Shenzhen Danbang Technology Co., Ltd.

Shenzhen Danbang Technology Co., Ltd. (stock code: 002618) was established in 2001 with a registered capital of 182.64 million yuan. It is a national high-tech enterprise specializing in the R&D and production of flexible circuits and materials, as well as an industrialization base for achievements from the National High-Tech Research and Development Program. The company boasts a state-level R&D center for flexible circuits and materials, and is China's largest manufacturer and supplier of flexible circuits and materials, providing comprehensive services for 3D chip packaging interconnection solutions using flexible circuits.

Danbang Science and Technology Park is located in the northern area of Shenzhen High-Tech Industrial Park. With a total investment of 260 million yuan, the park boasts a total construction area of 30,000 square meters and employs 992 people. Its annual total output value exceeds 400 million yuan, and over 95% of its products are exported. The company’s main products include flexible FCCL, high-density FPCs, COF substrate for chip packaging, chip and component packaging products, as well as thermosetting adhesives and micro-adhesive films related to flexible packaging. These products are primarily used in high-precision, cutting-edge smart terminal devices with limited space and foldable designs. They find extensive applications across all microelectronics fields, including consumer electronics, medical devices, specialized computers, intelligent displays, and high-end equipment industries. The company’s key customers include internationally renowned enterprises such as Sony, Hitachi, Sanyo, Panasonic, Sharp, Canon, JVC, Denso, Seiko, U.S. MOLEX, French Thomson, and South Korean Samsung.

Danbang Technology boasts a modern, dust-free Class 1,000 cleanroom facility and is equipped with specialized production and testing equipment imported from Europe, the U.S., and Japan. The company operates a complete industrial chain—from the production of flexible circuit materials (FCCL) to the advanced processing of flexible printed circuits (FPC), from COF manufacturing to ACAF bonding and final assembly. Danbang Technology has assembled a team of pioneers in China who have been engaged in research and application of material technologies, circuit fabrication techniques, and packaging technologies. Currently, the company has 123 R&D personnel, including 42 with senior professional titles and 9 overseas experts. Its quality management team is led by Japanese management specialists. Danbang Technology holds more than 40 invention patents, filling several domestic technology gaps and achieving numerous world-class breakthroughs in key materials for flexible circuits. The company is a leader in China—and ranks among the top globally—in both flexible circuit manufacturing technology and new material development.

Danbang Technology has successively undertaken and completed numerous major research projects under national science and technology programs as well as key攻关 projects. Several of its innovative research products have received national and municipal-level scientific research awards, including: a flexible polyimide adhesive-free substrate (Guangdong Province High-Tech Product of 2006); polyimide flexible circuit board rolls (Outstanding Scientific and Technological Achievement under the National Key Science and Technology Project, National Key New Product, and Guangdong Province Key New Product); ultra-fine COF wiring and chip packaging products (Shenzhen Science and Technology Innovation Award and Guangdong Province Science and Technology Award); COF packaging substrates (National Key New Product of 2010); multi-layer flexible substrates and multi-chip stacking packaging products (Guangdong Province Independent Innovation Product); UV-curable peelable pressure-sensitive adhesive film (First Prize of the 5th National Science and Technology Progress Award and Second Prize of the 5th National Patent Invention Award); embedded capacitor and resistor substrates (National Key New Product of 2013), and many others.

In the future, Danbang Technology will continue to adapt to evolving trends of the times. Grounded in the promising market prospects of high-end FPCs, COF flexible packaging substrates, and COF products, we will remain committed to technological leadership, stepping up R&D investments in areas such as materials and high-density flexible packaging substrates. At the same time, we will extend our reach upstream along the industrial chain, further broadening our market scope and maintaining a competitive edge in both technology and cost. We are determined to establish ourselves as a national brand in the high-end flexible circuit board, COF flexible substrate, and chip packaging industries—a world-class base for the production and R&D of COF packaging substrates. We strive to build our company into a domestically leading, internationally first-class, innovation-driven enterprise whose core value lies in technological innovation, spanning both the high-end flexible circuit board and chip flexible packaging sectors. We aim to serve both domestic and international markets with high-quality products, protect the environment, care about people’s livelihoods, and contribute to society—continuously expanding our positive impact on the community!