The Special Symposium on Talent Development and Innovative Development of the Integrated Circuit Industry Chain was successfully held in Shanghai.

On November 12, the “Special Symposium on Talent Development and Innovative Development of the Integrated Circuit Industry Chain,” hosted by the National Major Project Group for Program 02 and the China Semiconductor Industry Association, and organized by the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance (referred to as the “Materials Alliance”), was successfully held in Shanghai. The conference featured in-depth discussions centered around “strengthening industry-academia-research cooperation, accelerating the cultivation of mid-level and backbone talents, and boosting innovative development of the industry.” The meeting was chaired by Shi Ying, Secretary-General of the Materials Alliance. Attendees included Ye Tianchun, Chief Engineer of the National Program 02; Xu Xiaotian, Executive Vice Chairman of the China Semiconductor Industry Association; Hou Yongfeng, Director of the Science and Technology Division of the Department of Higher Education at the Ministry of Education; and Zhejiang...

　　On November 12, the “Special Symposium on Talent Development and Innovative Development of the Integrated Circuit Industry Chain,” hosted by the National Major Project Group for Program 02 and the China Semiconductor Industry Association, and organized by the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance (referred to as the “Materials Alliance”), was successfully held in Shanghai. The symposium featured in-depth discussions centered around “strengthening industry-academia-research cooperation, accelerating the cultivation of mid-level and backbone talents, and boosting innovative development of the industry.” The meeting was chaired by Shi Ying, Secretary-General of the Materials Alliance. Attendees and speakers included Ye Tianchun, Chief Engineer of the National Program 02; Xu Xiaotian, Executive Vice Chairman of the China Semiconductor Industry Association; Hou Yongfeng, Director of the Science and Technology Division of the Department of Higher Education at the Ministry of Education; and Yan Xiaolang, Honorary Dean of the School of Microelectronics at Zhejiang University. More than 110 experts from the integrated circuit industry’s academic, industrial, and research sectors participated in the symposium.

　　In his speech, Director Ye Tianchun stated: In recent years, with the introduction of the “Outline” and the accompanying surge in industrial investment, China’s integrated circuit industry has grown exponentially, creating a favorable trend of “three-chain integration”—the convergence of industrial chains, innovation chains, and capital chains. However, as an industry that relies heavily on manufacturing, talent demand has become a critical limiting factor. At the same time, we should also recognize that the Chinese mainland produces a large number of graduates each year, giving it an inherent advantage in building an engineering workforce. Moreover, in recent years, the state has vigorously promoted the establishment of talent cultivation bases and the development of exemplary microelectronics colleges. Therefore, to rapidly cultivate comprehensive talents for China’s integrated circuit industry in the next stage, we need the collective wisdom and concerted efforts of experts from across the entire industry chain.

　　Director Hou Yongfeng’s view—that talent is the cornerstone of university-industry cooperation with companies such as Intel and ARM—received unanimous approval from the attendees. At the same time, he proposed five “synergistic” goals for future university-industry collaboration: synergistic alignment of training objectives, thereby narrowing the gap between university and industry training; synergistic coordination of the training process, ensuring seamless integration between theoretical learning at universities and practical experience in enterprises; synergistic team building, fostering a combination of specialized expertise and cutting-edge skills within university faculty, and facilitating smoother mobility between enterprise engineers, managers, and university teachers; synergistic resource integration, harmonizing the educational resources available at universities with the practical resources offered by enterprises; and synergistic management, aligning the management systems and operational mechanisms governing university-industry partnerships. Dean Yan Xiaolang briefed the attending guests on the current state of talent development in China’s integrated circuit industry, the nation’s preliminary integrated circuit talent cultivation system, and the goals and strategies for future integrated circuit talent development.

　　During the interactive exchange, representatives from 10 universities—including Peking University’s School of Microelectronics—each introduced their respective schools’ distinctive features and ideas for university-enterprise cooperation. Representatives from companies along the industrial chain also delivered speeches one after another, expressing their hope that future university-enterprise collaborations will achieve substantial progress in areas such as discipline development, mutual exchanges, and project partnerships.

　　In his concluding remarks at the meeting, Vice Chairman Xu Xiaotian pointed out that both schools and enterprises need to establish corresponding mechanisms to build and improve education and talent-development systems. Moreover, in industrial development, industries and enterprises should play a leading role. He expressed hope that in the future, university-enterprise cooperation could leverage the Ministry of Education’s platform for discipline development and promotion, as well as the China Semiconductor Industry Association’s role as a bridge and link between the industry and the government, to rapidly cultivate comprehensive talents for China’s integrated circuit industry and thereby further boost the development of China’s integrated circuit sector.

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