The “Semiconductor Packaging Technology Research Institute” submitted by Hua Jin Semiconductor has officially been selected as a Preparatory Research Institute for 2015.

Recently, the Provincial Institute of Industrial Technology issued a document announcing the “Notice of the Jiangsu Provincial Institute of Industrial Technology Regarding Preparatory Research Institutes for 2015” (Su Yan Yuan [2015] No. 43). The “Semiconductor Packaging Technology Research Institute,” submitted by Huajin Semiconductor Packaging Leading-edge Technology R&D Center Co., Ltd., has officially been selected as a preparatory research institute for 2015. The institute is based on Huajin Semiconductor Packaging Leading-edge Technology R&D Center Co., Ltd. and is jointly established by the Institute of Microelectronics of the Chinese Academy of Sciences and the Management Committee of Wuxi New District. In response to the trends and characteristics of China’s advanced integrated circuit packaging industry, the institute will focus its efforts on key technologies related to advanced packaging and system integration.

The institute is based on HuaJin Semiconductor Packaging Leading Technology R&D Center Co., Ltd., and was jointly established by the Institute of Microelectronics of the Chinese Academy of Sciences and the Management Committee of Wuxi New District. In response to the trends and characteristics of China’s advanced integrated circuit packaging industry, the institute will focus its R&D efforts on key technologies related to advanced packaging and system integration, breaking through bottlenecks in industrialization. It will collaborate with domestic equipment manufacturers, material suppliers, design firms, and manufacturing enterprises to achieve low-cost commercialization of these technologies and their application in end products. While providing foundational and common technology R&D for the packaging and testing industry, the institute will also conduct research into next-generation technologies, offering sustainable technological support to China’s industrial sector, continuously driving upgrades throughout the industrial chain, and reinforcing Jiangsu’s leading position in the integrated circuit packaging and testing industry.

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