NCAP and YOLE jointly organized a seminar on advanced packaging and system integration technologies.

From April 21 to 22, 2016, NCAPCHINA (Nanjing Advanced Packaging R&D Center Co., Ltd.) and Yole Development, a renowned French market research firm, successfully co-hosted a two-day seminar on advanced packaging and system integration technologies at the Kailai Hotel in Wuxi. The seminar featured keynote speakers from globally recognized companies, including ASE Group, ASM Pacific Technology, Besi, BroadPak, EV Group, JCAP, and HuaTian Technology.

2016 Year 4 Moon 21 day -22 Day, Hua Jin Semiconductor Packaging Leading Technology R&D Center Co., Ltd. ( NCAP CHINA ) and a renowned French market research company Yole Development The two-day seminar on advanced packaging and system integration technologies was successfully held at the Kailai Grand Hotel in Wuxi. The invited speakers at the conference came from globally renowned companies, including: ASE Group, ASM Pacific Technology, Besi, BroadPak, EV Group ， JCAP, HuaTian Technology, Plasma-Therm, SPTS/Orbotech, STATS ChipPAC ， Zeta Instruments And so on. The seminar features a wide range of engaging content, and the discussion topics include: 2.5D TSV Adapter board &3D Integration, sensors &MEMS and the application of advanced packaging equipment and materials, among other topics. At the same time, the conference has also invited... BroadPak 、 Zeta Instruments 、 SPTS Hua Tian Technology, NCAP Experts from five companies engaged in a free-ranging discussion on hot R&D topics in the field of advanced packaging. The main areas of discussion were: 2.5D TSV Technology, Substrate Technology, Fan-out Technology, etc.

　　At the seminar, the session will begin with... Iron The company's vice president Ruurd Boomsma He summarized and looked ahead to the development of China’s semiconductor industry, pointing out that China’s semiconductor sector has made rapid strides in recent years and is expected to— 2020 Year 16/14nm The annual growth rate of mass-produced technology products will reach... 20% ; to 2030 In the coming years, China will see the emergence of semiconductor companies at a world-class level. Subsequently, Yole Development Senior Market Analyst Santosh Kumar To 3D TSV & 2.5D The technology was explained, and he pointed out that... TSV Technology successfully applied to MEMS and CIS Afterward, the future Memory will become a widely adopted product for the next generation. Following that, the speakers at the conference delivered inspiring presentations. BroadPak The company's CEO Farhang Yazdani The view holds that, for 2.5D and 3D The biggest obstacles to technology adoption are cost and reliability issues; it was also mentioned that, Fan-out Technology will become the mainstream in future markets. Dr. Yu Dazhuan, Vice President of Huatian Technology, stated: 3D WLP Advanced packaging technologies are crucial for applications in the fields of mobile communications and the Internet of Things. To meet the demands for low cost and high performance, new packaging technologies urgently need to be developed and implemented. STATS ChipPAC The company's YOON Doctor to Fan-out The technology was subjected to a comprehensive analysis. Fan-out Technology will be the next... Wire bond Technology and Flip Chip The mainstream advanced packaging technologies following the current ones will see their development trends driven by... 200mm Wafer Turnaround 300mm The wafer, and then proceed to transfer to the large-panel level. Finally, NCAP Dr. Zhang Wenqi, Technical Director, provided a detailed introduction to Hua Jin Company’s R&D platform, showcasing Hua Jin Company. 2.5D Technology and its applications in multiple products. Equipment companies such as... Suss ， EVG Others also shared the latest technologies and equipment in the field of advanced packaging at the conference. After the conference concluded, Hua Jin Company arranged for the attendees to visit and engage in technical exchanges at the company’s facilities.

　　 The organization of this seminar has enhanced the international visibility of HuaJin’s R&D technologies, helping to establish HuaJin’s own brand and influence. At the same time, it has provided valuable insights into the latest R&D trends and directions in the global packaging industry, charting a clear path for HuaJin’s future development. Furthermore, through the exchanges facilitated by this conference, we have jointly promoted the advancement of advanced packaging equipment, manufacturing, and materials both domestically and internationally, maximizing collaboration with globally renowned manufacturers to accelerate R&D and industrialization efforts. In summary, the successful holding of this conference has laid a solid foundation for HuaJin’s journey toward becoming a world-class enterprise.

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