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Hotspot Focus

Jiangfeng Electronics Joins Hands with American CeramTec to Usher in a New Chapter for China’s CMP Polishing Pad Industry.

2016.11.10

The “Asia Materials Conference 2016” Advanced Microelectronics and Optoelectronics Subsession was successfully held.

2016.11.03

The Materials and Components Alliance successfully held the training course “Integrated Circuit Chip Manufacturing Processes and Integration Technologies” in Qingdao.

2016.11.03

2016国际平坦化技术大会(ICPT 2016)在中国大陆首次成功举办

2016.10.30

The seminar on the application of domestically produced materials in wafer-level packaging was successfully held at Huatian Technology’s Kunshan facility.

2016.10.12

1nm Transistor Is Born—Moore’s Law Will Remain Valid for the Long Term

2016.10.09

The Materials and Components Alliance and SMIC held their second supply-and-demand matchmaking event successfully in Beijing.

2016.09.23

Guiding Opinions of the Ministry of Science and Technology, the General Administration of Quality Supervision, Inspection and Quarantine, and the National Standardization Administration on Strengthening the Development of Technical Standards in the Implementation of Special Projects under National Science and Technology Programs

2016.09.21

The alliance organization held the first meeting of the Working Group on the Technology and Industrial Development Roadmap for Key Components.

2016.09.08

Dow Launches OPTIPLANE Advanced Chemical-Mechanical Polishing (CMP) Platform for Semiconductor Manufacturing

2016.08.18

Employing a gap-inhibition-type tungsten-filled contact region process to reduce yield loss.

2016.08.18

Introduction to the Global Photoresist Patent Analysis Report (Part 4)

2016.08.18

Introduction to the Global Photoresist Patent Analysis Report (Part 3)

2016.08.18

China Achieves Major Breakthrough in Semiconductor Manufacturing Technology: SMIC Chongqing Begins Mass Production of 14nm Mid-Process Silicon Wafers

2016.08.01

Yangtze Memory Technologies Co., Ltd. has been officially established.

2016.08.01

Introduction to the Global Photoresist Patent Analysis Report (Part 1)

2016.08.01

Introduction to the Global Photoresist Patent Analysis Report (Part 2)

2016.08.01

The Materials Alliance Expands Its Component Business; The Alliance Renames Itself the "Strategic Alliance for Technological Innovation in Integrated Circuit Materials and Components Industry."

2016.07.22

Dinglong Shares’ CMP project is about to begin pilot production.

2016.07.21

South Korea’s efforts to increase the share of domestically produced equipment for semiconductors and panels are beginning to yield results.

2016.07.21

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