CMP Industry Technology Development Trends

In recent years, as... CMP The rapid advancement of industrial technology, Advanced CMP The future application prospects and existing challenges of technology are hot topics that have attracted considerable attention. Currently, CMP Focus on the following aspects: 10nm Below the node CMP Technology and market, CMP New abrasive particles, TSV in the CMP Wafer thinning, advanced films used in front-end and back-end processes, advanced cleaning and surface preparation technologies, TSV Chemicals and materials used in the application, and so forth. CMP We must break through technological bottlenecks in order to achieve sustained development and application in advanced technologies. This article will combine... Linx Consulting Company Mike Corbett In CMPUG Semicon West 2015 the report, covering defect detection technologies, the development of logic devices and memory, and CMP Let's start by introducing the current market situation.

For CMP For instance, the continuous improvement of defect detection methods is increasingly influencing its development. For example: SP3，SP5 With the aid of advanced optical inspection techniques, the range of detectable defects in these systems can be significantly expanded. In the foreseeable future, these cutting-edge optical inspection methods will be able to detect: 10-15nm particles, and enable the gripping of micro-sized particles, thereby reducing, to a certain extent, defects such as scratches that these particles might otherwise cause on surfaces. However, in the future, new materials will undoubtedly be introduced, giving rise to new... CMP processes, which generally introduce some new pollutants and particulates. These new changes include: advanced Dynamic Random Access Memory Structure, STT-MRAM — A possible alternative Dynamic Random Access Memory the structure, VNAND — A challenge to high aspect ratios and deep structures. In a landscape where new technologies and materials are constantly emerging, even as existing inspection techniques continue to evolve and improve defect-detection capabilities, the industry increasingly needs to use purer chemicals and raise dilution ratios to reduce contamination from metal ions and microparticles. By addressing contamination at its source, we can further minimize particle size and significantly decrease the occurrence of defects.

Trend in the growth of logic devices: RMG and FEOL finFET Its emergence has enabled the fabrication of advanced devices. CMP The number of steps has been increased to 7 Step, including the logic devices CMP The objects include: STI, Poly, ILD, POP, MG, SAC, W ， There are also high-mobility channels, and so on.

Trend of memory growth: Ru Electrodes can be used to make Dynamic Random Access Memory ， Dynamic Random Access Memory The size will continue to decrease under current technology. 5 Expected to pass after the Chinese New Year. TSV Technology continues to contribute to reductions. Dynamic Random Access Memory the size; 2D and 3D NAND Will continue to develop, 2D The structure requires higher flatness, whereas... 3D The structure will be increased. W Polishing steps for oxides; MRAM Provide non-volatile storage , High read and write speeds , Reduce energy loss and enhance endurance.

CMP Market Status: CMP Consumables account for a significant portion of spending in semiconductor manufacturing, especially polishing liquids and polishing pads. Wafer fabs face the following challenges: In material costs, 20% For 200 Millimeter wafers and 10% For 300 Millimeter wafer ; Cyclical characteristics of specialty products; Specialty materials are constrained by small production scales.

Based on the introduction above, we can conclude that: CMP The industry expects growth to remain robust in the coming years, among which... CMP Consumables are becoming a significant expenditure item for wafer foundries. As for... 22nm and 14nm Nevertheless, it remains essential to ensure the quality of both the polishing slurry and the polishing pad in order to control defects. Currently, advanced optical inspection techniques are employed to detect and control defects. However, with the emergence of new technologies and materials that introduce contaminant particles, even in state-of-the-art polishing slurries, the morphology of abrasive particles still needs to be strictly controlled. Specifically, abrasive particles must not agglomerate, must be free of sharp edges, and their content must gradually decrease—indeed, in some polishing slurry formulations, the abrasive particle content has already been reduced to... 0.5% Even lower, the trend is to rely more on chemical etching for removal and reduce mechanical grinding. The requirements for selecting polishing liquids are becoming increasingly stringent, and polishing pads are emerging as a critical factor in controlling the entire process. Among these, defect control remains paramount, including the reduction of scratches. dishing/erosion Moreover, the substantial growth potential of logic devices and memory in the future is also driving... CMP Technology continues to evolve and advance.