The national key science and technology project "300-mm Silicon Wafers for 40-28 nm Integrated Circuit Manufacturing" has been launched in Shanghai.

On July 28, the launch ceremony for the “300-mm Silicon Wafers for 40- to 28-nanometer Integrated Circuit Manufacturing” project under the National Key Science and Technology Major Project on Advanced Manufacturing Equipment and Complete Process Technologies for Ultra-Large-Scale Integrated Circuits (commonly referred to as “Project 02”) was held in the Lingang Development Zone of Pudong, Shanghai. Attending the event were Cao Jianlin, Deputy Minister of the Ministry of Science and Technology and Head of the Leading Group for Project 02; Zhou Bo, First Administrative Officer of Project 02 and Vice Mayor of Shanghai; Ma Junru, Director of the Advisory Committee for Project 02; and Academician Wang Xi, Deputy Head of the Overall Team for Project 02 and Chairman of the Materials Alliance. The integrated circuit industry is the core of the information technology industry. Since the implementation of “Project 02,” China has...

7 Moon 28 Day, the National Key Science and Technology Major Project for Manufacturing Equipment and Complete Process Technologies for Ultra-Large-Scale Integrated Circuits (abbreviated as 02 Specialized ” ) 40-28 For nanoscale integrated circuit manufacturing 300 Millimeter silicon wafer ” The project launch ceremony was held in the Lingang Development Zone in Pudong, Shanghai. The Vice Minister of the Ministry of Science and Technology of China, 02 Chairman of the Special Leading Group, Cao Jianlin, 02 The person specifically responsible for administrative affairs, Shanghai Vice Mayor Zhou Bo, 02 Director Ma Junru of the Special Advisory Committee, 02 Academician Wang Xi, Deputy Head of the Special Overall Group and Chairman of the Materials Alliance, attended the event.

The integrated circuit industry is the core of the information technology industry. 02 Since the launch of the “Special Initiative,” China’s integrated circuit industry has seen a rapid improvement in both its technological level and capabilities. However, as the largest and most critical material in integrated circuit manufacturing, 300 Millimeter-scale silicon wafers have long relied on imports, severely restricting the competitiveness of China’s integrated circuit industry and the security of its supply chain. Overcome this challenge. 300 Millimeter-scale silicon wafer mass production technology, enabling independent supply, is “ 02 One of the key tasks under the special initiative.

The project undertaking entity, Xinsheng Semiconductor Technology Co., Ltd., was jointly initiated by listed companies such as Shanghai Xinyang and Xingsen Technology, as well as a core technical team led by Shanghai Xin'ao and Dr. Zhang Rujing. The company... 300 Total investment in the millimeter-wave silicon wafer project 68 100 million yuan, including the investment for Phase I 23 100 million yuan, estimated 2017 Complete by the end of the year 40-28 Nano 300 Tackling key technologies for mass production of millimeter-scale silicon wafers, achieving... 15 Ten thousand pieces / By building monthly production capacity, we will achieve independent, large-scale production of high-end silicon wafers for China’s integrated circuit industry, laying a solid foundation for the vigorous development of China’s integrated circuit sector. This will enable China to essentially establish a complete semiconductor industrial chain, thereby promoting China’s participation in and competitiveness within the global mainstream semiconductor market.

Xin Sheng Company on 2014 Year 6 Established in [month], with the goal of... 2023 Achieve monthly production before the new year. 60 Production capacity of 100,000 silicon wafers. As of now, Xin Sheng Company has completed the preparatory work for project approval and obtained the construction permit, and is expected to... 2016 Equipment installation, commissioning, and trial production will be completed this year, and the products will enter user validation. 2017 Mass production and sales are expected to be achieved this year. It is worth noting that the core technical team of Xinsheng Company comprises experts from Japan, the United States, South Korea, Europe, and various regions across China—each of whom is a top-tier technical talent in the semiconductor silicon wafer industry with many years of experience. 300 Practical experience in the R&D and production of millimeter-scale silicon wafers. To ensure... 300 Millimeter-scale semiconductor silicon wafer manufacturing technology has been successfully implemented in China. Members of the core technical team will be responsible for product R&D and production, quality control, and marketing and sales, respectively. They will ensure that the company’s products meet international market requirements in terms of technology, quality, cost, and other key indicators. Additionally, they will provide training and develop domestic professional technical personnel, thereby guaranteeing an adequate pool of skilled workers to support the localization of large-diameter silicon wafers.

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