and German sides and was undertaken by the Shanghai Institute of Microsystem and Information Technology of the Chinese Academy of Sciences. More than 70 experts, scholars, and graduate students from the PGI-8 Institute, PGI-9 Institute, and IEK-5 Institute of the Jülich Research Centre in Germany, as well as from the Shanghai Institute of Microsystem and Information Technology of the Chinese Academy of Sciences, attended the workshop.
The green rhombus gas nitrous oxide recovery method has been granted an invention patent.
Recently, “A Method for Recovering and Purifying Nitrous Oxide from Industrial Off-Gas,” developed by Lüling Gas, has been granted an invention patent by the National Intellectual Property Administration. This method achieves, for the first time internationally, large-scale recovery and purification of nitrous oxide from industrial off-gas. The technology boasts an internationally leading level, with safe, efficient, and reliable operational performance, stable and dependable product quality, and significantly reduced production costs. At the same time, this method provides a solution for industrial enterprises dealing with nitrous oxide emissions and offers an excellent example for promoting a circular economy by facilitating environmental protection and emission reduction.
On August 26, 2015, the first asset-securitization product issued by Zhongguancun Technology Leasing Co., Ltd. was oversubscribed at a comprehensive cost of 5.5% on the face value and was listed on the Shanghai Stock Exchange on October 28. On October 26, exactly two months after the issuance of the company’s first asset-securitization product, the company held its first experience-sharing conference on asset securitization at the Yulong International Hotel. The conference was chaired by Huang Wen, Deputy General Manager of the company. Attending the meeting were Sheng Zijin, Chairman of the Board; He Rongfeng, General Manager; Dou Jiyuan, Assistant to the General Manager; and mid-level managers from the company. Also in attendance were relevant leaders from the Zhongguancun Administrative Committee, Zhongguancun Development Group, and external partner organizations, as well as guests from Jia.
Jiangyin Runma Achieves Another Bountiful Success in the Recognition of High-Tech Products.
According to the Jiangyin City Productivity Promotion Center, since Jiangyin Runma Electronic Materials Co., Ltd. added a new high-tech product—the “ultra-clean, high-purity hydrogen peroxide”—in the first half of this year, the company has now added three more high-tech products following its self-application and expert review by the Provincial Department of Science and Technology. These new high-tech products are: “new ultra-clean, high-purity isopropyl alcohol,” “acidic ammonium fluoride etching solution,” and “highly selective titanium etching solution.” As a result, the company has achieved a remarkable success in obtaining high-tech product certifications. To date, the company now has 10 high-tech products that remain valid. All these products are manufactured using independently developed processes or formulations, with quality matching that of similar foreign products, thereby filling a domestic gap.
Suzhou Ruihong Electronic Chemicals Co., Ltd.
Suzhou Ruihong Electronic Chemicals Co., Ltd. (hereinafter referred to as “Suzhou Ruihong”) was established in 1993 and is a joint venture specializing in the production of electronic chemicals, including photoresists. The company has established a comprehensive quality assurance system and is equipped with advanced testing and analytical instruments, such as Nikon G7 and Nikon I12 exposure systems, ACT8 integrated coating and developing machines, CD-SEMs, and X-SEMs for photoresist performance testing, as well as ICP-MS, laser particle counters, and high-pressure liquid chromatographs for physicochemical analysis. The company’s product range includes ultraviolet positive and negative photoresists, along with related series of products for cleaning, developing, stripping, and etching.
ICPT 2015 Minutes: Latest Advances in CMP Technology
The 2015 ICPT Conference (International Conference on Planarization/CMPTechnology) was held from September 30 to October 2, 2015, in Phoenix, USA. This conference served as a premier international forum for exchanging ideas on chemical-mechanical polishing (CMP) and planarization technologies. Researchers and engineers from around the world gathered to discuss key issues in the planarization process, engage in extensive technical exchanges, and share valuable information. The conference featured two invited keynote presentations, one of which was delivered by representatives from GlobalFoundries Semiconductor Co., Ltd.
According to the latest report by market research firm IC Insights, the global pure-play foundry market is expected to grow by 6.1% in 2015, reaching sales of US$44.9 billion. The growth momentum for the overall pure-play foundry market is anticipated to come primarily from semiconductor components manufactured using advanced processes below 40 nanometers. IC Insights estimates that the pure-play foundry market for processes below 40 nanometers will grow by 24% in 2015, reaching a size of US$16.1 billion—compared to US$13 billion in 2014. As for the market for processes at or above 40 nanometers, the estimate for 2015 is...
Recently, the Lauterbur Biomedical Imaging and Advanced Materials Research Team at the Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, has achieved new progress in tunable phononic crystals. The related research (Phononic Crystal Tunable via Ferroelectric Phase Transition) was published in PHYSICAL REVIEW APPLIED 4, 034009 (2015). Phononic crystals—or acoustic metamaterials—
Recently, the Provincial Institute of Industrial Technology issued a document announcing the “Notice of the Jiangsu Provincial Institute of Industrial Technology Regarding Preparatory Research Institutes for 2015” (Su Yan Yuan [2015] No. 43). The “Semiconductor Packaging Technology Research Institute,” submitted by Huajin Semiconductor Packaging Leading-edge Technology R&D Center Co., Ltd., has officially been selected as a preparatory research institute for 2015. The institute is based on Huajin Semiconductor Packaging Leading-edge Technology R&D Center Co., Ltd. and is jointly established by the Institute of Microelectronics of the Chinese Academy of Sciences and the Management Committee of Wuxi New District. In response to the trends and characteristics of China’s advanced integrated circuit packaging industry, the institute will focus its efforts on key technologies related to advanced packaging and system integration.
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